Patricia A. Brusso

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Underfill device and method
- Patent number 9,516,752
- Issue date Dec 6, 2016
- Intel Corporation
- Patricia A Brusso
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Underfill device and method
- Patent number 8,399,291
- Issue date Mar 19, 2013
- Intel Corporation
- Patricia A Brusso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible core for enhancement of package interconnect reliability
- Patent number 7,633,142
- Issue date Dec 15, 2009
- Intel Corporation
- Mitul B. Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible core for enhancement of package interconnect reliability
- Patent number 7,352,061
- Issue date Apr 1, 2008
- Intel Corporation
- Mitul B. Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
UNDERFILL DEVICE AND METHOD
- Publication number 20130208411
- Publication date Aug 15, 2013
- Patricia A. Brusso
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECT USING LIQUID METAL
- Publication number 20090001576
- Publication date Jan 1, 2009
- Surinder Tuli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACK UP PCB SUBSTRATE FOR HIGH DENSITY INTERCONNECT PACKAGES
- Publication number 20080150132
- Publication date Jun 26, 2008
- Tom Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible core for enhancement of package interconnect reliablity
- Publication number 20080057630
- Publication date Mar 6, 2008
- Mitul B. Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible core for enhancement of package interconnect reliability
- Publication number 20080054446
- Publication date Mar 6, 2008
- Mitul B. Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package connected to a substrate
- Publication number 20070002549
- Publication date Jan 4, 2007
- Patricia A. Brusso
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Underfill device and method
- Publication number 20070004085
- Publication date Jan 4, 2007
- Patricia A. Brusso
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Flexible core for enhancement of package interconnect reliability
- Publication number 20060261464
- Publication date Nov 23, 2006
- Intel Corporation
- Mitul B. Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patricia A. Brusso

Person

Patents Grantslast 30 patents

Underfill device and method

Underfill device and method

Flexible core for enhancement of package interconnect reliability

Flexible core for enhancement of package interconnect reliability

Patents Applicationslast 30 patents

UNDERFILL DEVICE AND METHOD

INTERCONNECT USING LIQUID METAL

STACK UP PCB SUBSTRATE FOR HIGH DENSITY INTERCONNECT PACKAGES

Flexible core for enhancement of package interconnect reliablity

Flexible core for enhancement of package interconnect reliability

Electronic package connected to a substrate

Underfill device and method

Flexible core for enhancement of package interconnect reliability