Pang Dow Foo

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making an integrated circuit inductor wherein a plurality...
- Patent number 6,908,825
- Issue date Jun 21, 2005
- Institute of Microelectronics
- Shuming Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and process for bulk wet etch with leakage protection
- Patent number 6,855,640
- Issue date Feb 15, 2005
- Institute of Microelectronics
- Zhe Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-relay
- Patent number 6,765,300
- Issue date Jul 20, 2004
- Tyco Electronics Logistics, A.G.
- Dirk Wagenaar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for reducing dishing in chemical mechanical polishing
- Patent number 6,670,272
- Issue date Dec 30, 2003
- Singapore Science Park II
- Shaoyu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF LDMOS on partial SOI substrate
- Patent number 6,667,516
- Issue date Dec 23, 2003
- Institute of Microelectronics
- Shuming Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked LDD high frequency LDMOSFET
- Patent number 6,664,596
- Issue date Dec 16, 2003
- Institute of Microelectronics
- Jun Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature wafer-to-wafer bonding by polydimethylsiloxane
- Patent number 6,503,847
- Issue date Jan 7, 2003
- Institute of Microelectronics
- Yu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit inductor
- Patent number 6,495,903
- Issue date Dec 17, 2002
- Institute of Microelectronics
- Shuming Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked LDD high frequency LDMOSFET
- Patent number 6,489,203
- Issue date Dec 3, 2002
- Institute of Microelectronics
- Jun Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF LDMOS on partial SOI substrate
- Patent number 6,461,902
- Issue date Oct 8, 2002
- Institute of Microelectronics
- Shuming Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer resist process for dual damascene
- Patent number 6,436,810
- Issue date Aug 20, 2002
- Institute of Microelectronics
- Rakesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed, low cost BICMOS process using profile engineering
- Patent number 6,383,855
- Issue date May 7, 2002
- Institute of Microelectronics
- Minghui Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS compatible integrated pressure sensor
- Patent number 6,122,975
- Issue date Sep 26, 2000
- Institue of Microelectronics
- Uppili Sridhar
- G01 - MEASURING TESTING
Information Patent Grant
Design of a novel tactile sensor
- Patent number 6,007,728
- Issue date Dec 28, 1999
- Institute of Micoelectronics
- Lian Jun Liu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and process for bulk wet etch with leakage protection
- Publication number 20050118822
- Publication date Jun 2, 2005
- Institute of Microelectronics
- Zhe Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and process for bulk wet etch with leakage protection
- Publication number 20030160022
- Publication date Aug 28, 2003
- Institute of Microelectronics
- Zhe Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked LDD high frequency LDMOSFET
- Publication number 20030085448
- Publication date May 8, 2003
- Institute of Microelectronics
- Jun Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making an integrated circuit inductor
- Publication number 20030071325
- Publication date Apr 17, 2003
- Shuming Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reducing dishing in chemical mechanical polishing
- Publication number 20030054649
- Publication date Mar 20, 2003
- Shaoyu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for preventing photoresist poisoning in semiconductor fabric...
- Publication number 20030040174
- Publication date Feb 27, 2003
- Cher Huan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF LDMOS on partial SOI substrate
- Publication number 20020197774
- Publication date Dec 26, 2002
- Institute of Microelectronics
- Shuming Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked LDD high frequency LDMOSFET
- Publication number 20020164844
- Publication date Nov 7, 2002
- Institute of Microelectronics
- Jun Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Room temperature wafer-to-wafer bonding by polydimethylsiloxane
- Publication number 20020160582
- Publication date Oct 31, 2002
- Institute of Microelectronics
- Yu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device
- Publication number 20020017682
- Publication date Feb 14, 2002
- Shuming Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit inductor
- Publication number 20010045617
- Publication date Nov 29, 2001
- Shuming Xu
- H01 - BASIC ELECTRIC ELEMENTS

Pang Dow Foo

Person

Patents Grantslast 30 patents

Method of making an integrated circuit inductor wherein a plurality...

Apparatus and process for bulk wet etch with leakage protection

Micro-relay

Method for reducing dishing in chemical mechanical polishing

RF LDMOS on partial SOI substrate

Stacked LDD high frequency LDMOSFET

Room temperature wafer-to-wafer bonding by polydimethylsiloxane

Integrated circuit inductor

Stacked LDD high frequency LDMOSFET

RF LDMOS on partial SOI substrate

Bi-layer resist process for dual damascene

High speed, low cost BICMOS process using profile engineering

CMOS compatible integrated pressure sensor

Design of a novel tactile sensor

Patents Applicationslast 30 patents

Apparatus and process for bulk wet etch with leakage protection

Apparatus and process for bulk wet etch with leakage protection

Stacked LDD high frequency LDMOSFET

Method of making an integrated circuit inductor

Method for reducing dishing in chemical mechanical polishing

Method for preventing photoresist poisoning in semiconductor fabric...

RF LDMOS on partial SOI substrate

Stacked LDD high frequency LDMOSFET

Room temperature wafer-to-wafer bonding by polydimethylsiloxane

Semiconductor device

Integrated circuit inductor