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Patents Grants
last 30 patents
Information
Patent Grant
Optical transceiver with reduced height
Patent number
7,842,957
Issue date
Nov 30, 2010
Avago Technologies ECBU IP (Singapore) Pte, Ltd.
Teck Chai Goh
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Intrinsic thermal enhancement for FBGA package
Patent number
7,521,794
Issue date
Apr 21, 2009
Micron Technology, Inc.
Pak Hong Yee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite receiver assembly having a circuit board on which multipl...
Patent number
7,514,666
Issue date
Apr 7, 2009
Avago Technologies ECBU IP (Singapore) Pte Ltd
Pak Hong Yee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Intrinsic thermal enhancement for FBGA package
Patent number
7,459,346
Issue date
Dec 2, 2008
Micron Technology, Inc.
Pak Hong Yee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Intrinsic thermal enhancement for FBGA package
Patent number
7,138,711
Issue date
Nov 21, 2006
Micron Technology, Inc.
Pak Hong Yee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for adhering and sealing a silicon chip in an integrated cir...
Patent number
6,387,729
Issue date
May 14, 2002
Texas Instruments Incorporated
Kian Teng Eng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package
Patent number
6,365,833
Issue date
Apr 2, 2002
Texas Instruments Incorporated
Kian Teng Eng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for adhering and sealing a silicon chip in an integrated cir...
Patent number
6,087,203
Issue date
Jul 11, 2000
Texas Instruments Incorporated
Kian Teng Eng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Optical Transceiver with Reduced Height
Publication number
20080219673
Publication date
Sep 11, 2008
Teck Chai Goh
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
MINIATURE COMPOSITE ASSEMBLY THAT INCORPORATES MULTIPLE DEVICES THA...
Publication number
20080013961
Publication date
Jan 17, 2008
Pak Hong YEE
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
COMPOSITE ASSEMBLY THAT INCORPORATES MULTIPLE DEVICES THAT USE DIFF...
Publication number
20080011939
Publication date
Jan 17, 2008
Pak Hong YEE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Intrinsic thermal enhancement for FBGA package
Publication number
20060289989
Publication date
Dec 28, 2006
Micron Technology, Inc.
Pak Hong Yee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Intrinsic thermal enhancement for FBGA package
Publication number
20050186704
Publication date
Aug 25, 2005
Micron Technology, Inc.
Pak Hong Yee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Intrinsic thermal enhancement for FBGA package
Publication number
20030230799
Publication date
Dec 18, 2003
Micron Technology, Inc.
Pak Hong Yee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for adhering and sealing a silicon chip in an integrated cir...
Publication number
20020001882
Publication date
Jan 3, 2002
Kian Teng Eng
H01 - BASIC ELECTRIC ELEMENTS