The present invention relates to a grinding apparatus for grinding a workpiece such as a semiconductor wafer held on a chuck table, the grinding apparatus being capable of adjusting the tilt of a table rotational axis of the chuck table.
Device chips including such devices as integrated circuits (ICs) and large-scale-integration (LSI) circuits are fabricated from wafers in the shape of circular plates. Specifically, a plurality of devices are built on the face side of a wafer, and then the reverse side of the wafer is ground to thin down the wafer. Thereafter, the wafer is divided into individual device chips incorporating the respective devices. Such workpieces as wafers are ground on a grinding apparatus (see Japanese Patent Laid-open No. 2009-141176). The grinding apparatus has a chuck table for holding a workpiece thereon and a grinding unit for grinding the workpiece held on the chuck table. The grinding unit includes a grinding wheel having an annular array of grindstones that are fixed thereto and that lie in a plane substantially parallel to the holding surface of the chuck table that holds the workpiece thereon.
The grinding apparatus can rotate the chuck table about a table rotational axis extending centrally through the holding surface and rotate the grinding wheel to turn the grindstones along an annular track. When the grinding unit is lowered to bring the grindstones into contact with the workpiece on the chuck table while the chuck table and the grinding wheel are rotating, the grindstones grind the workpiece. The holding surface of the chuck table is a gradually inclined conical surface. The tilt of the table rotational axis is determined to make one of the generators of the holding surface that is closest to a plane of rotation that includes the annular track, parallel to the plane of rotation. The tilt of the table rotational axis is preadjusted to cause the surface of the workpiece that has been ground by the grindstones to have a uniformly height. Heretofore, it has been customary to grind a wafer with the grindstones in a test, then measure a thickness distribution of the workpiece, and adjust the tilt of the table rotational axis in reference to the measured thickness distribution. However, the wafer that has been ground in the test before the tilt of the table rotational axis is adjusted tends to be irregular in thickness, and is thrown away for being a material unsuitable for fabricating device chips.
There has been proposed a method of temporarily stopping grinding a workpiece, retracting the grinding wheel away from the workpiece, measuring the thicknesses of various portions of the workpiece with a thickness measuring device, adjusting the tilt of the table rotational axis in reference to the measured thicknesses, and then resuming the grinding process (see Japanese Patent Laid-open No. 2013-119123). However, though the proposed method is effective to eliminate wasted workpieces, it is likely to lower the processing efficiency because the grinding process is temporarily suspended. According to another proposed method (Japanese Patent Laid-open No. 2016-184604), the thicknesses of various portions of a workpiece are monitored with a thickness measuring device while a measuring unit, i.e., a sensor, of the thickness measuring device is being moved over the workpiece when the workpiece is ground. However, since grindstones grind the workpiece at all times in a central portion of the workpiece, the measuring unit cannot gain access to the central portion of the workpiece, and hence the thickness measuring device is unable to measure the thickness of the central portion of the workpiece.
According to one solution, a plurality of data maps representing typical examples of the cross-sectional shapes of workpieces are stored in a control unit, and, with use of the stored data map, the thickness of a central portion of a workpiece can be predicted according to the cross-sectional shape of a portion of the workpiece other than the central portion thereof. Specifically, the cross-sectional shape of a portion of the workpiece other than the central portion thereof is checked against the data maps stored in the control unit, and one of the data maps that is closest to the cross-sectional shape is selected. Then, the tilt of the table rotational axis is adjusted according to the selected data map. This method does not require that the grinding process for the workpiece be temporarily suspended.
However, inasmuch as the grinding process is continuously in progress while the measuring unit of the thickness measuring device is being moved over the surface being ground of the workpiece to measure the thicknesses of various portions of the workpiece, the thicknesses of those portions are measured at different times. In other words, the proposed method is unable to obtain an accurate thickness distribution over the entire surface of the workpiece at a certain point of time. Since the data maps of the cross-sectional shapes of workpieces do not assume that the grinding process is in progress, the thickness distribution of a workpiece that is measured by the thickness measuring device cannot be checked against the data maps to a nicety.
It is therefore an object of the present invention to provide a grinding apparatus that is capable of measuring a thickness distribution of a workpiece being ground and adjusting the relative tilt of the table rotational axis of a chuck table with respect to a spindle highly accurately, in reference to the measured thickness distribution.
In accordance with an aspect of the present invention, there is provided a grinding apparatus including a chuck table that has a conical holding surface for holding a workpiece thereon and that is rotatable about a table rotational axis extending centrally through the holding surface, a grinding unit including a grinding wheel having a plurality of grindstones arranged in an annular array on a surface facing the holding surface of the chuck table, a spindle having a lower end on which the grinding wheel is mounted, and a lifting and lowering mechanism for lifting and lowering the spindle, the grinding unit being capable of grinding the workpiece held on the holding surface of the chuck table while the chuck table is rotating about the table rotational axis, in an area of the workpiece extending from a center of the workpiece to an outer circumferential edge thereof, a tilt adjustment unit for adjusting a relative tilt of the table rotational axis and the spindle, a thickness measuring device for measuring a thickness of the workpiece held on the chuck table, and a control unit. In the grinding apparatus, the thickness measuring device includes a measuring unit for measuring a thickness of the workpiece while facing a portion of an upper surface of the workpiece to be ground by the grinding unit, and a measuring unit moving mechanism for moving the measuring unit back and forth on a measuring track between a position above the outer circumferential edge of the workpiece held on the chuck table and a position above the workpiece out of physical interference with the grinding unit, and the control unit includes a grinding controlling section for rotating the chuck table holding the workpiece thereon about the table rotational axis and controlling the lifting and lowering mechanism to lower the spindle while rotating the grinding wheel of the grinding unit about an axis of the spindle, to bring the grindstones into abrasive contact with the upper surface of the workpiece and thereby grind the workpiece, a cross-sectional shape calculating section for controlling the measuring unit to measure thicknesses of the workpiece at various points thereon while controlling the measuring unit moving mechanism to move the measuring unit back and forth on the measuring track, calculating average thickness values representing average values of measured thickness values acquired when the measuring unit measures the thickness of the workpiece in forward strokes on the measuring track and measured thickness values acquired when the measuring unit measures the thickness of the workpiece in return strokes on the measuring track, and calculating a cross-sectional shape of the workpiece from the average thickness values at the various points, and a tilt adjustment variable calculating section for calculating an adjustment variable for the relative tilt of the table rotational axis and the spindle to be adjusted by the tilt adjustment unit in order to bring the workpiece ground by the grindstones close to a finished shape, according to the cross-sectional shape of the workpiece.
Preferably, the control unit further includes a cross-sectional shape interpolating section for calculating a cross-sectional shape of a central portion of the workpiece according to the least-squares method from the cross-sectional shape of the workpiece calculated by the cross-sectional shape calculating section and interpolating the cross-sectional shape of the workpiece according to the calculated cross-sectional shape of the central portion of the workpiece, and the tilt adjustment variable calculating section calculates an adjustment variable for the relative tilt of the table rotational axis and the spindle according to the cross-sectional shape of the workpiece interpolated by the cross-sectional shape interpolating section.
In accordance with another aspect of the present invention, there is provided a grinding apparatus including a chuck table that has a conical holding surface for holding a workpiece thereon and that is rotatable about a table rotational axis extending centrally through the holding surface, a grinding unit including a grinding wheel having a plurality of grindstones arranged in an annular array on a surface facing the holding surface of the chuck table, a spindle having a lower end on which the grinding wheel is mounted, and a lifting and lowering mechanism for lifting and lowering the spindle, the grinding unit being capable of grinding the workpiece held on the holding surface of the chuck table while the chuck table is rotating about the table rotational axis, in an area of the workpiece extending from a center of the workpiece to an outer circumferential edge thereof, a tilt adjustment unit for adjusting a relative tilt of the table rotational axis and the spindle, a thickness measuring device for measuring a thickness of the workpiece held on the chuck table, and a control unit. The thickness measuring device includes a measuring unit for measuring a thickness of the workpiece while facing a portion of an upper surface of the workpiece to be ground by the grinding unit, and a measuring unit moving mechanism for moving the measuring unit back and forth on a measuring track between a position above the outer circumferential edge of the workpiece held on the chuck table and a position above the workpiece out of physical interference with the grinding unit, and the control unit includes a grinding controlling section for rotating the chuck table holding the workpiece thereon about the table rotational axis and controlling the lifting and lowering mechanism to lower the spindle while rotating the grinding wheel of the grinding unit about an axis of the spindle, to bring the grindstones into abrasive contact with the upper surface of the workpiece and thereby grind the workpiece, a cross-sectional shape calculating section for controlling the measuring unit to measure thicknesses of the workpiece at various points thereon while controlling the measuring unit moving mechanism to move the measuring unit back and forth on the measuring track, and calculating a cross-sectional shape of a portion of the workpiece other than a central portion thereof from measured thickness values, a tilt adjustment variable calculating section for calculating an adjustment variable for the relative tilt of the table rotational axis and the spindle to be adjusted by the tilt adjustment unit in order to bring the workpiece ground by the grindstones close to a finished shape according to the cross-sectional shape of the workpiece, and a cross-sectional shape interpolating section for calculating a cross-sectional shape of the central portion of the workpiece according to the least-squares method from the cross-sectional shape of the portion of the workpiece other than the central portion thereof calculated by the cross-sectional shape calculating section and interpolating the cross-sectional shape of the workpiece according to the calculated cross-sectional shape of the central portion of the workpiece, and the tilt adjustment variable calculating section calculates an adjustment variable for the relative tilt of the table rotational axis and the spindle according to the cross-sectional shape of the workpiece interpolated by the cross-sectional shape interpolating section.
Preferably, the measuring unit is a non-contact-type sensor for measuring the thickness of the workpiece while staying out of physical contact with the workpiece.
Preferably, the measuring unit includes a plurality of sensors for measuring the thickness of the workpiece.
In the grinding apparatus according to the aspects of the present invention, while the grindstones are grinding the workpiece, the measuring unit of the thickness measuring device measures thicknesses of the workpiece at various points thereon while moving back and forth on the measuring track. When the measuring unit reaches an end of the measuring track, the thicknesses of the workpiece at the various points thereon are calculated, obtaining a thickness distribution of the workpiece, i.e., a cross-sectional shape thereof, at the time. The thicknesses of the workpiece at the various points thereon can thereby be calculated to a nicety without being affected by the differences between the measuring times upon movement of the measuring unit, making it possible to adjust the relative tilt of the table rotational axis and the spindle highly accurately.
According to the present invention, there is thus provided a grinding apparatus that is capable of measuring a thickness distribution of a workpiece being ground and adjusting the relative tilt of the table rotational axis with respect to the spindle highly accurately, according to the measured thickness distribution.
The above and other objects, features and advantages of the present invention and the manner of realizing them will become more apparent, and the invention itself will best be understood from a study of the following description and appended claims with reference to the attached drawings showing a preferred embodiment of the present invention.
A grinding apparatus according to a preferred embodiment of the present invention will be described hereinbelow with reference to the accompanying drawings. The grinding apparatus according to the present embodiment grinds a workpiece to thin it down.
The grinding apparatus 2 according to the present embodiment will be described in detail below with reference to
A loading arm 34 and an unloading arm 36 are disposed on an upper surface of the base 4 at respective positions adjacent to the positioning table 32. The workpiece 1 that has been positioned at the predetermined position on the positioning table 32 is delivered from the positioning table 32 by the loading arm 34. A turntable 6 shaped as a circular plate is rotatably mounted centrally on the upper surface of the base 4. The turntable 6 supports on its upper surface three chuck tables 8 that are angularly spaced circumferentially at 120° intervals. When the turntable 6 is turned about its central axis, the chuck tables 8 are angularly moved therewith while holding respective workpieces 1 delivered by the loading arm 34.
A rotary actuator 56 such as an electric motor is coupled to a bottom portion 54 of the chuck table 8 for rotating the chuck table 8 about a table rotational axis 58 extending centrally through the holding surface 8a. The bottom portion 54 of the chuck table 8 is supported on a plurality of support shafts in such a manner that the bottom portion 54 of the chuck table 8 will not be prevented from rotating by the support shafts. Specifically, the support shafts include one fixed shaft 60 and two extensible and contractible adjustment shafts 62 and 64. The tilt of the holding surface 8a, i.e., the tilt of the table rotational axis 58, can be adjusted by adjusting the lengths of the adjustment shafts 62 and 64. In other words, the adjustment shafts 62 and 64 jointly function as a tilt adjustment unit for adjusting the tilt of the table rotational axis 58.
The grinding apparatus 2 will further be described below with reference to
A first grinding unit 10a for rough-grinding the reverse side 1b of the workpiece 1 held on the chuck table 8 in the rough-grinding region is disposed outside of the turntable 6 on a rear upper surface of the base 4. The workpiece 1 held on the chuck table 8 in the rough-grinding region is rough-ground by the first grinding unit 10a. After the workpiece 1 has been rough-ground by the first grinding unit 10a, the turntable 6 is turned to move the chuck table 8 to a finish-grinding region over the turntable 6 adjacent to the rough-grinding region. A second grinding unit 10b for finish-grinding the reverse side 1b of the workpiece 1 held on the chuck table 8 in the finish-grinding region is disposed adjacent to the first grinding unit 10a outside of the turntable 6 on a rear upper surface of the base 4. The workpiece 1 held on the chuck table 8 in the finish-grinding region is finish-ground by the second grinding unit 10b. After the workpiece 1 has been finish-ground by the second grinding unit 10b, the turntable 6 is turned to move the chuck table 8 back to the wafer loading/unloading region where the workpiece 1 is unloaded from the chuck table 8 by the unloading arm 36.
A spinner cleaning device 38 for cleaning and spin-drying the ground workpiece 1 is disposed near the unloading arm 36 on the upper surface of the base 4 and the wafer delivery robot 30 on the base 4. The ground workpiece 1 that has been unloaded from the chuck table 8 by the unloading arm 36 is delivered to the spinner cleaning device 38, and cleaned and spin-dried by the spinner cleaning device 38. After the workpiece 1 has been cleaned and spin-dried by the spinner cleaning device 38, the workpiece 1 is delivered from the spinner cleaning device 38 and placed into the cassette 28b placed on the cassette rest table 26b by the wafer delivery robot 30. Two columns 22a and 22b that are disposed adjacent to each other are erected on a rear portion of the base 4. The first grinding unit 10a is vertically movably mounted on a front surface of the column 22a, and the second grinding unit 10b is vertically movably mounted on a front surface of the column 22b.
The first grinding unit 10a includes a first spindle 14a extending in vertical directions and a spindle motor 12a connected to an upper end of the first spindle 14a. The second grinding unit 10b includes a second spindle 14b extending in vertical directions and a spindle motor 12b connected to an upper end of the second spindle 14b. The first grinding unit 10a also includes a first lifting and lowering mechanism 24a supporting the components of the first grinding unit 10a that include the first spindle 14a for movement along the vertical directions. The second grinding unit 10b also includes a second lifting and lowering mechanism 24b supporting the components of the second grinding unit 10b that include the second spindle 14b for movement along the vertical directions. The first and second spindles 14a and 14b may have their orientations adjustable.
As illustrated in
When the spindle motor 12a is energized, the first spindle 14a is rotated about its central axis, rotating the first grinding wheel 18a to move the first grindstones 20a on and along a first annular track. Then, the first lifting and lowering mechanism 24a is actuated to lower the first spindle 14a and bring the first grindstones 20a into abrasive contact with the reverse side 1b, i.e., the upper surface, of the workpiece 1 held on the chuck table 8 in the rough-grinding region, thereby grinding the workpiece 1. When the spindle motor 12b is energized, the second spindle 14b is rotated about its central axis, rotating the second grinding wheel 18b to move the second grindstones 20b on and along a second annular track. Then, the second lifting and lowering mechanism 24b is actuated to lower the second spindle 14b and bring the second grindstones 20b into abrasive contact with the reverse side 1b, i.e., the upper surface, of the workpiece 1 held on the chuck table 8 in the finish-grinding region, thereby grinding the workpiece 1.
In the first grinding unit 10a, the lifting and lowering mechanism 24a grinding-feeds the first grinding unit 10a at a relatively high speed to enable the first grindstones 20a of the first grinding unit 10a to perform rough grinding on the workpiece 1 on the chuck table 8 in the rough-grinding region. When the workpiece 1 is rough-ground by the first grinding unit 10a, most of the total material to be ground off the workpiece 1 until the workpiece 1 is ground to a finished thickness is removed. In the second grinding unit 10b, the lifting and lowering mechanism 24b grinding-feeds the second grinding unit 10b at a relatively low speed to enable the second grindstones 20b of the second grinding unit 10b to perform finish grinding on the workpiece 1 on the chuck table 8 in the finish-grinding region. When the workpiece 1 is finish-ground by the second grinding unit 10b, the workpiece 1 is ground to the finished thickness, so that surface irregularities are removed from the reverse side 1b. Each of the first grindstones 20a and the second grindstones 20b contains abrasive grains made of diamond or the like and a binder in which the abrasive grains are dispersed and secured. The abrasive grains contained in the second grindstones 20b used for finish grinding should preferably be of a grain size smaller than that of the abrasive grains contained in the first grindstones 20a used for rough grinding. The abrasive grains of the thus selected grain size allow the first grindstones 20a to rough-grind the workpiece 1 more quickly and also allows the second grindstones 20b to finish-grind the workpiece 1 to higher quality.
A first thickness measuring device 40 for measuring the thickness of the workpiece 1 rough-ground by the first grinding unit 10a is disposed on the upper surface of the base 4 near the first grinding unit 10a. Similarly, a second thickness measuring device 42 for measuring the thickness of the workpiece 1 finish-ground by the second grinding unit 10b is disposed on the upper surface of the base 4 near the second grinding unit 10b.
The first thickness measuring device 40 is, for example, a contact-type thickness measuring device for measuring the thickness of the workpiece 1 while physically contacting the reverse side 1b of the workpiece 1. The contact-type thickness measuring device includes two probes extending over the chuck table 8 in the rough-grinding region, for example. Each of the probes includes an arm extending horizontally and a contact finger extending downwardly from a distal end of the arm. One of the probes measures the height of the reverse side 1b of the workpiece 1 by keeping the lower end of the contact finger thereof in contact with the reverse side 1b of the workpiece 1. The other probe measures the height of the holding surface 8a of the chuck table 8 by keeping the lower end of the contact finger thereof in contact with the holding surface 8a. The workpiece 1 is placed and held on the holding surface 8a of the chuck table 8 with the protective member 3 interposed therebetween. Hence, the contact-type thickness measuring device can calculate the total thickness of the workpiece 1 and the protective member 3 from the difference between the measured height of the reverse side 1b of the workpiece 1 and the measured height of the holding surface 8a of the chuck table 8.
The second thickness measuring device 42 is, for example, a non-contact-type thickness measuring device for measuring the thickness of the workpiece 1 while staying out of physical contact with the reverse side 1b of the workpiece 1. The non-contact-type thickness measuring device includes a measuring unit 42a disposed directly above the reverse side 1b of the workpiece 1 on the chuck table 8 in the finish-grinding region. The non-contact-type thickness measuring device measures the height of the reverse side 1b of the workpiece 1 by transmitting ultrasonic waves or probe light from the measuring unit 42a to the reverse side 1b of the workpiece 1, detecting reflected ultrasonic waves or probe light from the reverse side 1b with the measuring unit 42a, and analyzing the detected ultrasonic waves or probe light. Hence, the measuring unit 42a is a non-contact-type sensor.
The non-contact-type second thickness measuring device 42 has, for example, a rotatable shaft 42b erected from the upper surface of the base 4 of the grinding apparatus 2 and an arm 42c extending horizontally from an upper end of the shaft 42b. The measuring unit 42a is fixed to a distal end of the arm 42c. An unillustrated rotating mechanism including a piston, an electric motor, or the like is connected to a lower end of the shaft 42b for rotating the shaft 42b about its central axis. When the shaft 42b is rotated about its central axis by the rotating mechanism, the measuring unit 42a is moved on and along an arcuate measuring track around the shaft 42b. Stated otherwise, the grinding apparatus 2 has a measuring unit moving mechanism for moving the measuring unit 42a back and forth on and along the arcuate measuring track over the workpiece 1 on the chuck table 8 in the finish-grinding region. While the reverse side 1b of the workpiece 1 is being ground by the second grinding unit 10b, the measuring unit 42a is movable over the reverse side 1b of the workpiece 1 and can measure various portions of the reverse side 1b.
However, the measuring unit 42a cannot move into physical interference with the second grinding unit 10b as it grinds the workpiece 1. Since the second grindstones 20b keep contacting a central portion of the workpiece 1 while grinding the workpiece 1, the measuring unit 42a is unable to enter a space above the central portion of the workpiece 1 at any time. Specifically, the measuring unit moving mechanism moves the measuring unit 42a back and forth on the arcuate measuring track between a position above the outer circumferential edge of the workpiece 1 on the chuck table 8 and a position above the workpiece 1 out of physical interference with the second grinding unit 10b.
The grinding apparatus 2 further includes a control unit 90 for controlling various components thereof. The control unit 90 controls, for example, the turntable 6, the chuck tables 8, the first and second grinding units 10a and 10b, the wafer delivery robot 30, the positioning table 32, the loading arm 34, the unloading arm 36, the spinner cleaning device 38, etc. The control unit 90 includes a computer including a processing device such as a central processing unit (CPU) or a microprocessor and a storage device such as a flash memory or a hard disk drive. When the processing device operates according to software represented by programs, etc., stored in the storage device, the control unit 90 functions as specific means in which the software and the processing device work together. The control unit 90 stores processing conditions under which various workpieces 1 are to be ground by the first and second grinding units 10a and 10b, various pieces of information, etc., in the storage device. The processing conditions stored in the storage device include information representing the types, sizes, and thicknesses to be achieved by rough and finish grinding, of workpieces 1 to be processed, i.e., ground, rotational speeds of the spindles 14a and 14b, etc.
As illustrated in
For finish-grinding the workpiece 1 with the second grinding unit 10b, the chuck table 8 in the finish-grinding region is rotated about the table rotational axis 58 and the second spindle 14b is lowered while being rotated about its central axis to bring the second grindstones 20b into abrasive contact with the reverse side 1b of the workpiece 1. While the second grindstones 20b are grinding an arcuate area of the workpiece 1 from its center to outer circumferential edge, the workpiece 1 on the chuck table 8 is rotated about the table rotational axis 58, causing the second grindstones 20b to grind the reverse side 1b of the workpiece 1 in its entirety.
In order to make the face side 1a and the reverse side 1b of the workpiece 1 parallel to each other, the tilt of the table rotational axis 58 is determined to make one of the generators of the conical holding surface 8a that is closest to a plane of rotation that includes the annular track of the second grindstones 20b, parallel to the plane of rotation. While the second grindstones 20b are grinding the reverse side 1b of the workpiece 1, the second thickness measuring device 42 monitors the thickness of the workpiece 1. When the workpiece 1 has been ground to a predetermined thickness, the second lifting and lowering mechanism 24b stops lowering the second spindle 14b, bringing the finish-grinding process on the workpiece 1 to an end.
If the tilt of the table rotational axis 58 of the chuck table 8 is not appropriate, the workpiece 1 does not have a uniform thickness distribution, and suffers a thickness deviation, so that the face side 1a and the reverse side 1b of the workpiece 1 do not lie parallel to each other. While the workpiece 1 is being ground, therefore, the measuring unit 42a of the second thickness measuring device 42 is moved to measure the thicknesses of various portions of the workpiece 1. In this manner, the thickness distribution of the workpiece 1 is monitored. When the measured thickness distribution of the workpiece 1 becomes problematic, the tilt adjustment unit may be used to adjust the tilt of the table rotational axis 58. However, since the second grindstones 20b grind the workpiece 1 at all times in the central portion thereof, the measuring unit 42a cannot access the central portion of the workpiece 1 and hence cannot measure the thickness of the central portion of the workpiece 1.
According to one solution, a plurality of data maps representing an example of the cross-sectional shape of the workpiece 1 are stored in the control unit 90 or the like, and, with use of the stored data map, the thickness of the central portion of the workpiece 1 can be predicted according to the cross-sectional shape of a portion of the workpiece 1 other than the central portion thereof. Specifically, the cross-sectional shape of a portion of the workpiece 1 other than the central portion thereof is checked against the data maps stored in the control unit 90, and one of the data maps that is closest to the cross-sectional shape is selected. Then, a thickness distribution of the workpiece 1 in its entirety is predicted according to the selected data map, and the tilt of the table rotational axis 58 is adjusted according to the predicted thickness distribution. However, inasmuch as the grinding process is continuously in progress while the measuring unit, i.e., sensor, 42a of the second thickness measuring device 42 is being moved over the surface being ground of the workpiece 1 to measure the thicknesses of various portions of the workpiece 1, the thicknesses of those portions are measured at different times. In other words, the proposed method is unable to obtain an accurate thickness distribution over the entire surface of the workpiece 1 at a certain time. Since the data maps of the cross-sectional shape of the workpiece 1 do not assume that the grinding process is in progress, the thickness distribution of the workpiece 1 that is measured by the thickness measuring device 42 cannot be checked against the data maps to a nicety.
On the other hand, the grinding apparatus 2 according to the present embodiment predicts a thickness distribution of the workpiece 1 in its entirety at a certain point of time while the workpiece 1 is changing its thickness during the grinding process. Then, depending on the predicted thickness distribution of the workpiece 1, the grinding apparatus 2 actuates the tilt adjustment unit to adjust the tilt of the table rotational axis 58, and grinds the workpiece 1 with the adjusted tilt of the table rotational axis 58 to make the ground workpiece 1 free of thickness deviations. Configurational details of the grinding apparatus 2 that contribute to the prediction of a thickness distribution of the workpiece 1 in its entirety at a certain point of time will be described in detail below. The prediction of a thickness distribution of the workpiece 1 in its entirety on the grinding apparatus 2 is carried out by the control unit 90 that controls the components of the grinding apparatus 2. The control unit 90 then determines details as to how to operate the tilt adjustment unit.
The control unit 90 includes a grinding controlling section 92 (see
For adjusting the tilt of the table rotational axes 58, the grinding controlling section 92 refers to the cross-sectional shapes of the workpieces 1. The control unit 90 also includes a cross-sectional shape calculating section 94 for calculating the cross-sectional shapes of the workpieces 1 from the thicknesses of various portions of the workpieces 1. The thickness of the workpiece 1 in the rough-grinding region is measured by the first thickness measuring device 40, whereas the thickness of the workpiece 1 in the finish-grinding region is measured by the measuring unit 42a of the second thickness measuring device 42 while the measuring unit 42a is being moved on and along the measuring track by the measuring unit moving mechanism. Further, the control unit 90 includes a tilt adjustment variable calculating section 96 for calculating tilt adjustment variables or angles by which the tilt of the table rotational axes 58 is to be adjusted by the tilt adjustment units, in order to make the workpieces 1 ground by the first and second grindstones 20a and 20b close to a finished shape. The grinding controlling section 92 refers to the calculated tilt adjustment variables from the tilt adjustment variable calculating section 96 and controls the tilt adjustment units to adjust the tilt of the table rotational axes 58 in reference to the tilt adjustment variables.
The relation between deviations of a thickness distribution of a workpiece 1 in the grinding process and the tilt of the table rotational axis 58 will be described in detail below. Though the relation in a process for finish-grinding the workpiece 1 with the second grinding unit 10b will be described below, the relation in a process for rough-grinding a workpiece 1 with the first grinding unit 10a is similar to the relation in the finish-grinding process.
For grinding the workpiece 1, the tilt adjustment unit adjust the tilt of the table rotational axis 58 to make a generator of the holding surface 8a that interconnects the center 68 of the holding surface 8a underlying the annular track 20c and an outer circumferential edge, denoted by 66, of the holding surface 8a, parallel to the annular track 20c. The second grindstones 20b that are being moved along the annular track 20c are bought into abrasive contact with the reverse side 1b of the workpiece 1 in a grinding area 72 between a position above the center 68 of the holding surface 8a and a position above the outer circumferential edge 66, grinding the reverse side 1b of the workpiece 1. The second grindstones 20b stay out of abrasive contact with the workpiece 1 in an area between the position above the center 68 of the holding surface 8a and a position above another outer circumferential edge 70 of the holding surface 8a.
The thickness distribution indicated by the graph of
In view of the cross-sectional shape of the workpiece 1 that is produced due to the thickness deviation “a,” the thickness deviation “a” may be called a “protruding deviation.” In order to eliminate the deviation of the thickness variation indicated by the graph of
The thickness distribution indicated by the graph of
In view of the cross-sectional shape of the workpiece 1 that is produced due to the thickness deviation “m,” the thickness deviation “m” may be called a “gull wing deviation.” The degrees to which the adjustment shafts 62 and 64 are to be adjusted may be determined to make the deviation “m” zero. As illustrated in
In a case where the lengths of the adjustment shafts 62 and 64 are appropriate, the thickness of the workpiece 1 is uniform in its entirety. In a case where the lengths of the adjustment shafts 62 and 64 are inappropriate, the workpiece 1 develops a thickness distribution that is represented by the sum of the thickness distribution indicated by the graph of
When the tilt adjustment variable calculating section 96 is to calculate degrees to which the lengths of the adjustment shafts 62 and 64 are to be adjusted, i.e., adjustment variables, the tilt adjustment variable calculating section 96 refers to the thickness distribution of the workpiece 1, i.e., the cross-sectional shape of the workpiece 1. The cross-sectional shape of the workpiece 1 that serves as a reference for calculating the adjustment variables varies at all times while the grinding process for the workpiece 1 is in progress. In addition, the measuring unit 42a for measuring the thickness of the workpiece 1 is unable to move into physical interference with the second grinding unit 10b, i.e., to enter the space above the central portion of the workpiece 1, and hence cannot measure the thickness of the workpiece 1 in its central portion. Consequently, the cross-sectional shape calculating section 94 of the control unit 90 measures the thicknesses of various portions of the workpiece 1 within a possible range with the measuring unit 42a of the second thickness measuring device 42, and calculates the entire cross-sectional shape of the workpiece 1 according to the measured thicknesses. In particular, the cross-sectional shape calculating section 94 calculates the cross-sectional shape of the workpiece 1 at a certain point of time, in view of the different times at which the cross-sectional shape calculating section 94 measures the thicknesses of the various portions of the workpiece 1. An example of a process of calculating the cross-sectional shape of the workpiece 1 by the cross-sectional shape calculating section 94 will be described below.
The grinding apparatus 2 according to the present embodiment calculates an average thickness value that represents the average value of measured thickness values acquired when the measuring unit 42a measures the thickness of the workpiece 1 in forward strokes on the measuring track and measured thickness values acquired when the measuring unit 42a measures the thickness of the workpiece 1 in return strokes on the measuring track. The significance of the calculation of the average thickness value will be described below. In one example, attention is drawn to a change in the thickness of the workpiece 1 at any position “a” on the measuring track between the position “I” and the position “O” at the respective ends thereof. After the measuring unit 42a that moves back and forth along the measuring track has left the position “I,” the measuring unit 42a passes through the position “a” when it measures a value T(a1) of the thickness of the workpiece 1. The stroke at this time of the measuring unit 42a will be referred to as a “forward stroke” and the value T(a1) as “measured forward stroke thickness value.” Thereafter, the measuring unit 42a, after having reached the position “O,” reverses its direction at the position “O,” and passes again through the position “a” when it measures a value T(a2) of the thickness of the workpiece 1. The stroke at this time of the measuring unit 42a will be referred to as a “return stroke” and the value T(a2) as a “measured return stroke thickness value.”
The speed at which the measuring unit 42a is moved back and forth on the measuring track by the measuring unit moving mechanism changes periodically. Specifically, the measuring unit 42a is accelerated after it has left the position “I” until it reaches a midpoint on the measuring track, and then decelerated from the midpoint until it reaches the position “I.” The changes in the speed of the measuring unit 42a are symmetrical upon acceleration and deceleration on both sides of the midpoint, and are similar in the forward and return strokes. Therefore, the length of time required for the measuring unit 42a to travel after it has passed through the position “a” until it reaches the position “O” and the length of time required for the measuring unit 42a to travel after it has left the position “O” until it reaches the position “a” are equal to each other. The workpiece 1 is ground at a constant rate.
Thus, the amount of the material ground off from the workpiece 1 during the period of time after the measuring unit 42a has passed through the position “a” until it reaches the position “O” and the amount of the material ground off from the workpiece 1 during the period of time after the measuring unit 42a has left the position “O” until it reaches the position “a” are equal to each other. Consequently, the average value of the thickness value T(a1) and the thickness value T(a2) represents the thickness of the workpiece 1 at a position underlying the position “a” on the measuring track at the time the measuring unit 42a reaches the position “O.” Similarly, at a position “b” different from the position “a” on the measuring track, the thickness value of the workpiece 1 measured by the measuring unit 42a moving in the forward stroke on the measuring track is referred to as “T(b1),” and the thickness value of the workpiece 1 measured by the measuring unit 42a moving in the return stroke on the measuring track is referred to as “T(b2).” The average value of the thickness value T(b1) and the thickness value T(b2) represents the thickness of the workpiece 1 at a position underlying the position “b” on the measuring track at the time the measuring unit 42a reaches the position “O.”
The measuring unit 42a calculates at each of various points on the workpiece 1 the average value of the measured forward stroke thickness value acquired when the measuring unit 42a measures the thickness of the workpiece 1 in the forward stroke and the measured return stroke thickness value acquired when the measuring unit 42a measures the thickness of the workpiece 1 in the return stroke. The distribution of the average values obtained at the various points is in conformity with the distribution of thickness values of the workpiece 1, i.e., the cross-sectional shape thereof, at the time the measuring unit 42a has reached the position “O.” It is important to note that this process makes it possible to obtain a thickness distribution of the workpiece 1 that is free of the effect of the differences between the measuring times. When the measuring unit 42a reaches the position “a” again after having moved in the return stroke on the measuring track and changed its direction at the position “I,” the measuring unit 42a measures the thickness of the workpiece 1 as a measured thickness value T(a3). The measuring unit 42a may calculate an average thickness value of the thickness value T(a2) and thickness value T(a3). This average thickness value represents the thickness of the workpiece 1 at a position underlying the position “a” on the measuring track at the time the measuring unit 42a reaches the position “I.” In other words, a thickness distribution of the workpiece 1, i.e., a cross-sectional shape thereof, can be calculated at this time according to a similar process, and a thickness distribution of the workpiece 1, i.e., a cross-sectional shape thereof, can be calculated repeatedly according to a similar process.
In
Since the measuring unit 42a cannot move over the central portion of the workpiece 1, the cross-sectional shape calculating section 94 cannot calculate a thickness distribution, i.e., a cross-sectional shape, of the central portion of the workpiece 1. However, it is possible to calculate a thickness distribution, i.e., a cross-sectional shape, of the central portion of the workpiece 1 according to the thickness distribution, i.e., the cross-sectional shape, of a portion of the workpiece 1 except the central portion thereof. For example, the control unit 90 may further have a cross-sectional shape interpolating section 98 for interpolating a cross-sectional shape of the workpiece 1 by calculating the cross-sectional shape of the central portion of the workpiece 1 from the cross-sectional shape of the central portion that is calculated by the cross-sectional shape calculating section 94. In this case, the tilt adjustment variable calculating section 96 calculates a degree to which the tilt of the table rotational axis 58 is to be adjusted according to the cross-sectional shape of the workpiece 1 interpolated by the cross-sectional shape interpolating section 98. For example, the cross-sectional shape interpolating section 98 derives an approximate equation representing a height distribution of the upper surface of the workpiece 1 according to the least-squares method from the cross-sectional shape of the portion of the workpiece 1 except the central portion thereof, and calculates a cross-sectional shape of the central portion of the workpiece 1 according to the approximate equation, thereby interpolating the cross-sectional shape of the workpiece 1. In this process, the approximate equation representing the height distribution of the upper surface of the workpiece 1, which is derived according to the least-squares method, also contributes to minimizing the effect of errors and variations that are necessarily caused in thickness values measured at various points on the workpiece 1 by the measuring unit 42a.
Errors and variations caused in thickness values measured at various points on the workpiece 1 by the measuring unit 42a may be corrected by a process of calculating an average thickness value per certain length on the upper surface of the workpiece 1 or a median thickness value of the workpiece 1, other than the least-squares method. In addition, errors and variations may alternatively be corrected by a process of performing a plurality of thickness measurements and calculating an average or median thickness value from the thickness measurements at various points on the workpiece 1. However, these processes other than the least-squares method will require a further process of calculating the thickness of the central portion of the workpiece 1 where no measured value can be obtained after errors and variations caused in measured thickness values have been corrected. Still another process, other than the least-squares method, of deriving a thickness distribution, i.e., a cross-sectional shape, of the central portion of the workpiece 1 may be performed by registering typical examples of a thickness distribution of the workpiece 1 in advance as a plurality of data maps in the control unit 90 and checking measured thickness values against the data maps. According to this process, the cross-sectional shape calculating section 94 calculates a thickness distribution of the portion of the workpiece 1 other than the central portion thereof, the obtained thickness distribution is checked against the data maps registered in the control unit 90, and one of the data maps that best matches the thickness distribution is selected as an entire thickness distribution of the workpiece 1.
However, the workpiece 1 that is being ground may come to have a cross-sectional shape not normally predicted because of the shape of the lower surface, not ground, of the workpiece 1, the shape of the holding surface 8a of the chuck table 8, unexpected faults of the grinding apparatus 2, etc. In other words, any of the data maps registered in the control unit 90 may fail to match the thickness distribution of the workpiece 1. On the other hand, the process of interpolating the thickness distribution, i.e., the cross-sectional shape, of the workpiece 1 according to the least-squares method is able to calculate an appropriate equation for the upper surface of the workpiece 1 and interpolate the cross-sectional shape of the workpiece 1 even in cases where the workpiece 1 has an unknown thickness distribution not normally predicted. In such cases where the workpiece 1 has an unknown thickness distribution, the tilt of the table rotational axis 58 can be corrected in order for the entire workpiece 1 to have a final uniform thickness, as described later.
The process of interpolating the thickness distribution, i.e., the cross-sectional shape, of the workpiece 1 according to the least-squares method can deal with situations where the workpiece 1 has an unknown thickness distribution as measured by the measuring unit 42a, and also reduce the effect of errors, etc., of measured values and interpolate the thickness distribution of the central portion of the workpiece 1. Further, by use of the approximate equation derived by the least-squares method for the thickness distribution of the workpiece 1, the thickness distribution of the workpiece 1 can easily be separated into the two graphs illustrated in
Next, a process of calculating a degree by which the tilt of the table rotational axis 58 is to be adjusted with the tilt adjustment variable calculating section 96 and grinding the workpiece 1 while adjusting the tilt of the table rotational axis 58 in order for the entire workpiece 1 to have a uniform finished thickness will be described below.
An example of a process in which the grinding of the workpiece 1 is kept in progress by the second grinding unit 10b will be described below with reference to
At time B, the tilt of the table rotational axis 58 starts being adjusted. The tilt adjustment variable calculating section 96 calculates length adjustment variables for the respective adjustment shafts 62 and 64 that function as the tilt adjustment unit by referring to the values of the thickness deviations “a” and “m” of the workpiece 1. The control unit 90 then changes the lengths of the adjustment shafts 62 and 64 according to the calculated length adjustment variables. Specifically, the control unit 90 starts increasing the length of the adjustment shaft 62 at time B and finishes increasing the length of the adjustment shaft 62 at time C. The thickness deviation “m” of the workpiece 1 represented by the solid-line curve 82 gradually decreases from time B and stops being reduced at time C. In the example illustrated in
The length of the adjustment shaft 64 starts being reduced at time B, and finishes decreasing at time D. The thickness deviation “a” of the workpiece 1 represented by the solid-line curve 84 gradually increases toward zero from time B, and stops increasing at time D. In the example illustrated in
Thereafter, the thickness deviations “a” and “m” remain highly close to zero until time F. When the thickness of the workpiece 1 reaches a finished thickness at time F, the second spindle 14b stops being lowered, bringing the grinding process to an end. At this time, since the thickness deviations “a” and “m” are highly close to zero, the entire workpiece 1 has been ground to a finished thickness highly accurately.
The process of grinding the workpiece 1 on the grinding apparatus 2 according to the present embodiment described above will be summarized below. In the grinding apparatus 2, the chuck tables 8 in the rough-grinding region and the finish-grinding region first hold the workpieces 1 thereon. Then, the chuck tables 8 are rotated about the respective table rotational axes 58, and while the grinding wheels 18a and 18b of the grinding units 10a and 10b are being rotated about the respective axes of the spindles 14a and 14b, the spindles 14a and 14b are lowered toward the respective upper surfaces of the workpieces 1. The grindstones 20a and 20b that are moving along their annular tracks are brought into abrasive contact with the upper surfaces of the workpieces 1, starting to grind the workpieces 1.
While the workpieces 1 are being thus ground, the measuring units of the thickness measuring devices 40 and 42 measure the thicknesses of the workpieces 1 while moving back and forth on the measuring tracks out of physical interference with the grinding units 10a and 10b above the workpieces 1. Operation of only the measuring unit 42a of the thickness measuring device 42 will be described hereinbelow. The control unit 90 calculates an average thickness value that represents the average value of measured thickness values acquired when the measuring unit 42a measures the thickness of the workpiece 1 in forward strokes on the measuring track and measured thickness values acquired when the measuring unit 42a measures the thickness of the workpiece 1 in return strokes on the measuring track. Thereafter, the control unit 90 calculates a cross-sectional shape of the workpiece 1 from the average thickness values at various points on the workpiece 1. However, since the measuring unit 42a is unable to enter the space above the central portion of the workpiece 1, the measuring unit 42a cannot measure the thickness of the central portion of the workpiece 1. For calculating a cross-sectional shape of the workpiece 1, therefore, an appropriate equation representing the cross-sectional shape of the workpiece 1 may be generated by the least-squares method, the cross-sectional shape of the central portion of the workpiece 1 may be calculated according to the approximate equation, and the cross-sectional shape of the workpiece 1 may be interpolated from the cross-sectional shape of the central portion of the workpiece 1. However, the process of interpolating the cross-sectional shape of the workpiece 1 is not limited to the above details.
Thereafter, the tilt of the table rotational axis 58 is adjusted such that the workpiece 1 ground by the grindstones 20a and 20b will approach a finished shape. The adjustment variable by which the tilt of the table rotational axis 58 is to be adjusted is calculated according to the calculated cross-sectional shape of the workpiece 1. Specifically, the tilt of the table rotational axis 58 is adjusted to bring the deviations “a” and “m” of the thickness distribution of the workpiece 1 close to zero. Then, while the workpiece 1 is being ground, the tilt of the table rotational axis 58 is adjusted as required until the workpiece 1 that has a predetermined uniform finished thickness is finally obtained.
In the grinding apparatus 2 according to the present embodiment, as described above, the thickness measuring device 42 measures the thickness of the workpiece 1 that is being ground and hence has its thickness changing at all times while the thickness measuring device 42 is being moved back and forth over the workpiece 1. The control unit 90 calculates a thickness distribution of the workpiece 1, i.e., a cross-sectional shape thereof, in its entirety that is free of the effect of the differences between the times at which the thickness is measured at various points on the workpiece 1. Thus, the tilt of the table rotational axis 58 can appropriately be adjusted to make the ground workpiece 1 uniform in thickness.
The present invention is not limited to the present embodiment described above, and various changes and modifications may be made therein. According to the above embodiment, for example, it has been described that the measuring unit 42a measures thicknesses of the workpiece 1 at various points thereon while moving back and forth along the measuring track, average thickness values representing an average of thickness values measured in the forward stroke and thickness values measured in the return stroke are calculated, and a cross-sectional shape of the workpiece 1 is calculated according to the average thickness values. However, the present invention is not limited to such details. Specifically, another calculating process may be employed to calculate a thickness distribution of the workpiece 1, i.e., a cross-sectional shape thereof, in its entirety that is free of the effect of the differences between the times at which the thickness is measured at various points on the workpiece 1. For example, supposing that the grinding speed, i.e., the grinding rate, of the workpiece 1 is essentially constant, a thickness distribution of the workpiece 1 may be calculated at a certain point of time in such a manner as to be free of the effect of the differences between degrees to which the grinding of the workpiece 1 is in progress due to the differences between the times at which the thickness is measured at various points on the workpiece 1.
For example, a situation is considered for measuring the thickness of the workpiece 1 when the measuring unit 42a is positioned in the position “I” at an end of the measuring track, and then measuring the thickness of the workpiece 1 when the measuring unit 42a is positioned in a particular position on the measuring track. In this situation, the product of a length of time required for the measuring unit 42a to move from the position “I” to the particular position and the grinding speed is added to the thickness of the workpiece 1 measured by the measuring unit 42a when the measuring unit 42a is positioned in the particular position. Then, the thickness of the workpiece 1 in the particular position can be calculated at the time the measuring unit 42a was positioned in the position “I.”
In this situation, too, the cross-sectional shape calculating section 94 measures the thicknesses of the various portions of the workpiece 1 with the measuring unit 42a and calculates a cross-sectional shape of the portion of the workpiece 1 other than the central portion thereof. The cross-sectional shape interpolating section 98 calculates a cross-sectional shape of the central portion of the workpiece 1 according to the least-squares method from the calculated cross-sectional shape of the portion of the workpiece 1 other than the central portion thereof, and interpolates the cross-sectional shape of the workpiece 1. The tilt adjustment variable calculating section 96 calculates a tilt adjustment variable for the table rotational axis 58 to bring the workpiece 1 ground by the second grindstones 20b close to a finished shape according to the cross-sectional shape of the workpiece 1. According to this process, it is possible to calculate a thickness distribution of the workpiece 1, i.e., a cross-sectional shape thereof, that is free of the effect of the differences between the measuring times, simply by moving the measuring unit 42a from one end to the other of the measuring track. In this case, however, the calculations required may be more complex than the above process of calculating average thickness values.
Moreover, for example, the measuring unit 42a of the thickness measuring device 42 may have a plurality of sensors. The measuring unit 42a with the plurality of sensors may be fixed in position and the sensors can simultaneously measure thicknesses of various portions of the workpiece 1 without moving. Consequently, a thickness distribution of the workpiece 1 can be obtained without being affected by the differences between the measuring times. However, it is necessary for the grinding apparatus 2 to incorporate the thickness measuring device 42 with the plurality of sensors, tending to increase the cost of the grinding apparatus 2, and thicknesses of the workpiece 1 cannot be measured at positions where the sensors are not located.
According to the above embodiment, it has been described that the workpiece 1 is ground while the tilt of the table rotational axis 58 is being adjusted to make the workpiece 1 uniform in thickness. However, the tilt adjustment unit may not necessarily be required to adjust the tilt of the table rotational axis 58, and the tilt adjustment variable calculating section 96 may not necessarily be required to calculate tilt adjustment variables for the table rotational axis 58. In the grinding apparatus 2 according to one mode of the present invention, the tilt of the spindles 14a and 14b rather than the tilt of the table rotational axis 58 of the chuck table 8 may be variable, or both the table rotational axis 58 and the spindles 14a and 14b may be variable. Specifically, the tilt adjustment unit may adjust either the table rotational axis 58 or the spindles 14a and 14b or both for adjusting the relative tilt of the table rotational axis 58 and the spindles 14a and 14b. Then, the tilt adjustment variable calculating section 96 calculates a tilt adjustment variable for either the table rotational axis 58 or the spindles 14a and 14b or both. As a result, the tilt adjustment variable calculating section 96 calculates a tilt adjustment variable for adjusting the relative tilt of the table rotational axis 58 and the spindles 14a and 14b with the tilt adjustment unit.
The present invention is not limited to the details of the above described preferred embodiment. The scope of the invention is defined by the appended claims and all changes and modifications as fall within the equivalence of the scope of the claims are therefore to be embraced by the invention.
Number | Date | Country | Kind |
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2021-031794 | Mar 2021 | JP | national |