Paul S. Andry

Person

Yorktown Heights, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
3D textured composite silicon anode and fluorinated lithium compoun...
- Patent number 11,961,958
- Issue date Apr 16, 2024
- International Business Machines Corporation
- John Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of a chip to a substrate
- Patent number 11,824,037
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Katsuyuki Sakuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct bonded heterogeneous integration silicon bridge
- Patent number 11,791,270
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Kamal K Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferrable pillar structure for fanout package or interconnect b...
- Patent number 11,587,896
- Issue date Feb 21, 2023
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulating in-situ energy storage device with electrode contact
- Patent number 11,489,219
- Issue date Nov 1, 2022
- International Business Machines Corporation
- John Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 11,424,152
- Issue date Aug 23, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified hermetic packaging of a micro-battery
- Patent number 11,411,272
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified hermetic packaging of a micro-battery
- Patent number 11,362,382
- Issue date Jun 14, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microbattery with through-silicon via electrodes
- Patent number 11,316,164
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular, frequency-flexible, superconducting quantum processor arch...
- Patent number 11,288,587
- Issue date Mar 29, 2022
- International Business Machines Corporation
- Hanhee Paik
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microbattery separator
- Patent number 11,258,132
- Issue date Feb 22, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile battery construct with engineered interfaces
- Patent number 11,183,725
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed under bump metallurgy (UBM) interconnect bridge structure
- Patent number 11,139,269
- Issue date Oct 5, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large channel interconnects with through silicon Vias (TSVs) and me...
- Patent number 11,127,715
- Issue date Sep 21, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 11,121,005
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sandwich-parallel micro-battery
- Patent number 11,043,690
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cathode for thin film microbattery
- Patent number 10,686,164
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Paul S. Andry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of forming a plurality of electro-optical module assemblies
- Patent number 10,687,425
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Paul S. Andry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 10,679,887
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electro-optical module assembly
- Patent number 10,670,656
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Paul S. Andry
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming a plurality of electro-optical module assemblies
- Patent number 10,638,613
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Paul S. Andry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a homogeneous solid metallic anode for a thin fil...
- Patent number 10,622,590
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Paul S. Andry
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 10,586,726
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile battery construct with engineered interfaces
- Patent number 10,581,037
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handler bonding and debonding for semiconductor dies
- Patent number 10,573,538
- Issue date Feb 25, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microbattery with through-silicon via electrodes
- Patent number 10,431,828
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electro-optical module assembly
- Patent number 10,393,798
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Paul S. Andry
- G01 - MEASURING TESTING
Information Patent Grant
Microbattery separator
- Patent number 10,388,929
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double layer release temporary bond and debond processes and systems
- Patent number 10,381,255
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Paul S. Andry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin 3D die with electromagnetic radiation blocking encapsulation
- Patent number 10,347,588
- Issue date Jul 9, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLY OF A CHIP TO A SUBSTRATE
- Publication number 20240063171
- Publication date Feb 22, 2024
- International Business Machines Corporation
- Katsuyuki Sakuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE
- Publication number 20220359401
- Publication date Nov 10, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF A CHIP TO A SUBSTRATE
- Publication number 20220208719
- Publication date Jun 30, 2022
- International Business Machines Corporation
- Katsuyuki Sakuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFERRABLE PILLAR STRUCTURE FOR FANOUT PACKAGE OR INTERCONNECT B...
- Publication number 20220181286
- Publication date Jun 9, 2022
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure
- Publication number 20210233892
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITY COMPACT LITHIUM THIN FILM BATTERY
- Publication number 20210091372
- Publication date Mar 25, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR, FREQUENCY-FLEXIBLE, SUPERCONDUCTING QUANTUM PROCESSOR ARCH...
- Publication number 20200401924
- Publication date Dec 24, 2020
- International Business Machines Corporation
- Hanhee Paik
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENCAPSULATING IN-SITU ENERGY STORAGE DEVICE WITH ELECTRODE CONTACT
- Publication number 20200403190
- Publication date Dec 24, 2020
- International Business Machines Corporation
- John Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Textured Composite Silicon Anode & Fluorinated Lithium Compound...
- Publication number 20200395628
- Publication date Dec 17, 2020
- International Business Machines Corporation
- John Collins
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SANDWICH-PARALLEL MICRO-BATTERY
- Publication number 20200212475
- Publication date Jul 2, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20200176297
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20200168475
- Publication date May 28, 2020
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE BATTERY CONSTRUCT WITH ENGINEERED INTERFACES
- Publication number 20200144564
- Publication date May 7, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROBATTERY SEPARATOR
- Publication number 20190372075
- Publication date Dec 5, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROBATTERY WITH THROUGH-SILICON VIA ELECTRODES
- Publication number 20190355991
- Publication date Nov 21, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20190189469
- Publication date Jun 20, 2019
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE CHANNEL INTERCONNECTS WITH THROUGH SILICON VIAS (TSVS) AND ME...
- Publication number 20190139938
- Publication date May 9, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Layer Release Temporary Bond And Debond Processes And Systems
- Publication number 20190115243
- Publication date Apr 18, 2019
- International Business Machines Corporation
- Paul S. Andry
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOMOGENEOUS SOLID METALLIC ANODE FOR THIN FILM MICROBATTERY
- Publication number 20190019997
- Publication date Jan 17, 2019
- International Business Machines Corporation
- Paul S. Andry
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THIN 3D DIE WITH ELECTROMAGNETIC RADIATION BLOCKING ENCAPSULATION
- Publication number 20180342464
- Publication date Nov 29, 2018
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATHODE FOR THIN FILM MICROBATTERY
- Publication number 20180331329
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Paul S. Andry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
FLEXIBLE ELECTRONICS FOR WEARABLE HEALTHCARE SENSORS
- Publication number 20180257926
- Publication date Sep 13, 2018
- International Business Machines Corporation
- Paul S. ANDRY
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20180218934
- Publication date Aug 2, 2018
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN 3D DIE WITH ELECTROMAGNETIC RADIATION BLOCKING ENCAPSULATION
- Publication number 20180211924
- Publication date Jul 26, 2018
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20180138072
- Publication date May 17, 2018
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
- Publication number 20180138073
- Publication date May 17, 2018
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRO-OPTICAL MODULE ASSEMBLY
- Publication number 20180098433
- Publication date Apr 5, 2018
- International Business Machines Corporation
- Paul S. Andry
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED ELECTRO-OPTICAL MODULE ASSEMBLY
- Publication number 20180098432
- Publication date Apr 5, 2018
- International Business Machines Corporation
- Paul S. Andry
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED ELECTRO-OPTICAL MODULE ASSEMBLY
- Publication number 20180095125
- Publication date Apr 5, 2018
- International Business Machines Corporation
- Paul S. Andry
- G01 - MEASURING TESTING
Information Patent Application
SIMPLIFIED HERMETIC PACKAGING OF A MICRO-BATTERY
- Publication number 20180069202
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS

Paul S. Andry

Person

Patents Grantslast 30 patents

3D textured composite silicon anode and fluorinated lithium compoun...

Assembly of a chip to a substrate

Direct bonded heterogeneous integration silicon bridge

Transferrable pillar structure for fanout package or interconnect b...

Encapsulating in-situ energy storage device with electrode contact

Handler bonding and debonding for semiconductor dies

Simplified hermetic packaging of a micro-battery

Simplified hermetic packaging of a micro-battery

Microbattery with through-silicon via electrodes

Modular, frequency-flexible, superconducting quantum processor arch...

Microbattery separator

Low-profile battery construct with engineered interfaces

Mixed under bump metallurgy (UBM) interconnect bridge structure

Large channel interconnects with through silicon Vias (TSVs) and me...

Handler bonding and debonding for semiconductor dies

Sandwich-parallel micro-battery

Cathode for thin film microbattery

Method of forming a plurality of electro-optical module assemblies

Handler bonding and debonding for semiconductor dies

Integrated electro-optical module assembly

Method of forming a plurality of electro-optical module assemblies

Method of forming a homogeneous solid metallic anode for a thin fil...

Handler bonding and debonding for semiconductor dies

Low-profile battery construct with engineered interfaces

Handler bonding and debonding for semiconductor dies

Microbattery with through-silicon via electrodes

Integrated electro-optical module assembly

Microbattery separator

Double layer release temporary bond and debond processes and systems

Thin 3D die with electromagnetic radiation blocking encapsulation

Patents Applicationslast 30 patents

ASSEMBLY OF A CHIP TO A SUBSTRATE

DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE

ASSEMBLY OF A CHIP TO A SUBSTRATE

TRANSFERRABLE PILLAR STRUCTURE FOR FANOUT PACKAGE OR INTERCONNECT B...

Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure

HIGH CAPACITY COMPACT LITHIUM THIN FILM BATTERY

MODULAR, FREQUENCY-FLEXIBLE, SUPERCONDUCTING QUANTUM PROCESSOR ARCH...

ENCAPSULATING IN-SITU ENERGY STORAGE DEVICE WITH ELECTRODE CONTACT

3D Textured Composite Silicon Anode & Fluorinated Lithium Compound...

SANDWICH-PARALLEL MICRO-BATTERY

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

LOW-PROFILE BATTERY CONSTRUCT WITH ENGINEERED INTERFACES

MICROBATTERY SEPARATOR

MICROBATTERY WITH THROUGH-SILICON VIA ELECTRODES

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

LARGE CHANNEL INTERCONNECTS WITH THROUGH SILICON VIAS (TSVS) AND ME...

Double Layer Release Temporary Bond And Debond Processes And Systems

HOMOGENEOUS SOLID METALLIC ANODE FOR THIN FILM MICROBATTERY

THIN 3D DIE WITH ELECTROMAGNETIC RADIATION BLOCKING ENCAPSULATION

CATHODE FOR THIN FILM MICROBATTERY

FLEXIBLE ELECTRONICS FOR WEARABLE HEALTHCARE SENSORS

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

THIN 3D DIE WITH ELECTROMAGNETIC RADIATION BLOCKING ENCAPSULATION

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES

INTEGRATED ELECTRO-OPTICAL MODULE ASSEMBLY

INTEGRATED ELECTRO-OPTICAL MODULE ASSEMBLY

INTEGRATED ELECTRO-OPTICAL MODULE ASSEMBLY

SIMPLIFIED HERMETIC PACKAGING OF A MICRO-BATTERY