Oscar Van Der Straten

Person

Mohegan Lake, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Etching of magnetic tunnel junction (MTJ) stack for magnetoresistiv...
- Patent number 12,342,726
- Issue date Jun 24, 2025
- International Business Machines Corporation
- Koichi Motoyama
Information Patent Grant
MRAM structure with multilayer encapsulation
- Patent number 12,317,752
- Issue date May 27, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Magneto-resistive random access memory with segmented bottom electrode
- Patent number 12,289,896
- Issue date Apr 29, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Modified top electrode contact for MRAM embedding in advanced logic...
- Patent number 12,277,960
- Issue date Apr 15, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magneto-resistive random access memory with substitutional bottom e...
- Patent number 12,250,827
- Issue date Mar 11, 2025
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
Phase change memory with concentric ring-shaped heater
- Patent number 12,245,530
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Kangguo Cheng
Information Patent Grant
Phase change memory with conductive rings
- Patent number 12,219,884
- Issue date Feb 4, 2025
- International Business Machines Corporation
- Kangguo Cheng
Information Patent Grant
Same level MRAM stacks having different configurations
- Patent number 12,207,477
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Yann Mignot
Information Patent Grant
Replacement bottom electrode structure for MRAM devices
- Patent number 12,167,700
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Multi-diameter magnetic random-access memory pillar structure
- Patent number 12,108,685
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Encapsulated top via interconnects
- Patent number 12,040,230
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial top MRAM electrode
- Patent number 12,002,498
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
Simultaneous electrodes for magneto-resistive random access memory...
- Patent number 11,887,641
- Issue date Jan 30, 2024
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
Physical unclonable function for secure integrated hardware systems
- Patent number 11,791,290
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin-orbit-torque magnetoresistive random-access memory
- Patent number 11,793,001
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Eric Raymond Evarts
- G11 - INFORMATION STORAGE
Information Patent Grant
Magneto-resistive random access memory with laterally-recessed free...
- Patent number 11,758,819
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
Laser anneal for MRAM encapsulation enhancement
- Patent number 11,711,982
- Issue date Jul 25, 2023
- International Business Machines Corporation
- Michael Rizzolo
Information Patent Grant
Dual damascene crossbar array for disabling a defective resistive s...
- Patent number 11,682,471
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Joseph F. Maniscalco
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual damascene with short liner
- Patent number 11,664,271
- Issue date May 30, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode with alloy interface
- Patent number 11,557,482
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having air gap spacers
- Patent number 11,430,690
- Issue date Aug 30, 2022
- International Business Machines Corporation
- Kenneth Chun Kuen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar bump with noble metal seed layer for advanced heterogeneous...
- Patent number 11,380,641
- Issue date Jul 5, 2022
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single process for liner and metal fill
- Patent number 11,322,359
- Issue date May 3, 2022
- ELPIS TECHNOLOGIES INC.
- Praneet Adusumilli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with partial sidewall liner
- Patent number 11,270,910
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical unclonable function for MRAM structures
- Patent number 11,239,414
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with enlarged contact area
- Patent number 11,183,455
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated top via interconnects
- Patent number 11,177,171
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with cobalt-infused ruthenium liner and a c...
- Patent number 11,158,538
- Issue date Oct 26, 2021
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried MIM capacitor structure with landing pads
- Patent number 11,081,542
- Issue date Aug 3, 2021
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-spheroid BEOL capacitor
- Patent number 11,081,543
- Issue date Aug 3, 2021
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONCAVE TRAY BOTTOM ELECTRODE FOR MRAM
- Publication number 20250204268
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
MRAM DEVICE WITH ASYMMETRIC ELECTRODES
- Publication number 20250194432
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
LOW RESISTANCE VIA STRUCTURE
- Publication number 20250167103
- Publication date May 22, 2025
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-INTEGRATION OF S/D METAL CONTACT CUT AND WRAP-AROUND-CONTACT
- Publication number 20250126838
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Julien Frougier
Information Patent Application
MULTI-TAPERED MRAM DEVICE STRUCTURE
- Publication number 20250120324
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Application
MRAM DEVICE WITH TUNNEL BARRIER OVERHANG
- Publication number 20250107452
- Publication date Mar 27, 2025
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Application
VERTICAL ANTIFUSE
- Publication number 20250096122
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC ISOLATION FOR MRAM ARRAY
- Publication number 20250031382
- Publication date Jan 23, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
MRAM ANCHOR VIA
- Publication number 20250024757
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20250014994
- Publication date Jan 9, 2025
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTERCONNECTS WITH HYPERBOLOID PROFILE
- Publication number 20240421076
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH TRAPEZOID SHAPED ELECTRODES
- Publication number 20240389468
- Publication date Nov 21, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
MRAM DEVICE WITH HEXAGONAL SHAPED ELECTRODES
- Publication number 20240389469
- Publication date Nov 21, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
METAL WIRES WITH EXPANDED SIDEWALLS
- Publication number 20240332074
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE SEMICONDUCTOR INTERCONNECT STRUCTURE
- Publication number 20240304546
- Publication date Sep 12, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE FOR ADVANCED INTERCONNECT
- Publication number 20240304547
- Publication date Sep 12, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING METAL WIRES WITH EDGE CURVATURE
- Publication number 20240282630
- Publication date Aug 22, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH OCTAGON PROFILE
- Publication number 20240233793
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Application
MRAM REFILL DEVICE STRUCTURE
- Publication number 20240237548
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
BACKSIDE-CONNECTING VIA WITH NANOSHEET SPACERS FOR TRANSISTORS
- Publication number 20240222395
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OCTAGONAL INTERCONNECT WIRING FOR ADVANCED LOGIC
- Publication number 20240213092
- Publication date Jun 27, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED PITCH INTERCONNECTS WITH MULTIPLE LOW ASPECT RATIO SEGMENTS
- Publication number 20240213087
- Publication date Jun 27, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects with Sidewall Barrier Layer Divot Fill
- Publication number 20240194587
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH HAMMERHEAD PROFILE
- Publication number 20240196758
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Koichi Motoyama
- G11 - INFORMATION STORAGE
Information Patent Application
MULTIPLE LAYERS OF VOID-FREE INTERLAYER DIELECTRIC BETWEEN ADJACENT...
- Publication number 20240188448
- Publication date Jun 6, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Structure for Low Resistance Interconnects
- Publication number 20240186242
- Publication date Jun 6, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diamond Shaped Magnetic Random Access Memory
- Publication number 20240180045
- Publication date May 30, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED POWER RAIL VIA WITH REDUCED ASPECT RATIO DISCREPANCY
- Publication number 20240162151
- Publication date May 16, 2024
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH SKIPVIA
- Publication number 20240153868
- Publication date May 9, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH OCTAGON PROFILE
- Publication number 20240135978
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE

Oscar Van Der Straten

Person

Patents Grantslast 30 patents

Etching of magnetic tunnel junction (MTJ) stack for magnetoresistiv...

MRAM structure with multilayer encapsulation

Magneto-resistive random access memory with segmented bottom electrode

Modified top electrode contact for MRAM embedding in advanced logic...

Magneto-resistive random access memory with substitutional bottom e...

Phase change memory with concentric ring-shaped heater

Phase change memory with conductive rings

Same level MRAM stacks having different configurations

Replacement bottom electrode structure for MRAM devices

Multi-diameter magnetic random-access memory pillar structure

Encapsulated top via interconnects

Coaxial top MRAM electrode

Simultaneous electrodes for magneto-resistive random access memory...

Physical unclonable function for secure integrated hardware systems

Spin-orbit-torque magnetoresistive random-access memory

Magneto-resistive random access memory with laterally-recessed free...

Laser anneal for MRAM encapsulation enhancement

Dual damascene crossbar array for disabling a defective resistive s...

Dual damascene with short liner

Electrode with alloy interface

Interconnects having air gap spacers

Pillar bump with noble metal seed layer for advanced heterogeneous...

Single process for liner and metal fill

Interconnect structure with partial sidewall liner

Physical unclonable function for MRAM structures

Interconnects with enlarged contact area

Encapsulated top via interconnects

Interconnect structures with cobalt-infused ruthenium liner and a c...

Buried MIM capacitor structure with landing pads

Multi-spheroid BEOL capacitor

Patents Applicationslast 30 patents

CONCAVE TRAY BOTTOM ELECTRODE FOR MRAM

MRAM DEVICE WITH ASYMMETRIC ELECTRODES

LOW RESISTANCE VIA STRUCTURE

CO-INTEGRATION OF S/D METAL CONTACT CUT AND WRAP-AROUND-CONTACT

MULTI-TAPERED MRAM DEVICE STRUCTURE

MRAM DEVICE WITH TUNNEL BARRIER OVERHANG

VERTICAL ANTIFUSE

DIELECTRIC ISOLATION FOR MRAM ARRAY

MRAM ANCHOR VIA

TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES

ADVANCED INTERCONNECTS WITH HYPERBOLOID PROFILE

MRAM DEVICE WITH TRAPEZOID SHAPED ELECTRODES

MRAM DEVICE WITH HEXAGONAL SHAPED ELECTRODES

METAL WIRES WITH EXPANDED SIDEWALLS

LOW RESISTANCE SEMICONDUCTOR INTERCONNECT STRUCTURE

WIRING STRUCTURE FOR ADVANCED INTERCONNECT

SEMICONDUCTOR STRUCTURES INCLUDING METAL WIRES WITH EDGE CURVATURE

MRAM DEVICE WITH OCTAGON PROFILE

MRAM REFILL DEVICE STRUCTURE

BACKSIDE-CONNECTING VIA WITH NANOSHEET SPACERS FOR TRANSISTORS

OCTAGONAL INTERCONNECT WIRING FOR ADVANCED LOGIC

ADVANCED PITCH INTERCONNECTS WITH MULTIPLE LOW ASPECT RATIO SEGMENTS

Interconnects with Sidewall Barrier Layer Divot Fill

MRAM DEVICE WITH HAMMERHEAD PROFILE

MULTIPLE LAYERS OF VOID-FREE INTERLAYER DIELECTRIC BETWEEN ADJACENT...

Wire Structure for Low Resistance Interconnects

Diamond Shaped Magnetic Random Access Memory

BURIED POWER RAIL VIA WITH REDUCED ASPECT RATIO DISCREPANCY

INTERCONNECT STRUCTURE WITH SKIPVIA

MRAM DEVICE WITH OCTAGON PROFILE