Oscar K. HSU

Person

Chelmsford, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layered chemical-mechanical planarization pad
- Patent number 9,796,063
- Issue date Oct 24, 2017
- FNS Tech Co., Ltd.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad having micro-grooves on the pad surface
- Patent number 9,375,822
- Issue date Jun 28, 2016
- FNS Tech Co., Ltd.
- Oscar K. Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical planarization pad including patterned structura...
- Patent number 9,162,341
- Issue date Oct 20, 2015
- FNS Tech Co., Ltd.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad having micro-grooves on the pad surface
- Patent number 8,900,036
- Issue date Dec 2, 2014
- FNS Tech No., Ltd.
- Oscar K. Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Multi-layered chemical-mechanical planarization pad
- Patent number 8,790,165
- Issue date Jul 29, 2014
- FNS Tech Co., Ltd.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Method of grooving a chemical-mechanical planarization pad
- Patent number 8,758,659
- Issue date Jun 24, 2014
- FNS Tech Co., Ltd.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical planarization pad with void network
- Patent number 8,684,794
- Issue date Apr 1, 2014
- FNS Tech Co., Ltd.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Fabric containing non-crimped fibers and methods of manufacture
- Patent number 8,546,260
- Issue date Oct 1, 2013
- Innopad, Inc.
- Oscar K. Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Three-dimensional network in CMP pad
- Patent number 8,491,360
- Issue date Jul 23, 2013
- Innopad, Inc.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical planarization pad including patterned structura...
- Patent number 8,435,099
- Issue date May 7, 2013
- Innopad, Inc.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical planarization pad
- Patent number 8,430,721
- Issue date Apr 30, 2013
- Innopad, Inc.
- Oscar K. Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with controlled void formation
- Patent number 8,377,351
- Issue date Feb 19, 2013
- Innopad, Inc.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical planarization pad
- Patent number 8,172,648
- Issue date May 8, 2012
- Innopad, Inc.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad having micro-grooves on the pad surface
- Patent number 8,137,166
- Issue date Mar 20, 2012
- Innopad, Inc.
- Oscar K. Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical planarization pad having end point detection wi...
- Patent number 7,985,121
- Issue date Jul 26, 2011
- innoPad, Inc.
- Paul Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pads useful in chemical mechanical polishing of substrate...
- Patent number 6,890,244
- Issue date May 10, 2005
- Freudenberg Nonwovens Limited Partnership
- Oscar K. Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pads with polymer filled fibrous web, and methods for fab...
- Patent number 6,712,681
- Issue date Mar 30, 2004
- International Business Machines Corporation
- Shyng-Tsong Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pads useful in chemical mechanical polishing of substrate...
- Patent number 6,656,018
- Issue date Dec 2, 2003
- Freudenberg Nonwovens Limited Partnership
- Oscar K. Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Multilayered polishing pad, method for fabricating, and use thereof
- Patent number 6,383,066
- Issue date May 7, 2002
- International Business Machines Corporation
- Shyng-Tsong Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad grooving method and apparatus
- Patent number 6,340,325
- Issue date Jan 22, 2002
- International Business Machines Corporation
- Shyng-Tsong Chen
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING PAD HAVING MICRO-GROOVES ON THE PAD SURFACE
- Publication number 20150056894
- Publication date Feb 26, 2015
- FNS TECH CO., LTD.
- Oscar K. HSU
- B24 - GRINDING POLISHING
Information Patent Application
MULTI-LAYERED CHEMICAL-MECHANICAL PLANARIZATION PAD
- Publication number 20140311043
- Publication date Oct 23, 2014
- Paul LEFEVRE
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL PLANARIZATION PAD INCLUDING PATTERNED STRUCTURA...
- Publication number 20130244548
- Publication date Sep 19, 2013
- Paul LEFEVRE
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD HAVING MICRO-GROOVES ON THE PAD SURFACE
- Publication number 20120178348
- Publication date Jul 12, 2012
- INNOPAD, INC.
- Oscar K. HSU
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF GROOVING A CHEMICAL-MECHANICAL PLANARIZATION PAD
- Publication number 20120073210
- Publication date Mar 29, 2012
- INNOPAD, INC.
- Paul LEFEVRE
- B24 - GRINDING POLISHING
Information Patent Application
FABRIC CONTAINING NON-CRIMPED FIBERS AND METHODS OF MANUFACTURE
- Publication number 20110171831
- Publication date Jul 14, 2011
- INNOPAD, INC.
- Oscar K. Hsu
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Application
MULTI-LAYERED CHEMICAL-MECHANICAL PLANARIZATION PAD
- Publication number 20100221983
- Publication date Sep 2, 2010
- INNOPAD, INC.
- Paul LEFEVRE
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL PLANARIZATION PAD INCLUDING PATTERNED STRUCTURA...
- Publication number 20100221985
- Publication date Sep 2, 2010
- INNOPAD, INC.
- Paul LEFEVRE
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Planarization Pad With Void Network
- Publication number 20090258588
- Publication date Oct 15, 2009
- INNOPAD, INC.
- Oscar K. HSU
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Pad With Controlled Void Formation
- Publication number 20090246504
- Publication date Oct 1, 2009
- INNOPAD, INC.
- Paul LEFEVRE
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL PLANARIZATION PAD
- Publication number 20090170410
- Publication date Jul 2, 2009
- INNOPAD, INC.
- Oscar K. HSU
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL PLANARIZATION PAD
- Publication number 20090170413
- Publication date Jul 2, 2009
- INNOPAD, INC.
- Oscar K. HSU
- B24 - GRINDING POLISHING
Information Patent Application
Chemical-Mechanical Planarization Pad Having End Point Detection Wi...
- Publication number 20090142989
- Publication date Jun 4, 2009
- INNOPAD, INC.
- Paul Lefevre
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Three-Dimensional Network in CMP Pad
- Publication number 20090137121
- Publication date May 28, 2009
- INNOPAD, INC.
- Oscar K. HSU
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Pad Having Micro-Grooves On The Pad Surface
- Publication number 20080085661
- Publication date Apr 10, 2008
- INNOPAD, INC.
- Oscar K. HSU
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Pad
- Publication number 20060223424
- Publication date Oct 5, 2006
- Jean Vangsness
- B24 - GRINDING POLISHING
Information Patent Application
Fiber embedded polishing pad
- Publication number 20060116059
- Publication date Jun 1, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad
- Publication number 20050255794
- Publication date Nov 17, 2005
- Jean Vangsness
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pads useful in chemical mechanical polishing of substrate...
- Publication number 20040072507
- Publication date Apr 15, 2004
- FREUDENBERG NONWOVENS LIMITED PARTNERSHIP
- Oscar K. Hsu
- B24 - GRINDING POLISHING

Oscar K. HSU

Person

Patents Grantslast 30 patents

Multi-layered chemical-mechanical planarization pad

Polishing pad having micro-grooves on the pad surface

Chemical-mechanical planarization pad including patterned structura...

Polishing pad having micro-grooves on the pad surface

Multi-layered chemical-mechanical planarization pad

Method of grooving a chemical-mechanical planarization pad

Chemical mechanical planarization pad with void network

Fabric containing non-crimped fibers and methods of manufacture

Three-dimensional network in CMP pad

Chemical-mechanical planarization pad including patterned structura...

Chemical-mechanical planarization pad

Polishing pad with controlled void formation

Chemical-mechanical planarization pad

Polishing pad having micro-grooves on the pad surface

Chemical-mechanical planarization pad having end point detection wi...

Polishing pads useful in chemical mechanical polishing of substrate...

Polishing pads with polymer filled fibrous web, and methods for fab...

Polishing pads useful in chemical mechanical polishing of substrate...

Multilayered polishing pad, method for fabricating, and use thereof

Polishing pad grooving method and apparatus

Patents Applicationslast 30 patents

POLISHING PAD HAVING MICRO-GROOVES ON THE PAD SURFACE

MULTI-LAYERED CHEMICAL-MECHANICAL PLANARIZATION PAD

CHEMICAL-MECHANICAL PLANARIZATION PAD INCLUDING PATTERNED STRUCTURA...

POLISHING PAD HAVING MICRO-GROOVES ON THE PAD SURFACE

METHOD OF GROOVING A CHEMICAL-MECHANICAL PLANARIZATION PAD

FABRIC CONTAINING NON-CRIMPED FIBERS AND METHODS OF MANUFACTURE

MULTI-LAYERED CHEMICAL-MECHANICAL PLANARIZATION PAD

CHEMICAL-MECHANICAL PLANARIZATION PAD INCLUDING PATTERNED STRUCTURA...

Chemical Mechanical Planarization Pad With Void Network

Polishing Pad With Controlled Void Formation

CHEMICAL-MECHANICAL PLANARIZATION PAD

CHEMICAL-MECHANICAL PLANARIZATION PAD

Chemical-Mechanical Planarization Pad Having End Point Detection Wi...

Three-Dimensional Network in CMP Pad

Polishing Pad Having Micro-Grooves On The Pad Surface

Polishing Pad

Fiber embedded polishing pad

Polishing pad

Polishing pads useful in chemical mechanical polishing of substrate...