Pan Tang

Follow

Person

Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board with heat dissipation function
- Patent number 12,052,827
- Issue date Jul 30, 2024
- Hong Heng Sheng Electronical Technology (HuaiAn)Co., Ltd.
- Pan Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with heat dissipation function and method for manufac...
- Patent number 11,582,871
- Issue date Feb 14, 2023
- Hong Heng Sheng Electronical Technology (HuaiAn) Co., Ltd
- Pan Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for wet processing substrate
- Patent number 8,388,800
- Issue date Mar 5, 2013
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Yao-Wen Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing printed circuit board with thick traces
- Patent number 8,377,317
- Issue date Feb 19, 2013
- Hong Heng Sheng Electrical Technology (HuaiAn) Co., Ltd
- Yao-Wen Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION
- Publication number 20230139231
- Publication date May 4, 2023
- Hong Heng Sheng Electronical Technology (HuaiAn)Co.,Ltd.
- PAN TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION AND METHOD FOR MANUFAC...
- Publication number 20230007780
- Publication date Jan 5, 2023
- Hong Heng Sheng Electronical Technology (HuaiAn)Co.,Ltd.
- PAN TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD WITH THICK TRACES
- Publication number 20110215069
- Publication date Sep 8, 2011
- Hong Heng Sheng Electronical Technology (HuaiAn) Co., Ltd
- YAO-WEN BAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH CARBON NANOTUBE BUNDLE
- Publication number 20110186339
- Publication date Aug 4, 2011
- Hong Heng Sheng Electronical Technology (HuaiAn)Co., Ltd
- YAO-WEN BAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR WET PROCESSING SUBSTRATE
- Publication number 20110024042
- Publication date Feb 3, 2011
- FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
- Yao-Wen Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...