Pandi C. Marimuthu

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 12,094,843
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 11,488,933
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier to...
- Patent number 11,488,932
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 11,469,191
- Issue date Oct 11, 2022
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 11,222,793
- Issue date Jan 11, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
- Patent number 11,024,561
- Issue date Jun 1, 2021
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 11,011,423
- Issue date May 18, 2021
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 10,777,528
- Issue date Sep 15, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
- Patent number 10,707,150
- Issue date Jul 7, 2020
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier to...
- Patent number 10,658,330
- Issue date May 19, 2020
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 10,636,753
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing encapsulant along sides and surface edge of se...
- Patent number 10,515,828
- Issue date Dec 24, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging thin die and semiconductor device including thi...
- Patent number 10,510,632
- Issue date Dec 17, 2019
- STATS ChipPAC Pte. Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming double-sided fan-out waf...
- Patent number 10,453,785
- Issue date Oct 22, 2019
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
- Patent number 10,446,479
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wire studs as vertical i...
- Patent number 10,446,523
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming electromagnetic (EM) shi...
- Patent number 10,388,612
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using substrate having base and...
- Patent number 10,242,948
- Issue date Mar 26, 2019
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 10,181,423
- Issue date Jan 15, 2019
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive vias through...
- Patent number 10,141,222
- Issue date Nov 27, 2018
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming conductive vias by backs...
- Patent number 10,115,701
- Issue date Oct 30, 2018
- STATS ChipPAC Pte. Ltd.
- Xing Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided semiconductor package and dual-mold method of making same
- Patent number 10,115,672
- Issue date Oct 30, 2018
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
- Patent number 10,049,964
- Issue date Aug 14, 2018
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming low profile fan-out pack...
- Patent number 9,978,665
- Issue date May 22, 2018
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided semiconductor package and dual-mold method of making same
- Patent number 9,893,017
- Issue date Feb 13, 2018
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive vias using ba...
- Patent number 9,865,524
- Issue date Jan 9, 2018
- STATS ChipPAC Pte. Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method and device of forming a fan-out PoP device wit...
- Patent number 9,865,525
- Issue date Jan 9, 2018
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a thin wafer without a c...
- Patent number 9,842,775
- Issue date Dec 12, 2017
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier to...
- Publication number 20230015504
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20230012958
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna in Embedded Wafer-Level Ball-Grid Array Package
- Publication number 20220375886
- Publication date Nov 24, 2022
- STATS ChipPAC Pte Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20220093417
- Publication date Mar 24, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20210233815
- Publication date Jul 29, 2021
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20200335478
- Publication date Oct 22, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Fan-Out PoP Device wit...
- Publication number 20200294890
- Publication date Sep 17, 2020
- STATS ChipPAC Pte Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier to...
- Publication number 20200227383
- Publication date Jul 16, 2020
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna in Embedded Wafer-Level Ball-Grid Array Package
- Publication number 20200219832
- Publication date Jul 9, 2020
- STATS ChipPAC Pte Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20200090954
- Publication date Mar 19, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Double-Sided Fan-Out Waf...
- Publication number 20200006215
- Publication date Jan 2, 2020
- STATS ChipPAC Pte Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Packaging Thin Die and Semiconductor Device Including Thi...
- Publication number 20190287873
- Publication date Sep 19, 2019
- STATS ChipPAC Pte Ltd.
- Won Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20190109048
- Publication date Apr 11, 2019
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna in Embedded Wafer-Level Ball-Grid Array Package
- Publication number 20190088603
- Publication date Mar 21, 2019
- STATS ChipPAC Pte Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Fan-Out PoP Device wit...
- Publication number 20180331018
- Publication date Nov 15, 2018
- STATS ChipPAC Pte Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-Sided Semiconductor Package and Dual-Mold Method of Making Same
- Publication number 20180076142
- Publication date Mar 15, 2018
- STATS ChipPAC Pte Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
- Publication number 20180068937
- Publication date Mar 8, 2018
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...
- Publication number 20170330840
- Publication date Nov 16, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier to...
- Publication number 20170294406
- Publication date Oct 12, 2017
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Low Profile Fan-Out Pack...
- Publication number 20170271241
- Publication date Sep 21, 2017
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20170271305
- Publication date Sep 21, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20170133270
- Publication date May 11, 2017
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using Substrate Having Base and...
- Publication number 20170098610
- Publication date Apr 6, 2017
- STATS ChipPAC Pte Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Depositing Encapsulant Along Sid...
- Publication number 20170011936
- Publication date Jan 12, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Thin Wafer Without a C...
- Publication number 20160336230
- Publication date Nov 17, 2016
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Wire Studs as Vertical I...
- Publication number 20160336299
- Publication date Nov 17, 2016
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-Sided Semiconductor Package and Dual-Mold Method of Making Same
- Publication number 20160300797
- Publication date Oct 13, 2016
- STATS ChipPAC, Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Bonding Semiconductor Die to Sub...
- Publication number 20160163675
- Publication date Jun 9, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming a Low Profile Embedded...
- Publication number 20160141238
- Publication date May 19, 2016
- STATS ChipPAC, Ltd.
- Seung Wook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Double-Sided Fan-Out Waf...
- Publication number 20160043047
- Publication date Feb 11, 2016
- STATS ChipPAC, Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Pandi C. Marimuthu

Person

Patents Grantslast 30 patents

Semiconductor device with encapsulant deposited along sides and sur...

Antenna in embedded wafer-level ball-grid array package

Semiconductor device and method of making a wafer-level chip-scale...

Semiconductor device and method of forming embedded wafer level chi...

Semiconductor device and method of using a standardized carrier to...

Antenna in embedded wafer-level ball-grid array package

Semiconductor device with encapsulant deposited along sides and sur...

Semiconductor device and method of forming a fan-out PoP device wit...

Semiconductor device and method of using a standardized carrier in...

Semiconductor device and method of forming embedded wafer level chi...

Semiconductor device and method of forming a fan-out PoP device wit...

Semiconductor device and method of using a standardized carrier to...

Antenna in embedded wafer-level ball-grid array package

Method of depositing encapsulant along sides and surface edge of se...

Method of packaging thin die and semiconductor device including thi...

Semiconductor device and method of forming double-sided fan-out waf...

Semiconductor device and method of forming a PoP device with embedd...

Semiconductor device and method of forming wire studs as vertical i...

Semiconductor device and method of forming electromagnetic (EM) shi...

Semiconductor device and method of using substrate having base and...

Semiconductor device and method of using a standardized carrier in...

Semiconductor device and method of forming conductive vias through...

Semiconductor device and method of forming conductive vias by backs...

Double-sided semiconductor package and dual-mold method of making same

Semiconductor device and method of forming a fan-out PoP device wit...

Semiconductor device and method of forming low profile fan-out pack...

Double-sided semiconductor package and dual-mold method of making same

Semiconductor device and method of forming conductive vias using ba...

Semiconductor method and device of forming a fan-out PoP device wit...

Semiconductor device and method of forming a thin wafer without a c...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Using a Standardized Carrier to...

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

Antenna in Embedded Wafer-Level Ball-Grid Array Package

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

Semiconductor Device and Method of Forming a Fan-Out PoP Device wit...

Semiconductor Device and Method of Using a Standardized Carrier to...

Antenna in Embedded Wafer-Level Ball-Grid Array Package

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

Semiconductor Device and Method of Forming Double-Sided Fan-Out Waf...

Method of Packaging Thin Die and Semiconductor Device Including Thi...

Semiconductor Device and Method of Using a Standardized Carrier in...

Antenna in Embedded Wafer-Level Ball-Grid Array Package

Semiconductor Device and Method of Forming a Fan-Out PoP Device wit...

Double-Sided Semiconductor Package and Dual-Mold Method of Making Same

Semiconductor Device and Method of Forming a POP Device with Embedd...

Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...

Semiconductor Device and Method of Using a Standardized Carrier to...

Semiconductor Device and Method of Forming Low Profile Fan-Out Pack...

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device and Method of Using Substrate Having Base and...

Semiconductor Device and Method of Depositing Encapsulant Along Sid...

Semiconductor Device and Method of Forming a Thin Wafer Without a C...

Semiconductor Device and Method of Forming Wire Studs as Vertical I...

Double-Sided Semiconductor Package and Dual-Mold Method of Making Same

Semiconductor Device and Method of Bonding Semiconductor Die to Sub...

Semiconductor Device and Method for Forming a Low Profile Embedded...

Semiconductor Device and Method of Forming Double-Sided Fan-Out Waf...