Paul DIJKSTRA

Person

EINDHOVEN, NL

People

Patents Grantslast 30 patents

Information Patent Grant
UV-C water purification device
- Patent number 10,501,342
- Issue date Dec 10, 2019
- SIGNIFY HOLDING B.V.
- Daiyu Hayashi
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Light emitting device package
- Patent number 10,475,973
- Issue date Nov 12, 2019
- Lumileds LLC
- Paul Dijkstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source assembly and method for producing the same
- Patent number 9,863,585
- Issue date Jan 9, 2018
- Philips Lighting Holding B.V.
- Boudewijn Ruben De Jong
- F21 - LIGHTING
Information Patent Grant
Light emitting device package
- Patent number 9,691,959
- Issue date Jun 27, 2017
- Koninklijke Philips N.V.
- Paul Dijkstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging a semiconductor die and package formed by the...
- Patent number 8,183,682
- Issue date May 22, 2012
- NXP B.V.
- Paul Dijkstra
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Surface treatments for contact pads used in semiconductor chip pack...
- Patent number 8,159,826
- Issue date Apr 17, 2012
- NXP B.V.
- Paul Dijkstra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air cavity package for flip-chip
- Patent number 8,153,480
- Issue date Apr 10, 2012
- NXP B.V.
- Geert Steenbruggen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch method
- Patent number 8,070,971
- Issue date Dec 6, 2011
- NXP B.V.
- Jan Kloosterman
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Carrier for bonding a semiconductor chip onto and a method of contr...
- Patent number 7,989,934
- Issue date Aug 2, 2011
- NXP B.V.
- Klaas Heres
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air cavity package for a semiconductor die and methods of forming t...
- Patent number 7,944,062
- Issue date May 17, 2011
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing thereof
- Patent number 7,858,444
- Issue date Dec 28, 2010
- NXP B.V.
- Cornelis Gerardus Schriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing thereof
- Patent number 7,514,801
- Issue date Apr 7, 2009
- NXP B.V.
- Cornelis Gerardus Schriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, method of manufacturing a carrier and an electronic device
- Patent number 7,247,938
- Issue date Jul 24, 2007
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...

Patents Applicationslast 30 patents

Information Patent Application
ELECTRIC COMPONENT OF AN INTERVENTIONAL MEDICAL DEVICE
- Publication number 20210386376
- Publication date Dec 16, 2021
- Koninklijke Philips N.V.
- Johannes Wilhelmus WEEKAMP
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
UV-C WATER PURIFICATION DEVICE
- Publication number 20180086649
- Publication date Mar 29, 2018
- PHILIPS LIGHTING HOLDING B.V.
- Daiyu HAYASHI
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE
- Publication number 20170288109
- Publication date Oct 5, 2017
- Koninklijke Philips N.V.
- Paul Dijkstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE
- Publication number 20160315237
- Publication date Oct 27, 2016
- Koninklijke Philips N.V.
- Paul Dijkstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light source assembly and method for producing the same
- Publication number 20160109110
- Publication date Apr 21, 2016
- Koninklijke Philips N.V.
- Boudewijn Ruben DE JONG
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20120286410
- Publication date Nov 15, 2012
- NXP B.V.
- Roelf Anco Jacob GROENHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20120112351
- Publication date May 10, 2012
- NXP B.V.
- Sven WALCZYK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR BONDING A SEMICONDUCTOR SHIP ONTO AND A METHOD OF CONTR...
- Publication number 20100006996
- Publication date Jan 14, 2010
- NXP, B.V.
- Klaas Heres
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20090162791
- Publication date Jun 25, 2009
- NXP B.V.
- Cornelis Gerardus SCHRIKS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR CAVITY PACKAGE FOR FLIP-CHIP
- Publication number 20090079050
- Publication date Mar 26, 2009
- NXP B.V.
- Geert Steenbruggen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch Method
- Publication number 20080280105
- Publication date Nov 13, 2008
- Koninklijke Philips Electronics N.V.
- Jan Kloosterman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Packaging a Semiconductor Die and Package Formed by the...
- Publication number 20080277772
- Publication date Nov 13, 2008
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Cavity Package for a Semiconductor Die and Methods of Forming t...
- Publication number 20080272475
- Publication date Nov 6, 2008
- NXP B.V.
- Paul Dijkstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treatments for Contact Pads Used in Semiconductor Chip Pack...
- Publication number 20080230926
- Publication date Sep 25, 2008
- NXP B.V.
- Paul Dijkstra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and method of manufacturing thereof
- Publication number 20070052097
- Publication date Mar 8, 2007
- Koninklijke Philips Electronincs N.V.
- Cornelis Gerardus Schriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier, method of manufacturing a carrier and an electronic device
- Publication number 20050153483
- Publication date Jul 14, 2005
- Kononklijke Philips Electronics N.V. a corporation
- Roelf Anco Jacob Groenhuis
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES

Paul DIJKSTRA

Person

Patents Grantslast 30 patents

UV-C water purification device

Light emitting device package

Light source assembly and method for producing the same

Light emitting device package

Methods of packaging a semiconductor die and package formed by the...

Surface treatments for contact pads used in semiconductor chip pack...

Air cavity package for flip-chip

Etch method

Carrier for bonding a semiconductor chip onto and a method of contr...

Air cavity package for a semiconductor die and methods of forming t...

Electronic device and method of manufacturing thereof

Electronic device and method of manufacturing thereof

Carrier, method of manufacturing a carrier and an electronic device

Patents Applicationslast 30 patents

ELECTRIC COMPONENT OF AN INTERVENTIONAL MEDICAL DEVICE

UV-C WATER PURIFICATION DEVICE

LIGHT EMITTING DEVICE PACKAGE

LIGHT EMITTING DEVICE PACKAGE

Light source assembly and method for producing the same

SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE

CARRIER FOR BONDING A SEMICONDUCTOR SHIP ONTO AND A METHOD OF CONTR...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF

AIR CAVITY PACKAGE FOR FLIP-CHIP

Etch Method

Methods of Packaging a Semiconductor Die and Package Formed by the...

Air Cavity Package for a Semiconductor Die and Methods of Forming t...

Surface Treatments for Contact Pads Used in Semiconductor Chip Pack...

Electronic device and method of manufacturing thereof

Carrier, method of manufacturing a carrier and an electronic device