Patrick THEOFANIS

Person

Pasadena, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
EUV patterning methods, structures, and materials
- Patent number 11,984,317
- Issue date May 14, 2024
- Intel Corporation
- Marie Krysak
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Chain scission resist compositions for EUV lithography applications
- Patent number 11,262,654
- Issue date Mar 1, 2022
- Intel Corporation
- Lauren Doyle
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Vertical interconnect methods for stacked device architectures usin...
- Patent number 11,011,537
- Issue date May 18, 2021
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked devices with self-aligned regions formed by dire...
- Patent number 10,991,696
- Issue date Apr 27, 2021
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic nanomechanical devices for stiction compensation
- Patent number 9,926,193
- Issue date Mar 27, 2018
- Intel Corporation
- Jorge A. Munoz
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
THIN FILM TRANSISTORS HAVING A SPIN-ON 2D CHANNEL MATERIAL
- Publication number 20230098467
- Publication date Mar 30, 2023
- Intel Corporation
- Carl H. NAYLOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS WITH MONOCRYSTALLINE METAL CHALCOGENIDE CHANNEL MATERIALS
- Publication number 20220199812
- Publication date Jun 23, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EUV PATTERNING METHODS, STRUCTURES, AND MATERIALS
- Publication number 20210375616
- Publication date Dec 2, 2021
- Intel Corporation
- Marie Krysak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAIN SCISSION RESIST COMPOSITIONS FOR EUV LITHOGRAPHY APPLICATIONS
- Publication number 20210200085
- Publication date Jul 1, 2021
- Intel Corporation
- Lauren Doyle
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIRECT SELF ASSEMBLY (DSA) PROCESSING OF VERTICALLY STACKED DEVICES...
- Publication number 20190341384
- Publication date Nov 7, 2019
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL INTERCONNECT METHODS FOR STACKED DEVICE ARCHITECTURES USIN...
- Publication number 20190221577
- Publication date Jul 18, 2019
- Intel Corporation
- Aaron D. LILAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC NANOMECHANICAL DEVICES FOR STICTION COMPENSATION
- Publication number 20170158501
- Publication date Jun 8, 2017
- Intel Corporation
- Jorge A. MUNOZ
- B82 - NANO-TECHNOLOGY

Patrick THEOFANIS

Person

Patents Grantslast 30 patents

EUV patterning methods, structures, and materials

Chain scission resist compositions for EUV lithography applications

Vertical interconnect methods for stacked device architectures usin...

Vertically stacked devices with self-aligned regions formed by dire...

Magnetic nanomechanical devices for stiction compensation

Patents Applicationslast 30 patents

THIN FILM TRANSISTORS HAVING A SPIN-ON 2D CHANNEL MATERIAL

TRANSISTORS WITH MONOCRYSTALLINE METAL CHALCOGENIDE CHANNEL MATERIALS

EUV PATTERNING METHODS, STRUCTURES, AND MATERIALS

CHAIN SCISSION RESIST COMPOSITIONS FOR EUV LITHOGRAPHY APPLICATIONS

DIRECT SELF ASSEMBLY (DSA) PROCESSING OF VERTICALLY STACKED DEVICES...

VERTICAL INTERCONNECT METHODS FOR STACKED DEVICE ARCHITECTURES USIN...

MAGNETIC NANOMECHANICAL DEVICES FOR STICTION COMPENSATION