Patrick Weber

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for making integrated circuit package includi...
- Patent number 7,049,166
- Issue date May 23, 2006
- Authentec, Inc.
- Matthew M. Salatino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package including opening exposing portion of an IC
- Patent number 6,667,439
- Issue date Dec 23, 2003
- Authentec, Inc.
- Matthew M. Salatino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package with molded underfill
- Patent number 6,560,122
- Issue date May 6, 2003
- Hestia Technologies, Inc.
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of underfilling an integrated circuit chip
- Patent number 6,495,083
- Issue date Dec 17, 2002
- Hestia Technologies, Inc.
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with molded underfill
- Patent number 6,324,069
- Issue date Nov 27, 2001
- Hestia Technologies, Inc.
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a non-laminate carrier substrate utilizing a...
- Patent number 6,316,291
- Issue date Nov 13, 2001
- Hestia Technologies, Inc.
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with transfer mold underfill
- Patent number 6,157,086
- Issue date Dec 5, 2000
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer molded PCMCIA standard cards
- Patent number 6,128,195
- Issue date Oct 3, 2000
- Hestia Technologies, Inc.
- Patrick O. Weber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package with molded underfill
- Patent number 6,038,136
- Issue date Mar 14, 2000
- Hestia Technologies, Inc.
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor non-laminate package and method
- Patent number 5,929,522
- Issue date Jul 27, 1999
- Hestia Technologies, Inc.
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making multi-tier laminate substrates for electronic dev...
- Patent number 5,798,014
- Issue date Aug 25, 1998
- Hestia Technologies, Inc.
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for encapsulating electronic packages
- Patent number 5,776,512
- Issue date Jul 7, 1998
- Hestia Technologies, Inc.
- Patrick O. Weber
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of transfer molding electronic packages and packages produce...
- Patent number 5,766,986
- Issue date Jun 16, 1998
- Hestia Technologies, Inc.
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a multi-tier laminate substrate with internal hea...
- Patent number 5,728,248
- Issue date Mar 17, 1998
- Hestia Technologies, Inc.
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer molding standard electronic packages and appara...
- Patent number 5,689,137
- Issue date Nov 18, 1997
- Hestia Technologies, Inc.
- Patrick O. Weber
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Transfer modlded electronic package having a passage means
- Patent number 5,652,463
- Issue date Jul 29, 1997
- Hestia Technologies, Inc.
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making multi-tier laminate substrates for electronic dev...
- Patent number 5,622,588
- Issue date Apr 22, 1997
- Hestia Technologies, Inc.
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for encapsulating electronic packages
- Patent number 5,609,889
- Issue date Mar 11, 1997
- Hestia Technologies, Inc.
- Patrick O. Weber
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multi-tier laminate substrate with internal heat spreader
- Patent number 5,597,643
- Issue date Jan 28, 1997
- Hestia Technologies, Inc.
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL MANAGEMENT METHOD AND DEVICE FOR SOLAR CONCENTRATOR SYSTEMS
- Publication number 20110017264
- Publication date Jan 27, 2011
- Solaria Corporation
- Patrick Weber
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Light-Emitting Pixel Array Package And Method of Manufacturing The...
- Publication number 20100014234
- Publication date Jan 21, 2010
- HESTIA TECHNOLOGIES, INC.
- Patrick O. Weber
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Integrated circuit package including opening exposing portion of an IC
- Publication number 20020088632
- Publication date Jul 11, 2002
- Authen Tec
- Matthew M. Salatino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Methods and apparatus for making integrated circuit package includi...
- Publication number 20020081780
- Publication date Jun 27, 2002
- Authen Tec
- Matthew M. Salatino
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip package with molded underfill
- Publication number 20020043721
- Publication date Apr 18, 2002
- Patrick O. Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF UNDERFILLING AN INTEGRATED CIRCUIT CHIP
- Publication number 20010038166
- Publication date Nov 8, 2001
- PATRICK O. WEBER
- H01 - BASIC ELECTRIC ELEMENTS

Patrick Weber

Person

Patents Grantslast 30 patents

Methods and apparatus for making integrated circuit package includi...

Integrated circuit package including opening exposing portion of an IC

Chip package with molded underfill

Method of underfilling an integrated circuit chip

Chip package with molded underfill

Method of fabricating a non-laminate carrier substrate utilizing a...

Chip package with transfer mold underfill

Transfer molded PCMCIA standard cards

Chip package with molded underfill

Semiconductor non-laminate package and method

Methods of making multi-tier laminate substrates for electronic dev...

Apparatus for encapsulating electronic packages

Method of transfer molding electronic packages and packages produce...

Method for making a multi-tier laminate substrate with internal hea...

Method for transfer molding standard electronic packages and appara...

Transfer modlded electronic package having a passage means

Methods of making multi-tier laminate substrates for electronic dev...

Apparatus for encapsulating electronic packages

Multi-tier laminate substrate with internal heat spreader

Patents Applicationslast 30 patents

THERMAL MANAGEMENT METHOD AND DEVICE FOR SOLAR CONCENTRATOR SYSTEMS

Light-Emitting Pixel Array Package And Method of Manufacturing The...

Integrated circuit package including opening exposing portion of an IC

Methods and apparatus for making integrated circuit package includi...

Chip package with molded underfill

METHOD OF UNDERFILLING AN INTEGRATED CIRCUIT CHIP