Paolo Casati

Person

Sesto San Giovanni, IT

People

Patents Grantslast 30 patents

Information Patent Grant
Assembly structure for electronic power integrated circuit formed o...
- Patent number 7,459,771
- Issue date Dec 2, 2008
- STMicroelectronics, SRL
- Paolo Casati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated power multichip package
- Patent number 6,473,310
- Issue date Oct 29, 2002
- STMicroelectronics S.r.l.
- Paolo Casati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with metal-polymer joint of controlled...
- Patent number 6,002,173
- Issue date Dec 14, 1999
- SGS Thomson Microelectronics S.r.l.
- Paolo Casati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an electronic device structure with studs lo...
- Patent number 5,763,296
- Issue date Jun 9, 1998
- SGS Thomson Microelectronics S.r.l.
- Paolo Casati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for supporting integrated semiconductor devices
- Patent number 5,617,295
- Issue date Apr 1, 1997
- SGS-Thomson Microelectronics, S.R.L.
- Renato Poinelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination and method for coupling a heat sink to a semiconductor...
- Patent number 5,521,439
- Issue date May 28, 1996
- SGS-Microelectronics S.r.l.
- Paolo Casati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing plastic-encapsulated semiconductor devices...
- Patent number 5,445,995
- Issue date Aug 29, 1995
- SGS-Thomson Microelectronics, S.r.l.
- Paolo Casati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for assembling and resin-encapsulating a heat sink-mounte...
- Patent number 5,370,517
- Issue date Dec 6, 1994
- SGS Thomson Microelectronics S.r.l.
- Paolo Casati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular power circuit assembly
- Patent number 5,353,194
- Issue date Oct 4, 1994
- SGS-Thomson Microelectronics S.r.L.
- Giuseppe Libretti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device structure with studs locating lead frame on backi...
- Patent number 5,338,971
- Issue date Aug 16, 1994
- SGS-Thomson Microelectronics, S.r.l.
- Paolo Casati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for assembling and resin-encapsulating a heat...
- Patent number 5,244,838
- Issue date Sep 14, 1993
- SGS-Thomson Microelectronics S.r.L.
- Paolo Casati
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230042407
- Publication date Feb 9, 2023
- STMicroelectronics S.r.l
- Paolo CASATI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES, AND CORRESPONDING D...
- Publication number 20180053709
- Publication date Feb 22, 2018
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-frame for electonic devices with extruded pads
- Publication number 20050189625
- Publication date Sep 1, 2005
- Claudio Deodato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly structure for electronic power integrated circuit formed o...
- Publication number 20030209783
- Publication date Nov 13, 2003
- STMicroelectronics S.r.I.
- Paolo Casati
- H01 - BASIC ELECTRIC ELEMENTS

Paolo Casati

Person

Patents Grantslast 30 patents

Assembly structure for electronic power integrated circuit formed o...

Insulated power multichip package

Semiconductor device package with metal-polymer joint of controlled...

Method for fabricating an electronic device structure with studs lo...

Leadframe for supporting integrated semiconductor devices

Combination and method for coupling a heat sink to a semiconductor...

Method for manufacturing plastic-encapsulated semiconductor devices...

Apparatus for assembling and resin-encapsulating a heat sink-mounte...

Modular power circuit assembly

Electronic device structure with studs locating lead frame on backi...

Process and apparatus for assembling and resin-encapsulating a heat...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES, AND CORRESPONDING D...

Lead-frame for electonic devices with extruded pads

Assembly structure for electronic power integrated circuit formed o...