Owen R. Fay

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low cost three-dimensional stacking semiconductor assemblies
- Patent number 12,062,607
- Issue date Aug 13, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of pre-channeled materials for anisotropic conductors
- Patent number 12,051,670
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 12,033,929
- Issue date Jul 9, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking semiconductor assemblies with near zero...
- Patent number 12,027,498
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with redistribution structures for die sta...
- Patent number 11,990,446
- Issue date May 21, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with flexible reinforcement structure
- Patent number 11,990,350
- Issue date May 21, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,973,062
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages including multiple d...
- Patent number 11,961,825
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricated two-sided millimeter wave antenna using through-silicon-...
- Patent number 11,908,814
- Issue date Feb 20, 2024
- Micron Technology, Inc.
- John F. Kaeding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interface and method
- Patent number 11,868,253
- Issue date Jan 9, 2024
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Edge-notched substrate packaging and associated systems and methods
- Patent number 11,848,299
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers for microelectronic devices
- Patent number 11,824,010
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
- Patent number 11,791,315
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor assemblies and methods of manufact...
- Patent number 11,791,252
- Issue date Oct 17, 2023
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing pillar structures on semicond...
- Patent number 11,735,549
- Issue date Aug 22, 2023
- Micron Technology, Inc.
- Suresh Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave antenna and EMI shielding integrated with fan-out p...
- Patent number 11,710,888
- Issue date Jul 25, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including vertically integrated circuits a...
- Patent number 11,664,291
- Issue date May 30, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antenna using through silicon vias
- Patent number 11,652,283
- Issue date May 16, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,631,644
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,587,912
- Issue date Feb 21, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable integrated millimeter wave antenna using laser ablation and...
- Patent number 11,588,233
- Issue date Feb 21, 2023
- Micron Technology, Inc.
- John F. Kaeding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with flexible reinforcement structure
- Patent number 11,574,820
- Issue date Feb 7, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with redistribution structures for die sta...
- Patent number 11,552,045
- Issue date Jan 10, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge-notched substrate packaging and associated systems and methods
- Patent number 11,482,504
- Issue date Oct 25, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, microelectronic device assembly including same and meth...
- Patent number 11,476,241
- Issue date Oct 18, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost three-dimensional stacking semiconductor assemblies
- Patent number 11,462,472
- Issue date Oct 4, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages and related methods
- Patent number 11,456,284
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked interposer structures, microelectronic device assemblies in...
- Patent number 11,444,067
- Issue date Sep 13, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages and related methods...
- Patent number 11,410,973
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphics processing unit and high bandwidth memory integration usin...
- Patent number 11,410,981
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS
- Publication number 20240387441
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Mark E. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES
- Publication number 20240371755
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...
- Publication number 20240355783
- Publication date Oct 24, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20240339390
- Publication date Oct 10, 2024
- Lodestar Licensing Group LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20240321822
- Publication date Sep 26, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE
- Publication number 20240304465
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...
- Publication number 20240282755
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS FOR MICROELECTRONIC DEVICES
- Publication number 20240120283
- Publication date Apr 11, 2024
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INTERFACE AND METHOD
- Publication number 20240070069
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240055366
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHOD FOR SMOOTHING SURFA...
- Publication number 20230317511
- Publication date Oct 5, 2023
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...
- Publication number 20230307309
- Publication date Sep 28, 2023
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE INTEGRATED MILLIMETER WAVE ANTENNA USING LASER ABLATION AND...
- Publication number 20230198139
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- John F. Kaeding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...
- Publication number 20230197689
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE
- Publication number 20230187224
- Publication date Jun 15, 2023
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20230145473
- Publication date May 11, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE-NOTCHED SUBSTRATE PACKAGING AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20230045144
- Publication date Feb 9, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES
- Publication number 20230025886
- Publication date Jan 26, 2023
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS
- Publication number 20230008292
- Publication date Jan 12, 2023
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTERPOSER STRUCTURES, MICROELECTRONIC DEVICE ASSEMBLIES IN...
- Publication number 20230005904
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...
- Publication number 20220375902
- Publication date Nov 24, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Graphics Processing Unit and High Bandwidth Memory Integration Usin...
- Publication number 20220375917
- Publication date Nov 24, 2022
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INTERFACE AND METHOD
- Publication number 20220342814
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE D...
- Publication number 20220302090
- Publication date Sep 22, 2022
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...
- Publication number 20220293506
- Publication date Sep 15, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...
- Publication number 20220293569
- Publication date Sep 15, 2022
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS FOR MICROELECTRONIC DEVICES
- Publication number 20220254723
- Publication date Aug 11, 2022
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...
- Publication number 20220208736
- Publication date Jun 30, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Tunable Antenna Using Wire Bonds
- Publication number 20220140468
- Publication date May 5, 2022
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE ANTENNA AND EMI SHIELDING INTEGRATED WITH FAN-OUT P...
- Publication number 20220094037
- Publication date Mar 24, 2022
- Micron Technology, Inc.
- Owen R. FAY
- H01 - BASIC ELECTRIC ELEMENTS

Owen R. Fay

Person

Patents Grantslast 30 patents

Low cost three-dimensional stacking semiconductor assemblies

Use of pre-channeled materials for anisotropic conductors

Package-on-package semiconductor assemblies and methods of manufact...

Three-dimensional stacking semiconductor assemblies with near zero...

Semiconductor assemblies with redistribution structures for die sta...

Semiconductor devices with flexible reinforcement structure

High density pillar interconnect conversion with stack to substrate...

Microelectronic device assemblies and packages including multiple d...

Fabricated two-sided millimeter wave antenna using through-silicon-...

Memory device interface and method

Edge-notched substrate packaging and associated systems and methods

Interposers for microelectronic devices

Semiconductor assemblies including thermal circuits and methods of...

Package-on-package semiconductor assemblies and methods of manufact...

Methods and systems for manufacturing pillar structures on semicond...

Millimeter wave antenna and EMI shielding integrated with fan-out p...

Semiconductor assemblies including vertically integrated circuits a...

Integrated antenna using through silicon vias

High density pillar interconnect conversion with stack to substrate...

High density pillar interconnect conversion with stack to substrate...

Tunable integrated millimeter wave antenna using laser ablation and...

Semiconductor devices with flexible reinforcement structure

Semiconductor assemblies with redistribution structures for die sta...

Edge-notched substrate packaging and associated systems and methods

Interposer, microelectronic device assembly including same and meth...

Low cost three-dimensional stacking semiconductor assemblies

Microelectronic device assemblies and packages and related methods

Stacked interposer structures, microelectronic device assemblies in...

Microelectronic device assemblies and packages and related methods...

Graphics processing unit and high bandwidth memory integration usin...

Patents Applicationslast 30 patents

USE OF PRE-CHANNELED MATERIALS FOR ANISOTROPIC CONDUCTORS

LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE

HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...

INTERPOSERS FOR MICROELECTRONIC DEVICES

MEMORY DEVICE INTERFACE AND METHOD

SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHOD FOR SMOOTHING SURFA...

SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...

TUNABLE INTEGRATED MILLIMETER WAVE ANTENNA USING LASER ABLATION AND...

HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...

SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

EDGE-NOTCHED SUBSTRATE PACKAGING AND ASSOCIATED SYSTEMS AND METHODS

LOW COST THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS

STACKED INTERPOSER STRUCTURES, MICROELECTRONIC DEVICE ASSEMBLIES IN...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...

Graphics Processing Unit and High Bandwidth Memory Integration Usin...

MEMORY DEVICE INTERFACE AND METHOD

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE D...

PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACT...

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES WITH NEAR ZERO...

INTERPOSERS FOR MICROELECTRONIC DEVICES

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...

Semiconductor Device with Tunable Antenna Using Wire Bonds

MILLIMETER WAVE ANTENNA AND EMI SHIELDING INTEGRATED WITH FAN-OUT P...