Patricia B. Smith

Person

Grapevine, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
N2 based plasma treatment for enhanced sidewall smoothing and pore...
- Patent number 7,910,936
- Issue date Mar 22, 2011
- Texas Instruments Incorporated
- Sameer Kumar Ajmera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
N2 based plasma treatment for enhanced sidewall smoothing and pore...
- Patent number 7,476,602
- Issue date Jan 13, 2009
- Texas Instruments Incorporated
- Sameer Kumar Ajmera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrogen and oxygen based photoresist removal process
- Patent number 7,413,994
- Issue date Aug 19, 2008
- Texas Instruments Incorporated
- Patricia Beauregard Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface preparation method for selective and non-selective epitaxia...
- Patent number 7,344,951
- Issue date Mar 18, 2008
- Texas Instruments Incorporated
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for defect reduction in electrochemical plating
- Patent number 7,253,124
- Issue date Aug 7, 2007
- Texas Instruments Incorporated
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrogen plasma photoresist strip and polymeric residue cleanup pro...
- Patent number 7,232,768
- Issue date Jun 19, 2007
- Texas Instruments Incorporated
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrogen plasma photoresist strip and polymeric residue cleanup pro...
- Patent number 7,179,751
- Issue date Feb 20, 2007
- Texas Instruments Incorporated
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing such semiconduct...
- Patent number 7,101,788
- Issue date Sep 5, 2006
- Texas Instruments Incorporated
- Patricia Beauregard Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damage-free resist removal process for ultra-low-k processing
- Patent number 7,067,441
- Issue date Jun 27, 2006
- Texas Instruments Incorporated
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrogen plasma photoresist strip and polymeric residue cleanup pro...
- Patent number 7,001,848
- Issue date Feb 21, 2006
- Texas Instruments Incorporated
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrogen plasma photoresist strip and polymeric residue cleanup pro...
- Patent number 6,967,173
- Issue date Nov 22, 2005
- Texas Instruments Incorporated
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for photoresist strip, sidewall polymer removal and passivat...
- Patent number 6,958,294
- Issue date Oct 25, 2005
- Texas Instruments Incorporated
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical treatment of low-k dielectric films
- Patent number 6,838,300
- Issue date Jan 4, 2005
- Texas Instruments Incorporated
- Changming Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry process for post oxide etch residue removal
- Patent number 6,727,185
- Issue date Apr 27, 2004
- Texas Instruments Incorporated
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for polymer removal following etch-stop layer etch
- Patent number 6,713,402
- Issue date Mar 30, 2004
- Texas Instruments Incorporated
- Patricia Beauregard Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for photoresist strip, sidewall polymer removal and passivat...
- Patent number 6,599,829
- Issue date Jul 29, 2003
- Texas Instruments Incorporated
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma process for organic residue removal from copper
- Patent number 6,342,446
- Issue date Jan 29, 2002
- Texas Instruments Incorporated
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxygen-free, dry plasma process for polymer removal
- Patent number 6,277,733
- Issue date Aug 21, 2001
- Texas Instruments Incorporated
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hydrogen passivation of chemical-mechanically polished copper-conta...
- Patent number 6,251,771
- Issue date Jun 26, 2001
- Texas Instruments Incorporated
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for via formation and type conversion in group II and group...
- Patent number 5,318,666
- Issue date Jun 7, 1994
- Texas Instruments Incorporated
- Jerome L. Elkind
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dry etching openings in integrated circuit layers
- Patent number 5,157,000
- Issue date Oct 20, 1992
- Texas Instruments Incorporated
- Jerome L. Elkind
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for deposition of zinc sulfide films
- Patent number 5,077,092
- Issue date Dec 31, 1991
- Texas Instruments Incorporated
- Patricia B. Smith
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for dry etching vias in integrated circuit layers
- Patent number 5,017,511
- Issue date May 21, 1991
- Texas Instruments Incorporated
- Jerome L. Elkind
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for deposition of silicon oxide on a wafer
- Patent number 4,988,533
- Issue date Jan 29, 1991
- Texas Instruments Incorporated
- Dean W. Freeman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of sequential cleaning and passivating a GaAs substrate usin...
- Patent number 4,877,757
- Issue date Oct 31, 1989
- Texas Instruments Incorporated
- Rudy L. York
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for passivating wafer
- Patent number 4,855,160
- Issue date Aug 8, 1989
- Texas Instruments Incorporated
- Joseph D. Luttmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching films of mercury-cadmium-telluride and zinc sulfid
- Patent number 4,838,984
- Issue date Jun 13, 1989
- Texas Instruments Incorporated
- Joseph D. Luttmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing compound from group II-VI
- Patent number 4,837,113
- Issue date Jun 6, 1989
- Texas Instruments Incorporated
- Joseph D. Luttmer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
N2 BASED PLASMA TREATMENT FOR ENHANCED SIDEWALL SMOOTHING AND PORE...
- Publication number 20090115030
- Publication date May 7, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Sameer Kumar Ajmera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for removing residue containing an embedded metal
- Publication number 20070184666
- Publication date Aug 9, 2007
- Texas Instruments Inc.
- Patricia Beauregard Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROGEN PLASMA PHOTORESIST STRIP AND POLYMERIC RESIDUE CLEANUP PRO...
- Publication number 20070117341
- Publication date May 24, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Patricia B. Smith
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Hydrogen and oxygen based photoresist removal process
- Publication number 20060281312
- Publication date Dec 14, 2006
- Texas Instruments, Incorporated
- Patricia Beauregard Smith
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
N2 based plasma treatment for enhanced sidewall smoothing and pore...
- Publication number 20060172552
- Publication date Aug 3, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Sameer Kumar Ajmera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface preparation method for selective and non-selective epitaxia...
- Publication number 20060057810
- Publication date Mar 16, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hydrogen plasma photoresist strip and polymeric residue cleanup pro...
- Publication number 20050215050
- Publication date Sep 29, 2005
- Patricia B. Smith
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Damage-free resist removal process for ultra-low-k processing
- Publication number 20050101125
- Publication date May 12, 2005
- Patricia B. Smith
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Post-etch clean process for porous low dielectric constant materials
- Publication number 20050045206
- Publication date Mar 3, 2005
- Patricia Beauregard Smith
- B08 - CLEANING
Information Patent Application
Waferlevel method for direct bumping on copper pads in integrated c...
- Publication number 20040157450
- Publication date Aug 12, 2004
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hexamethyldisilazane treatment of low-k dielectric films
- Publication number 20040152296
- Publication date Aug 5, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Phillip D. Matz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical treatment of low-k dielectric films
- Publication number 20040150012
- Publication date Aug 5, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Changming Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for polymer removal following etch-stop layer etch
- Publication number 20030224595
- Publication date Dec 4, 2003
- Patricia Beauregard Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for photoresist strip, sidewall polymer removal and passivat...
- Publication number 20030207563
- Publication date Nov 6, 2003
- Patricia B. Smith
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for photoresist strip, sidewall polymer removal and passivat...
- Publication number 20030203642
- Publication date Oct 30, 2003
- Patricia B. Smith
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Semiconductor devices and methods of manufacturing such semiconduct...
- Publication number 20030162384
- Publication date Aug 28, 2003
- Patricia Beauregard Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Waferlevel method for direct bumping on copper pads in integrated c...
- Publication number 20030116845
- Publication date Jun 26, 2003
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for photoresist strip, sidewall polymer removal and passivat...
- Publication number 20020127840
- Publication date Sep 12, 2002
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for defect reduction in electrochemical plating
- Publication number 20020076929
- Publication date Jun 20, 2002
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hydrogen plasma photoresist strip and polymeric residue cleanup pro...
- Publication number 20020058397
- Publication date May 16, 2002
- Patricia B. Smith
- H01 - BASIC ELECTRIC ELEMENTS

Patricia B. Smith

Person

Patents Grantslast 30 patents

N2 based plasma treatment for enhanced sidewall smoothing and pore...

N2 based plasma treatment for enhanced sidewall smoothing and pore...

Hydrogen and oxygen based photoresist removal process

Surface preparation method for selective and non-selective epitaxia...

Process for defect reduction in electrochemical plating

Hydrogen plasma photoresist strip and polymeric residue cleanup pro...

Hydrogen plasma photoresist strip and polymeric residue cleanup pro...

Semiconductor devices and methods of manufacturing such semiconduct...

Damage-free resist removal process for ultra-low-k processing

Hydrogen plasma photoresist strip and polymeric residue cleanup pro...

Hydrogen plasma photoresist strip and polymeric residue cleanup pro...

Method for photoresist strip, sidewall polymer removal and passivat...

Chemical treatment of low-k dielectric films

Dry process for post oxide etch residue removal

Methods for polymer removal following etch-stop layer etch

Method for photoresist strip, sidewall polymer removal and passivat...

Plasma process for organic residue removal from copper

Oxygen-free, dry plasma process for polymer removal

Hydrogen passivation of chemical-mechanically polished copper-conta...

Method for via formation and type conversion in group II and group...

Method for dry etching openings in integrated circuit layers

Method and apparatus for deposition of zinc sulfide films

Method for dry etching vias in integrated circuit layers

Method for deposition of silicon oxide on a wafer

Method of sequential cleaning and passivating a GaAs substrate usin...

Method for passivating wafer

Method for etching films of mercury-cadmium-telluride and zinc sulfid

Method for depositing compound from group II-VI

Patents Applicationslast 30 patents

N2 BASED PLASMA TREATMENT FOR ENHANCED SIDEWALL SMOOTHING AND PORE...

Method for removing residue containing an embedded metal

HYDROGEN PLASMA PHOTORESIST STRIP AND POLYMERIC RESIDUE CLEANUP PRO...

Hydrogen and oxygen based photoresist removal process

N2 based plasma treatment for enhanced sidewall smoothing and pore...

Surface preparation method for selective and non-selective epitaxia...

Hydrogen plasma photoresist strip and polymeric residue cleanup pro...

Damage-free resist removal process for ultra-low-k processing

Post-etch clean process for porous low dielectric constant materials

Waferlevel method for direct bumping on copper pads in integrated c...

Hexamethyldisilazane treatment of low-k dielectric films

Chemical treatment of low-k dielectric films

Methods for polymer removal following etch-stop layer etch

Method for photoresist strip, sidewall polymer removal and passivat...

Method for photoresist strip, sidewall polymer removal and passivat...

Semiconductor devices and methods of manufacturing such semiconduct...

Waferlevel method for direct bumping on copper pads in integrated c...

Method for photoresist strip, sidewall polymer removal and passivat...

Process for defect reduction in electrochemical plating

Hydrogen plasma photoresist strip and polymeric residue cleanup pro...