Membership
Tour
Register
Log in
Paul Ganitzer
Follow
Person
Villach, AT
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
Patent number
12,087,717
Issue date
Sep 10, 2024
Infineon Technologies Austria AG
Thomas Feil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite wafer, semiconductor device and electronic component
Patent number
11,848,237
Issue date
Dec 19, 2023
Infineon Technologies AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with metallization structure on opposite sides...
Patent number
11,552,016
Issue date
Jan 10, 2023
Infineon Technologies AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite wafer, semiconductor device and electronic component
Patent number
11,302,579
Issue date
Apr 12, 2022
Infineon Technologies AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
Patent number
11,081,457
Issue date
Aug 3, 2021
Infineon Technologies Austria AG
Thomas Feil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with metallization structure on opposite sides...
Patent number
10,971,449
Issue date
Apr 6, 2021
Infineon Technologies AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite wafer, semiconductor device, electronic component and met...
Patent number
10,672,664
Issue date
Jun 2, 2020
Infineon Technologies AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with metallization structure on opposite sides...
Patent number
10,593,623
Issue date
Mar 17, 2020
Infineon Technologies AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of reducing a sheet resistance in an electronic device, and...
Patent number
10,573,533
Issue date
Feb 25, 2020
Infineon Technologies AG
Edward Fuergut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing a semiconductor device by forming a separa...
Patent number
9,935,055
Issue date
Apr 3, 2018
Infineon Technologies Austria AG
Andreas Meiser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor devices having a metallisati...
Patent number
9,887,152
Issue date
Feb 6, 2018
Infineon Technologies Austria AG
Rudolf Zelsacher
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processing of thick metal pads
Patent number
9,673,157
Issue date
Jun 6, 2017
Infineon Technologies AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor workpiece having a semiconductor substrate with at le...
Patent number
9,461,004
Issue date
Oct 4, 2016
Infineon Technologies Austria AG
Andreas Meiser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processing of thick metal pads
Patent number
9,397,055
Issue date
Jul 19, 2016
Infineon Technologies AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
Patent number
9,070,741
Issue date
Jun 30, 2015
Infineon Technologies Austria AG
Andreas Meiser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor devices having a metallisati...
Patent number
9,030,028
Issue date
May 12, 2015
Infineon Technologies Austria AG
Rudolf Zelsacher
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor devices having a metallisati...
Patent number
9,029,200
Issue date
May 12, 2015
Infineon Technologies Austria AG
Rudolf Zelsacher
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Layer stack
Patent number
9,006,899
Issue date
Apr 14, 2015
Infineon Technologies AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method including a soldering process
Patent number
8,710,678
Issue date
Apr 29, 2014
Infineon Technologies AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a semiconductor package
Patent number
8,603,858
Issue date
Dec 10, 2013
Infineon Technologies AG
Martin Standing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip, semiconductor device and methods for producing...
Patent number
8,324,115
Issue date
Dec 4, 2012
Infineon Technologies AG
Ralf Otremba
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Device and method including a soldering process
Patent number
8,211,752
Issue date
Jul 3, 2012
Infineon Technologies AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing a connection electrode for two semiconductor z...
Patent number
7,851,349
Issue date
Dec 14, 2010
Infineon Technologies Austria AG
Walter Rieger
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING A SEMICONDUCTOR...
Publication number
20210335739
Publication date
Oct 28, 2021
Thomas Feil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH METALLIZATION STRUCTURE ON OPPOSITE SIDES...
Publication number
20210183763
Publication date
Jun 17, 2021
INFINEON TECHNOLOGIES AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Composite Wafer, Semiconductor Device and Electronic Component
Publication number
20200273750
Publication date
Aug 27, 2020
INFINEON TECHNOLOGIES AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Metallization Structure on Opposite Sides...
Publication number
20200126904
Publication date
Apr 23, 2020
INFINEON TECHNOLOGIES AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Methods of Manufacturing a Semiconductor...
Publication number
20190267362
Publication date
Aug 29, 2019
Infineon Technologies Austria AG
Thomas Feil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BASED BEOL PROCESS FOR CHIP EMBEDDING
Publication number
20190259874
Publication date
Aug 22, 2019
INFINEON TECHNOLOGIES AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Composite Wafer, Semiconductor Device, Electronic Component and Met...
Publication number
20190088550
Publication date
Mar 21, 2019
INFINEON TECHNOLOGIES AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF REDUCING A SHEET RESISTANCE IN AN ELECTRONIC DEVICE, AND...
Publication number
20190013210
Publication date
Jan 10, 2019
INFINEON TECHNOLOGIES AG
Edward FUERGUT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Metallization Structure on Opposite Sides...
Publication number
20180138120
Publication date
May 17, 2018
INFINEON TECHNOLOGIES AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of Manufacturing a Semiconductor Device by Forming a Separa...
Publication number
20170012002
Publication date
Jan 12, 2017
Infineon Technologies Austria AG
Andreas Meiser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of reducing a sheet resistance in an electronic device, and...
Publication number
20160336226
Publication date
Nov 17, 2016
INFINEON TECHNOLOGIES AG
Edward FUERGUT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING OF THICK METAL PADS
Publication number
20160307858
Publication date
Oct 20, 2016
INFINEON TECHNOLOGIES AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Processing of Thick Metal Pads
Publication number
20150348921
Publication date
Dec 3, 2015
INFINEON TECHNOLOGIES AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Workpiece Having a Semiconductor Substrate with at Le...
Publication number
20150262942
Publication date
Sep 17, 2015
Infineon Technologies Austria AG
Andreas Meiser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...
Publication number
20150243592
Publication date
Aug 27, 2015
Infineon Technologies Austria AG
Rudolf Zelsacher
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BASED BEOL PROCESS FOR CHIP EMBEDDING
Publication number
20150221764
Publication date
Aug 6, 2015
INFINEON TECHNOLOGIES AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...
Publication number
20140284819
Publication date
Sep 25, 2014
Infineon Technologies Austria AG
Rudolf Zelsacher
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Fabricating a Layer Stack
Publication number
20140167270
Publication date
Jun 19, 2014
INFINEON TECHNOLOGIES AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Manufacturing a Semiconductor Device and a Semiconductor...
Publication number
20140167209
Publication date
Jun 19, 2014
Andreas Meiser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE
Publication number
20130017651
Publication date
Jan 17, 2013
INFINEON TECHNOLOGIES AG
Martin Standing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD INCLUDING A SOLDERING PROCESS
Publication number
20120267770
Publication date
Oct 25, 2012
INFINEON TECHNOLOGIES AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...
Publication number
20120013029
Publication date
Jan 19, 2012
Infineon Technologies Austria AG
Rudolf Zelsacher
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Producing a Connection Electrode for Two Semiconductor Z...
Publication number
20110294289
Publication date
Dec 1, 2011
Infineon Technologies Austria AG
Walter Reiger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD INCLUDING A SOLDERING PROCESS
Publication number
20090134501
Publication date
May 28, 2009
INFINEON TECHNOLOGIES AG
Paul Ganitzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor chip, semiconductor device and methods for producing...
Publication number
20080105907
Publication date
May 8, 2008
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING AN INTEGRATED CIRCUIT INCLUDING A CONNECTION C...
Publication number
20080096382
Publication date
Apr 24, 2008
INFINEON TECHNOLOGIES AG
Paul GANITZER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for producing a connection electrode for two semiconductor z...
Publication number
20070093019
Publication date
Apr 26, 2007
Infineon Technologies Austria AG
Walter Rieger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Silicon wafer with solderable coating on its wafer rear side, and p...
Publication number
20060273810
Publication date
Dec 7, 2006
Paul Ganitzer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR