Patrick W. Dehaven

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Automatic capacitance tuning for robust middle of the line contact...
- Patent number 9,224,675
- Issue date Dec 29, 2015
- International Business Machines Corporation
- Patrick W. DeHaven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature melt-processing of organic-inorganic hybrid
- Patent number 8,574,953
- Issue date Nov 5, 2013
- International Business Machines Corporation
- Patrick W. DeHaven
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Low temperature melt-processing of organic-inorganic hybrid
- Patent number 8,123,997
- Issue date Feb 28, 2012
- International Business Machines Corporation
- Patrick W Dehaven
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Copper interconnect structure with amorphous tantalum iridium diffu...
- Patent number 7,951,708
- Issue date May 31, 2011
- International Business Machines Corporation
- Patrick W. DeHaven
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Low temperature melt-processing of organic-inorganic hybrid
- Patent number 7,456,045
- Issue date Nov 25, 2008
- International Business Machines Corporation
- Patrick W Dehaven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contact structure and fabrication thereof
- Patent number 7,407,875
- Issue date Aug 5, 2008
- International Business Machines Corporation
- Keith Kwong Hon Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature melt-processing of organic-inorganic hybrid
- Patent number 7,291,516
- Issue date Nov 6, 2007
- International Business Machines Corporation
- Patrick W Dehaven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming low resistance and reliable via in inter-level di...
- Patent number 7,223,691
- Issue date May 29, 2007
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature melt-processing of organic-inorganic hybrid
- Patent number 7,105,360
- Issue date Sep 12, 2006
- International Business Machines Corporation
- Patrick W Dehaven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Salicide formation method
- Patent number 6,916,729
- Issue date Jul 12, 2005
- Infineon Technologies AG
- Sunfei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for thin film thickness mapping
- Patent number 6,909,772
- Issue date Jun 21, 2005
- Hypernex, Inc.
- Krzysztof J. Kozaczek
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for thin film thickness mapping
- Patent number 6,792,075
- Issue date Sep 14, 2004
- Hypernex, Inc.
- Krzysztof J. Kozaczek
- G01 - MEASURING TESTING
Information Patent Grant
Device produced by a process of controlling grain growth in metal f...
- Patent number 6,638,374
- Issue date Oct 28, 2003
- International Business Machines Corporation
- Patrick W. DeHaven
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromigration-resistant copper microstructure
- Patent number 6,572,982
- Issue date Jun 3, 2003
- International Business Machines Corporation
- Cyprian E. Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a contact barrier
- Patent number 6,509,265
- Issue date Jan 21, 2003
- International Business Machines Corporation
- Patrick W. DeHaven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film metal barrier for electrical interconnections
- Patent number 6,437,440
- Issue date Aug 20, 2002
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of controlling grain growth in metal films
- Patent number 6,361,627
- Issue date Mar 26, 2002
- International Business Machines Corporation
- Patrick W. DeHaven
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for controlling the texture and microstructure of plated cop...
- Patent number 6,333,120
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Patrick William DeHaven
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Thin metal barrier for electrical interconnections
- Patent number 6,291,885
- Issue date Sep 18, 2001
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a contact barrier
- Patent number 6,180,521
- Issue date Jan 30, 2001
- International Business Machines Corporation
- Patrick W. DeHaven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of controlling grain growth in metal films
- Patent number 6,126,761
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Patrick W. DeHaven
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electromigration-resistant copper microstructure and process of making
- Patent number 6,123,825
- Issue date Sep 26, 2000
- International Business Machines Corporation
- Cyprian E. Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for fabricating a metallization structure
- Patent number 5,943,601
- Issue date Aug 24, 1999
- International Business Machines Corporation
- Takamasa Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered intermetallic connection for semiconductor devices
- Patent number 5,171,642
- Issue date Dec 15, 1992
- International Business Machines Corporation
- Patrick W. DeHaven
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE MELT-PROCESSING OF ORGANIC-INORGANIC HYBRID
- Publication number 20120126216
- Publication date May 24, 2012
- International Business Machines Corporation
- Patrick W. DeHaven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE WITH AMORPHOUS TANTALUM IRIDIUM DIFFU...
- Publication number 20100311236
- Publication date Dec 9, 2010
- International Business Machines Corporation
- Patrick W. DeHaven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE MELT-PROCESSING OF ORGANIC-INORGANIC HYBRID
- Publication number 20080292825
- Publication date Nov 27, 2008
- International Business Machines Corporation
- Patrick W. DeHaven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE CONTACT STRUCTURE AND FABRICATION THEREOF
- Publication number 20080054326
- Publication date Mar 6, 2008
- International Business Machines Corporation
- Keith Kwong Hon Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low temperature melt-processing of organic-inorganic hybrid
- Publication number 20060270100
- Publication date Nov 30, 2006
- International Business Machines Corporation
- Patrick W. Dehaven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low temperature melt-processing of organic-inorganic hybrid
- Publication number 20060234480
- Publication date Oct 19, 2006
- International Business Machines Corporation
- Patrick W. Dehaven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming low resistance and reliable via in inter-level di...
- Publication number 20060084256
- Publication date Apr 20, 2006
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Salicide formation method
- Publication number 20040203229
- Publication date Oct 14, 2004
- Sunfei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for thin film thickness mapping
- Publication number 20040170249
- Publication date Sep 2, 2004
- Krzysztof J. Kozaczek
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR THIN FILM THICKNESS MAPPING
- Publication number 20040047447
- Publication date Mar 11, 2004
- Krzysztof J. Kozaczek
- G01 - MEASURING TESTING
Information Patent Application
Low temperature melt-processing of organic-inorganic hybrid
- Publication number 20030170918
- Publication date Sep 11, 2003
- International Business Machines Corporation
- Patrick W. Dehaven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device produced by a process of controlling grain growth in metal f...
- Publication number 20020129879
- Publication date Sep 19, 2002
- Patrick W. DeHaven
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Thin film metal barrier for electrical interconnections
- Publication number 20020046874
- Publication date Apr 25, 2002
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS

Patrick W. Dehaven

Person

Patents Grantslast 30 patents

Automatic capacitance tuning for robust middle of the line contact...

Low temperature melt-processing of organic-inorganic hybrid

Low temperature melt-processing of organic-inorganic hybrid

Copper interconnect structure with amorphous tantalum iridium diffu...

Low temperature melt-processing of organic-inorganic hybrid

Low resistance contact structure and fabrication thereof

Low temperature melt-processing of organic-inorganic hybrid

Method of forming low resistance and reliable via in inter-level di...

Low temperature melt-processing of organic-inorganic hybrid

Salicide formation method

Method and apparatus for thin film thickness mapping

Method and apparatus for thin film thickness mapping

Device produced by a process of controlling grain growth in metal f...

Electromigration-resistant copper microstructure

Process for manufacturing a contact barrier

Thin film metal barrier for electrical interconnections

Process of controlling grain growth in metal films

Method for controlling the texture and microstructure of plated cop...

Thin metal barrier for electrical interconnections

Process for manufacturing a contact barrier

Process of controlling grain growth in metal films

Electromigration-resistant copper microstructure and process of making

Process for fabricating a metallization structure

Multilayered intermetallic connection for semiconductor devices

Patents Applicationslast 30 patents

LOW TEMPERATURE MELT-PROCESSING OF ORGANIC-INORGANIC HYBRID

COPPER INTERCONNECT STRUCTURE WITH AMORPHOUS TANTALUM IRIDIUM DIFFU...

LOW TEMPERATURE MELT-PROCESSING OF ORGANIC-INORGANIC HYBRID

LOW RESISTANCE CONTACT STRUCTURE AND FABRICATION THEREOF

Low temperature melt-processing of organic-inorganic hybrid

Low temperature melt-processing of organic-inorganic hybrid

Method of forming low resistance and reliable via in inter-level di...

Salicide formation method

Method and apparatus for thin film thickness mapping

METHOD AND APPARATUS FOR THIN FILM THICKNESS MAPPING

Low temperature melt-processing of organic-inorganic hybrid

Device produced by a process of controlling grain growth in metal f...

Thin film metal barrier for electrical interconnections