Pao Tung PAN

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Kaohsiung City, TW

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Patents Applicationslast 30 patents

Information Patent Application
Metal Shielding on Die Level
- Publication number 20140264784
- Publication date Sep 18, 2014
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM BASED IC PACKAGING METHOD AND A PACKAGED IC DEVICE
- Publication number 20130299955
- Publication date Nov 14, 2013
- NXP B.V.
- Ching Hui Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-DIE PACKAGE AND METHOD THEREFOR
- Publication number 20130157414
- Publication date Jun 20, 2013
- NXP B.V.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-METAL STIFFENER RING FOR FCBGA
- Publication number 20120188721
- Publication date Jul 26, 2012
- NXP B.V.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS