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Patents Grants
last 30 patents
Information
Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
Patent number
7,452,808
Issue date
Nov 18, 2008
Chartered Semiconductor Manufacturing Ltd.
Simon Chooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
Patent number
7,060,613
Issue date
Jun 13, 2006
Chartered Semiconductor Manufacturing Ltd.
Simon Chooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of copper/copper surface bonding using a conducting polymer...
Patent number
6,967,162
Issue date
Nov 22, 2005
Chartered Semiconductor Manufacturing Ltd.
Simon Chooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and methods to clean copper contamination on wafer edge
Patent number
6,813,796
Issue date
Nov 9, 2004
Chartered Semiconductor
Sudipto Ranendra Roy
B08 - CLEANING
Information
Patent Grant
Method of using hydrogen plasma to pre-clean copper surfaces during...
Patent number
6,720,204
Issue date
Apr 13, 2004
Chartered Semiconductor Manufacturing Ltd.
John Leonard Sudijono
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for cleaning semiconductor structures using hydrocarbon and...
Patent number
6,692,579
Issue date
Feb 17, 2004
Chartered Semiconductor Manufacturing Ltd.
Sudipto Ranendra Roy
C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information
Patent Grant
Method to create a copper diffusion deterrent interface
Patent number
6,683,002
Issue date
Jan 27, 2004
Chartered Semiconductor Manufacturing Ltd.
Simon Chooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for ultra wide-band communication system using...
Patent number
6,611,223
Issue date
Aug 26, 2003
National University of Singapore
Kay Soon Low
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Method for stripping copper in damascene interconnects
Patent number
6,565,664
Issue date
May 20, 2003
Chartered Semiconductor Manufacturing Ltd.
Subhash Gupta
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method to reduce microloading in metal etching
Patent number
6,548,413
Issue date
Apr 15, 2003
Chartered Semiconductor Manufacturing Ltd.
Paul Kwok Keung Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for removing contaminants from the perimeter o...
Patent number
6,540,841
Issue date
Apr 1, 2003
Chartered Semiconductor Manufacturing Ltd.
Sudipto Ranendra Roy
B08 - CLEANING
Information
Patent Grant
Method of manufacturing embedded organic stop layer for dual damasc...
Patent number
6,475,810
Issue date
Nov 5, 2002
Chartered Semiconductor Manufacturing Ltd.
Mei Sheng Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to create copper traps by modifying treatment on the dielect...
Patent number
6,429,117
Issue date
Aug 6, 2002
Chartered Semiconductor Manufacturing Ltd.
John Sudijono
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for stripping copper in damascene interconnects
Patent number
6,394,114
Issue date
May 28, 2002
Chartered Semiconductor Manufacturing Ltd.
Subhash Gupta
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method to thin down copper barriers in deep submicron geometries by...
Patent number
6,391,783
Issue date
May 21, 2002
Chartered Semiconductor Manufacturing Ltd.
John Sudijono
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to deposit a cooper seed layer for dual damascence interconn...
Patent number
6,368,958
Issue date
Apr 9, 2002
Chartered Semiconductor Manufacturing Ltd.
Paul Kwok Keung Ho
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Process without post-etch cleaning-converting polymer and by-produc...
Patent number
6,365,508
Issue date
Apr 2, 2002
Chartered Semiconductor Manufacturing Ltd.
Mei Sheng Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of copper transport prevention by a sputtered gettering laye...
Patent number
6,358,821
Issue date
Mar 19, 2002
Chartered Semiconductor Manufacturing Inc.
Subhash Gupta
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method to remove copper contamination by using downstream oxygen an...
Patent number
6,350,689
Issue date
Feb 26, 2002
Chartered Semiconductor Manufacturing Ltd.
Paul Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating copper metal bumps for flip-chip or chip-on-b...
Patent number
6,340,608
Issue date
Jan 22, 2002
Chartered Semiconductor Manufacturing Ltd.
Simon Chooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for minimizing copper diffusion by doping an inorganic diele...
Patent number
6,309,982
Issue date
Oct 30, 2001
Chartered Semiconductor Manufacturing Ltd.
Simon Chooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to avoid copper contamination during copper etching and CMP
Patent number
6,274,499
Issue date
Aug 14, 2001
Chartered Semiconductor Manufacturing Ltd.
Subhash Gupta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Application of vapor phase HFACAC-based compound for use in copper...
Patent number
6,261,955
Issue date
Jul 17, 2001
Chartered Semiconductor Manufacturing Ltd.
Yakub Aliyu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method to deposit a copper layer
Patent number
6,261,954
Issue date
Jul 17, 2001
Chartered Semiconductor Manufacturing, Ltd.
Paul Kwok Keung Ho
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Alkyldione peroxides as cleaning solutions for wafer fabs
Patent number
6,255,266
Issue date
Jul 3, 2001
Chartered Semiconductor Manufacturing Ltd.
Subhash Gupta
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method to create a copper dual damascene structure with less dishin...
Patent number
6,251,786
Issue date
Jun 26, 2001
Chartered Semiconductor Manufacturing Ltd.
Mei Sheng Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to deposit a copper seed layer for dual damascene interconnects
Patent number
6,225,221
Issue date
May 1, 2001
Chartered Semiconductor Manufacturing Ltd.
Paul Kwok Keung Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method to create a controllable and reproducible dual copper damasc...
Patent number
6,184,138
Issue date
Feb 6, 2001
Chartered Semiconductor Manufacturing Ltd.
Paul Kwok Keung Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cleaning metal surfaces with alkyldione peroxides
Patent number
6,132,521
Issue date
Oct 17, 2000
Chartered Semiconductor Manufacturing Ltd.
Subhash Gupta
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Chlorine containing plasma etch method with enhanced sidewall passi...
Patent number
6,017,826
Issue date
Jan 25, 2000
Chartered Semiconductor Manufacturing, Ltd.
Mei-Sheng Zhou
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method for bonding wafers to produce stacked integrated circuits
Publication number
20050224921
Publication date
Oct 13, 2005
Subhash Gupta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chemical agent additives in copper CMP slurry
Publication number
20050205522
Publication date
Sep 22, 2005
Chartered Semiconductor Manufacturing Ltd.
Paul Kwok Keung Ho
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method of copper/copper surface bonding using a conducting polymer...
Publication number
20050112799
Publication date
May 26, 2005
Chartered Semiconductor Manufacturing Ltd.
Simon Chooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of copper/copper surface bonding using a conducting polymer...
Publication number
20050090102
Publication date
Apr 28, 2005
Simon Chooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of copper/copper surface bonding using a conducting polymer...
Publication number
20050090039
Publication date
Apr 28, 2005
Chartered Semiconductor Manufacturing Ltd.
Simon Chooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method to create a copper diffusion deterrent interface
Publication number
20040227247
Publication date
Nov 18, 2004
CHARTERED SEMICONDUCTOR MANFACTURING LTD.
Simon Chooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of using hydrogen plasma to pre-clean copper surfaces during...
Publication number
20030192943
Publication date
Oct 16, 2003
Chartered Semiconductor Manufacturing Ltd.
John Leonard Sudijono
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Apparatus and methods to clean copper contamination on wafer edge
Publication number
20030140943
Publication date
Jul 31, 2003
Chartered Semiconductor Manufacturing Ltd.
Sudipto Ranendra Roy
B08 - CLEANING
Information
Patent Application
Method and apparatus for multi-level phase shift keying communications
Publication number
20030103583
Publication date
Jun 5, 2003
National University of Singapore
Kay Soon Low
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Method for bonding wafers to produce stacked integrated circuits
Publication number
20020163072
Publication date
Nov 7, 2002
Subhash Gupta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Planarization by selective electro-dissolution
Publication number
20020115283
Publication date
Aug 22, 2002
Chartered Semiconductor Manufacturing Ltd.
Paul Kwok Keung Ho
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method for stripping copper in damascene interconnects
Publication number
20020115580
Publication date
Aug 22, 2002
Chartered Semiconductor Manufacturing Ltd.
Subhash Gupta
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method for cleaning semiconductor structures using hydrocarbon and...
Publication number
20020096190
Publication date
Jul 25, 2002
Chartered Semiconductor Manufacturing Inc.
Sudipto Ranendra Roy
C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information
Patent Application
Application of vapor phase HFACAC-based compound for use in copper...
Publication number
20020048950
Publication date
Apr 25, 2002
Chartered Semiconductor Manufacturing Ltd.
Yakub Aliyu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method to deposit a copper layer
Publication number
20010029099
Publication date
Oct 11, 2001
Chartered Semiconductor Manufacturing Ltd.
Paul Kwok Keung Ho
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...