Patrick Thompson

Person

Wylie, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
IC package with heat spreader
- Patent number 12,009,280
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with metal stop ring outside the scribe seal
- Patent number 12,009,319
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 11,942,386
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packages with visible solder fillets
- Patent number 11,855,024
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Qiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated semiconductor dies
- Patent number 11,837,518
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect for electronic device
- Patent number 11,616,038
- Issue date Mar 28, 2023
- Texas Instruments Incorporated
- Patrick Francis Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including undermounted die with exposed backs...
- Patent number 11,562,949
- Issue date Jan 24, 2023
- Texas Instruments Incorporated
- Patrick Francis Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brass-coated metals in flip-chip redistribution layers
- Patent number 11,410,947
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect for electronic device
- Patent number 10,833,036
- Issue date Nov 10, 2020
- Texas Instruments Incorporated
- Patrick Francis Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device having electromigration resistant feed line structures
- Patent number 8,531,030
- Issue date Sep 10, 2013
- Texas Instruments Incorporated
- Gregory Eric Howard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH A REINFORCING LAYER
- Publication number 20240395731
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH HEAT SPREADER
- Publication number 20240332119
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20240234231
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED SEMICONDUCTOR DIES
- Publication number 20240055313
- Publication date Feb 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd WYANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT FLIP CHIP SEMICONDUCTOR PACKAGE
- Publication number 20230317673
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH HEAT SPREADER
- Publication number 20230187306
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHIP SCALE PACKAGES WITH VISIBLE SOLDER FILLETS
- Publication number 20230065075
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Qiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20220384375
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED SEMICONDUCTOR DIES
- Publication number 20220068744
- Publication date Mar 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd WYANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20220059423
- Publication date Feb 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERMOUNTED DIE WITH EXPOSED BACKS...
- Publication number 20210398882
- Publication date Dec 23, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Patrick Francis Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH METAL STOP RING OUTSIDE THE SCRIBE SEAL
- Publication number 20210210440
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE WITH REDISTRIBUTION LAYER INTERRUPTS
- Publication number 20210210462
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20210193600
- Publication date Jun 24, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT FOR ELECTRONIC DEVICE
- Publication number 20210066229
- Publication date Mar 4, 2021
- TEXAS INSTRUMENTS INCORPORATED
- PATRICK FRANCIS THOMPSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT FOR ELECTRONIC DEVICE
- Publication number 20200211992
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- PATRICK FRANCIS THOMPSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WIRE BONDING AND METHOD
- Publication number 20160379953
- Publication date Dec 29, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Patrick Francis Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DEVICE HAVING ELECTROMIGRATION RESISTANT FEED LINE STRUCTURES
- Publication number 20120153458
- Publication date Jun 21, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Gregory Eric Howard
- H01 - BASIC ELECTRIC ELEMENTS

Patrick Thompson

Person

Patents Grantslast 30 patents

IC package with heat spreader

Integrated circuit with metal stop ring outside the scribe seal

Method of forming brass-coated metals in flip-chip redistribution l...

Electronic devices in semiconductor package cavities

Wafer chip scale packages with visible solder fillets

Coated semiconductor dies

Interconnect for electronic device

Semiconductor package including undermounted die with exposed backs...

Brass-coated metals in flip-chip redistribution layers

Interconnect for electronic device

IC device having electromigration resistant feed line structures

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH A REINFORCING LAYER

IC PACKAGE WITH HEAT SPREADER

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

COATED SEMICONDUCTOR DIES

FAN OUT FLIP CHIP SEMICONDUCTOR PACKAGE

IC PACKAGE WITH HEAT SPREADER

WAFER CHIP SCALE PACKAGES WITH VISIBLE SOLDER FILLETS

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

COATED SEMICONDUCTOR DIES

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

SEMICONDUCTOR PACKAGE INCLUDING UNDERMOUNTED DIE WITH EXPOSED BACKS...

INTEGRATED CIRCUIT WITH METAL STOP RING OUTSIDE THE SCRIBE SEAL

CHIP SCALE PACKAGE WITH REDISTRIBUTION LAYER INTERRUPTS

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

INTERCONNECT FOR ELECTRONIC DEVICE

INTERCONNECT FOR ELECTRONIC DEVICE

SEMICONDUCTOR WIRE BONDING AND METHOD

IC DEVICE HAVING ELECTROMIGRATION RESISTANT FEED LINE STRUCTURES