Paul Kasulke

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Device for removing solder material from a soldered joint
- Patent number 7,829,817
- Issue date Nov 9, 2010
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for applying material to a workpiece
- Patent number 7,121,449
- Issue date Oct 17, 2006
- Pac Tec - Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for the formation of a spatial chip arrangement and spatial...
- Patent number 7,087,442
- Issue date Aug 8, 2006
- PAC Tech-Packaging Technologies GmbH
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for applying pieces of material to a workpiece
- Patent number 7,021,517
- Issue date Apr 4, 2006
- Pac Tec - Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for positioning a tool in relation to a workpiece
- Patent number 6,955,284
- Issue date Oct 18, 2005
- Pac Tec-Packaging Technologies GmbH
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing contactless chip cards and corresponding conta...
- Patent number 6,651,891
- Issue date Nov 25, 2003
- Smart Pac GmbH Technology Services
- Elke Zakel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for selective soldering
- Patent number 6,328,200
- Issue date Dec 11, 2001
- PAC Tech - Packaging Technologies GmbH
- Jürgen Schredl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chips arranged in plurality of planes and electrically connected to...
- Patent number 6,281,577
- Issue date Aug 28, 2001
- PAC Tech-Packaging Technologies GmbH
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for testing chips
- Patent number 6,277,660
- Issue date Aug 21, 2001
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Elke Zakel
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for testing chips
- Patent number 6,211,571
- Issue date Apr 3, 2001
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung
- Elke Zakel
- G01 - MEASURING TESTING
Information Patent Grant
Method and device for repairing defective soldered joints
- Patent number 6,119,919
- Issue date Sep 19, 2000
- Pac Tech Packaging Technologies G.m.b.H.
- Paul Kasulke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip module with conductor paths on the chip bonding side of a chip...
- Patent number 6,093,971
- Issue date Jul 25, 2000
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching a component to a plate-shaped support
- Patent number 6,056,188
- Issue date May 2, 2000
- Pac Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal connecting structure for connecting materials with differen...
- Patent number 6,043,985
- Issue date Mar 28, 2000
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Ghassem Azdasht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for galvanic forming of bonding pads
- Patent number 5,989,993
- Issue date Nov 23, 1999
- Zakel; Elke
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and device for applying material to a workpiece
- Publication number 20050031776
- Publication date Feb 10, 2005
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device for positioning a tool in relation to a workpiece
- Publication number 20040129756
- Publication date Jul 8, 2004
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device for removing solder material from a soldered joint
- Publication number 20040026383
- Publication date Feb 12, 2004
- Elke Zakel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for the formation of a spatial chip arrangement and spatial...
- Publication number 20020009828
- Publication date Jan 24, 2002
- PAC TECH - PACKAGING TECHNOLOGIES GMBH
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS

Paul Kasulke

Person

Patents Grantslast 30 patents

Device for removing solder material from a soldered joint

Method and device for applying material to a workpiece

Process for the formation of a spatial chip arrangement and spatial...

Method and device for applying pieces of material to a workpiece

Device for positioning a tool in relation to a workpiece

Method for producing contactless chip cards and corresponding conta...

Process for selective soldering

Chips arranged in plurality of planes and electrically connected to...

Method and apparatus for testing chips

Method and apparatus for testing chips

Method and device for repairing defective soldered joints

Chip module with conductor paths on the chip bonding side of a chip...

Method of attaching a component to a plate-shaped support

Thermal connecting structure for connecting materials with differen...

Method for galvanic forming of bonding pads

Patents Applicationslast 30 patents

Method and device for applying material to a workpiece

Device for positioning a tool in relation to a workpiece

Device for removing solder material from a soldered joint

Process for the formation of a spatial chip arrangement and spatial...