Paul Alan McConnelee

Person

Schenecdady, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics package and method of manufacturing thereof
- Patent number 11,177,204
- Issue date Nov 16, 2021
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 10,607,957
- Issue date Mar 31, 2020
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics package and method of manufacturing thereof
- Patent number 10,453,786
- Issue date Oct 22, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress resistant micro-via structure for flexible circuits
- Patent number 10,276,486
- Issue date Apr 30, 2019
- General Electric Company
- Thomas Bert Gorczyca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and method of making same
- Patent number 10,269,688
- Issue date Apr 23, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and reconstituted semiconductor wafer havin...
- Patent number 10,204,881
- Issue date Feb 12, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and method of making same
- Patent number 10,186,477
- Issue date Jan 22, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure for an embedded electronics package
- Patent number 10,141,203
- Issue date Nov 27, 2018
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with pre-defined via patterns and methods of ma...
- Patent number 10,141,251
- Issue date Nov 27, 2018
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 10,068,840
- Issue date Sep 4, 2018
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package with embedded through-connect structure and met...
- Patent number 9,953,913
- Issue date Apr 24, 2018
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package with embedded through-connect and resistor stru...
- Patent number 9,953,917
- Issue date Apr 24, 2018
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure for an embedded electronics package
- Patent number 9,847,236
- Issue date Dec 19, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 9,806,051
- Issue date Oct 31, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and method of making same
- Patent number 9,704,788
- Issue date Jul 11, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 9,679,837
- Issue date Jun 13, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure for an embedded semiconductor dev...
- Patent number 9,653,438
- Issue date May 16, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure having wirebonds and method of manufacturin...
- Patent number 9,613,843
- Issue date Apr 4, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of making same
- Patent number 9,613,932
- Issue date Apr 4, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 9,570,376
- Issue date Feb 14, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded semiconductor device package and method of manufacturing t...
- Patent number 9,391,027
- Issue date Jul 12, 2016
- General Electric Company
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diffusion barrier for surface mount modules
- Patent number 9,299,630
- Issue date Mar 29, 2016
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect for an integrated circuit package and metho...
- Patent number 9,299,647
- Issue date Mar 29, 2016
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin buried die module and method of manufacturing thereof
- Patent number 9,236,348
- Issue date Jan 12, 2016
- General Electric Company
- Paul Alan McConnelee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded semiconductor device package and method of manufacturing t...
- Patent number 9,209,151
- Issue date Dec 8, 2015
- General Electric Company
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliable surface mount integrated power module
- Patent number 9,184,124
- Issue date Nov 10, 2015
- General Electric Company
- Shakti Singh Chauhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure with leadframe connections
- Patent number 9,171,785
- Issue date Oct 27, 2015
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure with leadframe connections
- Patent number 9,165,864
- Issue date Oct 20, 2015
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of making same
- Patent number 9,117,813
- Issue date Aug 25, 2015
- General Electric Company
- Paul Alan McConnelee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20200185349
- Publication date Jun 11, 2020
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20190311981
- Publication date Oct 10, 2019
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED ELECTRONICS PACKAGE
- Publication number 20180082857
- Publication date Mar 22, 2018
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20180033762
- Publication date Feb 1, 2018
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20170278782
- Publication date Sep 28, 2017
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20170263539
- Publication date Sep 14, 2017
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED ELECTRONICS PACKAGE
- Publication number 20170250093
- Publication date Aug 31, 2017
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20170207160
- Publication date Jul 20, 2017
- General Electronic Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE HAVING WIREBONDS AND METHOD OF MANUFACTURIN...
- Publication number 20170200692
- Publication date Jul 13, 2017
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20170077014
- Publication date Mar 16, 2017
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20160211208
- Publication date Jul 21, 2016
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGES WITH PRE-DEFINED VIA PATTERNS AND METHODS OF MA...
- Publication number 20160183376
- Publication date Jun 23, 2016
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER OVERLAY STRUCTURE HAVING WIREBONDS AND METHOD OF MANUFACTURIN...
- Publication number 20160104666
- Publication date Apr 14, 2016
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED SEMICONDUCTOR DEV...
- Publication number 20160056136
- Publication date Feb 25, 2016
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING T...
- Publication number 20150380356
- Publication date Dec 31, 2015
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME
- Publication number 20150287699
- Publication date Oct 8, 2015
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20150255418
- Publication date Sep 10, 2015
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20150194375
- Publication date Jul 9, 2015
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20150171036
- Publication date Jun 18, 2015
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING T...
- Publication number 20150084207
- Publication date Mar 26, 2015
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SURFACE MOUNT INTEGRATED POWER MODULE
- Publication number 20150069612
- Publication date Mar 12, 2015
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20140264800
- Publication date Sep 18, 2014
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20140264799
- Publication date Sep 18, 2014
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRATHIN BURIED DIE MODULE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20140183750
- Publication date Jul 3, 2014
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20140159213
- Publication date Jun 12, 2014
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS
- Publication number 20140138806
- Publication date May 22, 2014
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS
- Publication number 20140138807
- Publication date May 22, 2014
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP
- Publication number 20140110866
- Publication date Apr 24, 2014
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER FOR SURFACE MOUNT MODULES
- Publication number 20140029210
- Publication date Jan 30, 2014
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SURFACE MOUNT INTEGRATED POWER MODULE
- Publication number 20140029234
- Publication date Jan 30, 2014
- Shakti Singh Chauhan
- H01 - BASIC ELECTRIC ELEMENTS

Paul Alan McConnelee

Person

Patents Grantslast 30 patents

Ultra-thin embedded semiconductor device package and method of manu...

Power electronics package and method of manufacturing thereof

Ultra-thin embedded semiconductor device package and method of manu...

Power electronics package and method of manufacturing thereof

Stress resistant micro-via structure for flexible circuits

Power overlay structure and method of making same

Power overlay structure and reconstituted semiconductor wafer havin...

Power overlay structure and method of making same

Electrical interconnect structure for an embedded electronics package

Electronic packages with pre-defined via patterns and methods of ma...

Electrical interconnect for an integrated circuit package and metho...

Electronics package with embedded through-connect structure and met...

Electronics package with embedded through-connect and resistor stru...

Electrical interconnect structure for an embedded electronics package

Ultra-thin embedded semiconductor device package and method of manu...

Power overlay structure and method of making same

Electrical interconnect for an integrated circuit package and metho...

Electrical interconnect structure for an embedded semiconductor dev...

Power overlay structure having wirebonds and method of manufacturin...

Integrated circuit package and method of making same

Electrical interconnect for an integrated circuit package and metho...

Embedded semiconductor device package and method of manufacturing t...

Diffusion barrier for surface mount modules

Electrical interconnect for an integrated circuit package and metho...

Ultrathin buried die module and method of manufacturing thereof

Embedded semiconductor device package and method of manufacturing t...

Reliable surface mount integrated power module

Power overlay structure with leadframe connections

Power overlay structure with leadframe connections

Integrated circuit package and method of making same

Patents Applicationslast 30 patents

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED ELECTRONICS PACKAGE

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED ELECTRONICS PACKAGE

POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

POWER OVERLAY STRUCTURE HAVING WIREBONDS AND METHOD OF MANUFACTURIN...

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

ELECTRONIC PACKAGES WITH PRE-DEFINED VIA PATTERNS AND METHODS OF MA...

POWER OVERLAY STRUCTURE HAVING WIREBONDS AND METHOD OF MANUFACTURIN...

ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED SEMICONDUCTOR DEV...

EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING T...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING T...

RELIABLE SURFACE MOUNT INTEGRATED POWER MODULE

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

ULTRATHIN BURIED DIE MODULE AND METHOD OF MANUFACTURING THEREOF

ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHO...

POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS

POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS

SYSTEM AND METHOD OF CHIP PACKAGE BUILD-UP

DIFFUSION BARRIER FOR SURFACE MOUNT MODULES

RELIABLE SURFACE MOUNT INTEGRATED POWER MODULE