Paul R. Start

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded bridge die with through-silicon vias
- Patent number 12,159,813
- Issue date Dec 3, 2024
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level passive heat spreader interposer to enable improved the...
- Patent number 11,804,470
- Issue date Oct 31, 2023
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge with through-silicon vias
- Patent number 11,587,851
- Issue date Feb 21, 2023
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge with through-silicon Vias
- Patent number 11,049,798
- Issue date Jun 29, 2021
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded bridge with through-silicon vias
- Patent number 10,373,893
- Issue date Aug 6, 2019
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming ultra thin package structures including low temp...
- Patent number 9,461,014
- Issue date Oct 4, 2016
- Intel Corporation
- Sriram Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming ultra thin package structures including low temp...
- Patent number 9,064,971
- Issue date Jun 23, 2015
- Intel Corporation
- Sriram Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded heat spreaders
- Patent number 8,866,290
- Issue date Oct 21, 2014
- Intel Corporation
- Zhizhong Tang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
In-situ foam material as integrated heat spreader (IHS) sealant
- Patent number 8,703,536
- Issue date Apr 22, 2014
- Intel Corporation
- Paul R. Start
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ foam materials as integrated heat spreader (IHS) sealant
- Patent number 8,508,040
- Issue date Aug 13, 2013
- Intel Corporation
- Paul R. Start
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
- Publication number 20230197574
- Publication date Jun 22, 2023
- Intel Corporation
- Aditya S. VAIDYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
- Publication number 20210272881
- Publication date Sep 2, 2021
- Intel Corporation
- Aditya S. VAIDYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PASSIVE HEAT SPREADER INTERPOSER TO ENABLE IMPROVED THE...
- Publication number 20210057381
- Publication date Feb 25, 2021
- Intel Corporation
- Xavier F. BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
- Publication number 20190326198
- Publication date Oct 24, 2019
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BICONTINUOUS POROUS CERAMIC COMPOSITE FOR SEMICONDUCTOR PACKAGE APP...
- Publication number 20190206753
- Publication date Jul 4, 2019
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS
- Publication number 20190043778
- Publication date Feb 7, 2019
- Zhizhong TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS
- Publication number 20190006264
- Publication date Jan 3, 2019
- Intel Corporation
- Aditya S. Vaidya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ULTRA THIN PACKAGE STRUCTURES INCLUDING LOW TEMP...
- Publication number 20150221609
- Publication date Aug 6, 2015
- Intel Corporation
- Sriram Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED HEAT SPREADERS
- Publication number 20140264821
- Publication date Sep 18, 2014
- Zhizhong Tang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MICROELECTRONIC PACKAGE INCLUDING AN ENCAPSULATED HEAT SPREADER
- Publication number 20140239479
- Publication date Aug 28, 2014
- Paul R Start
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ULTRA THIN PACKAGE STRUCTURES INCLUDING LOW TEMP...
- Publication number 20140175644
- Publication date Jun 26, 2014
- Sriram Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU FOAM MATERIAL AS INTEGRATED HEAT SPREADER (IHS) SEALANT
- Publication number 20140024176
- Publication date Jan 23, 2014
- Paul R. Start
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU FOAM MATERIAL AS INTEGRATED HEAT SPREADER (IHS) SEALANT
- Publication number 20120139093
- Publication date Jun 7, 2012
- Paul R. Start
- H01 - BASIC ELECTRIC ELEMENTS

Paul R. Start

Person

Patents Grantslast 30 patents

Embedded bridge die with through-silicon vias

Wafer level passive heat spreader interposer to enable improved the...

Embedded bridge with through-silicon vias

Embedded bridge with through-silicon Vias

Embedded bridge with through-silicon vias

Methods of forming ultra thin package structures including low temp...

Methods of forming ultra thin package structures including low temp...

Molded heat spreaders

In-situ foam material as integrated heat spreader (IHS) sealant

In-situ foam materials as integrated heat spreader (IHS) sealant

Patents Applicationslast 30 patents

EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS

EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS

WAFER LEVEL PASSIVE HEAT SPREADER INTERPOSER TO ENABLE IMPROVED THE...

EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS

BICONTINUOUS POROUS CERAMIC COMPOSITE FOR SEMICONDUCTOR PACKAGE APP...

SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS

EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS

METHODS OF FORMING ULTRA THIN PACKAGE STRUCTURES INCLUDING LOW TEMP...

MOLDED HEAT SPREADERS

MICROELECTRONIC PACKAGE INCLUDING AN ENCAPSULATED HEAT SPREADER

METHODS OF FORMING ULTRA THIN PACKAGE STRUCTURES INCLUDING LOW TEMP...

IN-SITU FOAM MATERIAL AS INTEGRATED HEAT SPREADER (IHS) SEALANT

IN-SITU FOAM MATERIAL AS INTEGRATED HEAT SPREADER (IHS) SEALANT