Partha Mukhopadhyay

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vertical transistor structures and methods utilizing selective form...
- Patent number 12,218,244
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Mark I. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of high density 3D circuits with enhanced 3D conductivity
- Patent number 12,191,210
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D nano sheet method using 2D material integrated with conductive o...
- Patent number 12,176,249
- Issue date Dec 24, 2024
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D memory with conductive dielectric channel integrated with logic...
- Patent number 12,133,387
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Mark I. Gardner
Information Patent Grant
Ultra dense 3D routing for compact 3D designs
- Patent number 12,131,956
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making of plurality of 3D vertical logic elements integra...
- Patent number 12,114,480
- Issue date Oct 8, 2024
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D high density compact metal first approach for hybrid transistor...
- Patent number 12,068,205
- Issue date Aug 20, 2024
- Tokyo Electron Limited
- Mark I. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked DRAM with 3D vertical circuit design
- Patent number 12,009,355
- Issue date Jun 11, 2024
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device with self-aligned vertical interconnection
- Patent number 11,830,876
- Issue date Nov 28, 2023
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D device layout and method using advanced 3D isolation
- Patent number 11,756,836
- Issue date Sep 12, 2023
- Tokyo Electron Limited
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FORMATION OF HIGH DENSITY 3D CIRCUITS WITH ENHANCED 3D CONDUCTIVITY
- Publication number 20250120163
- Publication date Apr 10, 2025
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
Information Patent Application
NANOSHEET 3D TRANSISTOR FOR ADVANCED MEMORY ELEMENTS
- Publication number 20250098174
- Publication date Mar 20, 2025
- TOKYO ELECTRON LIMITED
- Partha MUKHOPADHYAY
Information Patent Application
CIRCUIT DESIGN MODELING FOR BONDING INTEGRATED CIRCUITS
- Publication number 20250068823
- Publication date Feb 27, 2025
- TOKYO ELECTRON LIMITED
- Henry Jim Fulford
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES WITH VERTICAL TRANSISTORS AND FERROELECTRIC C...
- Publication number 20250056810
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Henry Jim FULFORD
Information Patent Application
FORKSHEET SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20250031400
- Publication date Jan 23, 2025
- TOKYO ELECTRON LIMITED
- Mark I. GARDNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES
- Publication number 20250015045
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D U-SHAPED NANOSHEET DEVICE
- Publication number 20240282771
- Publication date Aug 22, 2024
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD OF FORMING 3D U-SHAPED NANOSHEET CFET
- Publication number 20240249978
- Publication date Jul 25, 2024
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240145576
- Publication date May 2, 2024
- TOKYO ELECTRON LIMITED
- Mark I. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120407
- Publication date Apr 11, 2024
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D DESIGN WITH METHOD OF INTEGRATION OF HIGH PERFORMANCE TRANSISTO...
- Publication number 20230378364
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSISTORS AND METHODS FOR FORMING THE SAME
- Publication number 20230378366
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSISTORS AND METHODS FOR FORMING THE SAME
- Publication number 20230369505
- Publication date Nov 16, 2023
- TOKYO ELECTRON LIMITED
- Mark I. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230352581
- Publication date Nov 2, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D HYBRID MEMORY USING HORIZONTALLY ORIENTED CONDUCTIVE DIELECTRIC...
- Publication number 20230337435
- Publication date Oct 19, 2023
- TOKYO ELECTRON LIMITED
- Mark I. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PLURALITY OF N HORIZONTAL MEMORY CELLS WITH ENHAN...
- Publication number 20230320069
- Publication date Oct 5, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING 3D MEMORY STACKING FORMATION WITH HIGH CIRCUIT DEN...
- Publication number 20230301061
- Publication date Sep 21, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON NANO SHEET THREE-DIMENSIONAL HORIZONTAL MEMORY WITH ALL-ARO...
- Publication number 20230301059
- Publication date Sep 21, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SILICON NANOSHEET MEMORY WITH METAL CAPACITOR
- Publication number 20230301060
- Publication date Sep 21, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D HORIZONTAL MEMORY CELL WITH SEQUENTIAL 3D VERTICAL STACKING
- Publication number 20230301062
- Publication date Sep 21, 2023
- TOKYO ELECTRON LIMITED
- Mark I. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ADVANCED TRANSISTOR ARCHITECTURE INTEGRATED WITH SOURCE/DRAIN SP...
- Publication number 20230261041
- Publication date Aug 17, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D UFET DEVICE FOR ADVANCED 3D INTEGRATION
- Publication number 20230261113
- Publication date Aug 17, 2023
- TOKYO ELECTRON LIMITED
- Mark I. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON NANOSHEET AND 2D PARALLEL CHANNEL VERTICAL FET DESIGN WITH...
- Publication number 20230261067
- Publication date Aug 17, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SINGLE CRYSTAL SILICON NANO SHEETS INTEGRATED WITH 2D MATERIAL C...
- Publication number 20230260851
- Publication date Aug 17, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NANO SHEET METHOD USING 2D MATERIAL INTEGRATED WITH CONDUCTIVE O...
- Publication number 20230253261
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SEMICONDUCTOR 3D HORIZONTAL NANO SHEET WITH HIGH MOBILITY...
- Publication number 20230253452
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Mark I. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED 3D DEVICE ARCHITECTURE USING NANOSHEETS WITH 2D MATERIALS...
- Publication number 20230253484
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED DRAM WITH 3D VERTICAL CIRCUIT DESIGN
- Publication number 20230225109
- Publication date Jul 13, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D VERTICAL NANO SHEET TRANSISTOR DESIGN USING SEMICONDUCTIVE OXIDE...
- Publication number 20230207624
- Publication date Jun 29, 2023
- TOKYO ELECTRON LIMITED
- Mark I. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-DENSE THREE-DIMENSIONAL TRANSISTOR DESIGN
- Publication number 20230207667
- Publication date Jun 29, 2023
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS

Partha Mukhopadhyay

Person

Patents Grantslast 30 patents

Vertical transistor structures and methods utilizing selective form...

Formation of high density 3D circuits with enhanced 3D conductivity

3D nano sheet method using 2D material integrated with conductive o...

3D memory with conductive dielectric channel integrated with logic...

Ultra dense 3D routing for compact 3D designs

Method of making of plurality of 3D vertical logic elements integra...

3D high density compact metal first approach for hybrid transistor...

3D stacked DRAM with 3D vertical circuit design

Three-dimensional device with self-aligned vertical interconnection

3D device layout and method using advanced 3D isolation

Patents Applicationslast 30 patents

FORMATION OF HIGH DENSITY 3D CIRCUITS WITH ENHANCED 3D CONDUCTIVITY

NANOSHEET 3D TRANSISTOR FOR ADVANCED MEMORY ELEMENTS

CIRCUIT DESIGN MODELING FOR BONDING INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICES WITH VERTICAL TRANSISTORS AND FERROELECTRIC C...

FORKSHEET SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES

3D U-SHAPED NANOSHEET DEVICE

DEVICE AND METHOD OF FORMING 3D U-SHAPED NANOSHEET CFET

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

3D DESIGN WITH METHOD OF INTEGRATION OF HIGH PERFORMANCE TRANSISTO...

VERTICAL TRANSISTORS AND METHODS FOR FORMING THE SAME

VERTICAL TRANSISTORS AND METHODS FOR FORMING THE SAME

THREE-DIMENSIONAL DEVICE AND METHOD OF FORMING THE SAME

3D HYBRID MEMORY USING HORIZONTALLY ORIENTED CONDUCTIVE DIELECTRIC...

THREE-DIMENSIONAL PLURALITY OF N HORIZONTAL MEMORY CELLS WITH ENHAN...

METHOD OF MAKING 3D MEMORY STACKING FORMATION WITH HIGH CIRCUIT DEN...

SILICON NANO SHEET THREE-DIMENSIONAL HORIZONTAL MEMORY WITH ALL-ARO...

THREE-DIMENSIONAL SILICON NANOSHEET MEMORY WITH METAL CAPACITOR

3D HORIZONTAL MEMORY CELL WITH SEQUENTIAL 3D VERTICAL STACKING

3D ADVANCED TRANSISTOR ARCHITECTURE INTEGRATED WITH SOURCE/DRAIN SP...

3D UFET DEVICE FOR ADVANCED 3D INTEGRATION

SILICON NANOSHEET AND 2D PARALLEL CHANNEL VERTICAL FET DESIGN WITH...

3D SINGLE CRYSTAL SILICON NANO SHEETS INTEGRATED WITH 2D MATERIAL C...

3D NANO SHEET METHOD USING 2D MATERIAL INTEGRATED WITH CONDUCTIVE O...

EPITAXIAL SEMICONDUCTOR 3D HORIZONTAL NANO SHEET WITH HIGH MOBILITY...

ADVANCED 3D DEVICE ARCHITECTURE USING NANOSHEETS WITH 2D MATERIALS...

3D STACKED DRAM WITH 3D VERTICAL CIRCUIT DESIGN

3D VERTICAL NANO SHEET TRANSISTOR DESIGN USING SEMICONDUCTIVE OXIDE...

ULTRA-DENSE THREE-DIMENSIONAL TRANSISTOR DESIGN