Pavan Gupta

Person

Belmont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
MEMS resonator system
- Patent number 11,987,495
- Issue date May 21, 2024
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,708,264
- Issue date Jul 25, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical structure with bonded cover
- Patent number 11,685,650
- Issue date Jun 27, 2023
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Force transducer for electronic devices
- Patent number 11,442,544
- Issue date Sep 13, 2022
- Apple Inc.
- Joseph C. Doll
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,370,656
- Issue date Jun 28, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Compliant material for protecting capacitive force sensors and incr...
- Patent number 11,275,475
- Issue date Mar 15, 2022
- Apple Inc.
- Daniel J. Bechstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compliant material for protecting capacitive force sensors and incr...
- Patent number 10,921,943
- Issue date Feb 16, 2021
- Apple Inc.
- Daniel J. Bechstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing of integrated circuit resonator
- Patent number 10,913,655
- Issue date Feb 9, 2021
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Force or touch sensing on a mobile device using capacitive or press...
- Patent number 10,866,683
- Issue date Dec 15, 2020
- Apple Inc.
- Pavan O. Gupta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,766,768
- Issue date Sep 8, 2020
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure for micromechanical resonator
- Patent number 10,723,617
- Issue date Jul 28, 2020
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,450,190
- Issue date Oct 22, 2019
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-profile stacked-die MEMS resonator system
- Patent number 10,287,162
- Issue date May 14, 2019
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,099,917
- Issue date Oct 16, 2018
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device including movable magnet based actuator for defor...
- Patent number 9,949,390
- Issue date Apr 17, 2018
- Apple Inc.
- Joseph C. Doll
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked-die MEMS resonator system
- Patent number 9,821,998
- Issue date Nov 21, 2017
- SiTime Corpoaration
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 9,758,371
- Issue date Sep 12, 2017
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 9,440,845
- Issue date Sep 13, 2016
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer encapsulated microelectromechanical structure
- Patent number 9,434,608
- Issue date Sep 6, 2016
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-profile stacked-die MEMS resonator system
- Patent number 9,371,221
- Issue date Jun 21, 2016
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked die package for MEMS resonator system
- Patent number 8,941,247
- Issue date Jan 27, 2015
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer encapsulated microelectromechanical structure and method of m...
- Patent number 8,871,551
- Issue date Oct 28, 2014
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked die package for MEMS resonator system
- Patent number 8,669,664
- Issue date Mar 11, 2014
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked die package for MEMS resonator system
- Patent number 8,324,729
- Issue date Dec 4, 2012
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked die package for MEMS resonator system
- Patent number 8,022,554
- Issue date Sep 20, 2011
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20250019229
- Publication date Jan 16, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20230391611
- Publication date Dec 7, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20220356059
- Publication date Nov 10, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20210221678
- Publication date Jul 22, 2021
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20210179421
- Publication date Jun 17, 2021
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Compliant Material for Protecting Capacitive Force Sensors and Incr...
- Publication number 20210124460
- Publication date Apr 29, 2021
- Apple Inc.
- Daniel J. Bechstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20200385261
- Publication date Dec 10, 2020
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Compliant Material for Protecting Capacitive Force Sensors and Incr...
- Publication number 20200348795
- Publication date Nov 5, 2020
- Apple Inc.
- Daniel J. Bechstein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20200079646
- Publication date Mar 12, 2020
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Force or Touch Sensing on a Mobile Device Using Capacitive or Press...
- Publication number 20200064952
- Publication date Feb 27, 2020
- Apple Inc.
- Pavan O. Gupta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Package Structure For Micromechanical Resonator
- Publication number 20190292043
- Publication date Sep 26, 2019
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20190055121
- Publication date Feb 21, 2019
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Force Transducer for Electronic Devices
- Publication number 20180314331
- Publication date Nov 1, 2018
- Apple Inc.
- Joseph C. Doll
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20180155186
- Publication date Jun 7, 2018
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated Haptic Output and Touch Input System
- Publication number 20180081441
- Publication date Mar 22, 2018
- Apple Inc.
- James E. Pedder
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20180044176
- Publication date Feb 15, 2018
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Localized and/or Encapsulated Haptic Actuators and Elements
- Publication number 20170364158
- Publication date Dec 21, 2017
- Apple Inc.
- Xiaonan Wen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20170101310
- Publication date Apr 13, 2017
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20170029269
- Publication date Feb 2, 2017
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20160167950
- Publication date Jun 16, 2016
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM
- Publication number 20150123220
- Publication date May 7, 2015
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20150041928
- Publication date Feb 12, 2015
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIE PACKAGE FOR MEMS RESONATOR SYSTEM
- Publication number 20150035090
- Publication date Feb 5, 2015
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Stacked Die Package for MEMS Resonator System
- Publication number 20130075853
- Publication date Mar 28, 2013
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Stacked Die Package for MEMS Resonator System
- Publication number 20110227175
- Publication date Sep 22, 2011
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIE PACKAGE FOR MEMS RESONATOR SYSTEM
- Publication number 20070290364
- Publication date Dec 20, 2007
- Pavan GUPTA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer encapsulated microelectromechanical structure and method of m...
- Publication number 20070181962
- Publication date Aug 9, 2007
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer encapsulated microelectromechanical structure and method of m...
- Publication number 20070170530
- Publication date Jul 26, 2007
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer encapsulated microelectromechanical structure and method of m...
- Publication number 20070170532
- Publication date Jul 26, 2007
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Pavan Gupta

Person

Patents Grantslast 30 patents

MEMS resonator system

Stacked-die MEMS resonator

Microelectromechanical structure with bonded cover

Force transducer for electronic devices

Stacked-die MEMS resonator

Compliant material for protecting capacitive force sensors and incr...

Compliant material for protecting capacitive force sensors and incr...

Manufacturing of integrated circuit resonator

Force or touch sensing on a mobile device using capacitive or press...

Encapsulated microelectromechanical structure

Package structure for micromechanical resonator

Encapsulated microelectromechanical structure

Low-profile stacked-die MEMS resonator system

Encapsulated microelectromechanical structure

Electronic device including movable magnet based actuator for defor...

Stacked-die MEMS resonator system

Encapsulated microelectromechanical structure

Encapsulated microelectromechanical structure

Wafer encapsulated microelectromechanical structure

Low-profile stacked-die MEMS resonator system

Stacked die package for MEMS resonator system

Wafer encapsulated microelectromechanical structure and method of m...

Stacked die package for MEMS resonator system

Stacked die package for MEMS resonator system

Stacked die package for MEMS resonator system

Patents Applicationslast 30 patents

STACKED-DIE MEMS RESONATOR

MICROMECHANICAL STRUCTURE WITH BONDED COVER

STACKED-DIE MEMS RESONATOR

STACKED-DIE MEMS RESONATOR

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

STACKED-DIE MEMS RESONATOR

Compliant Material for Protecting Capacitive Force Sensors and Incr...

LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM

Compliant Material for Protecting Capacitive Force Sensors and Incr...

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

Force or Touch Sensing on a Mobile Device Using Capacitive or Press...

Package Structure For Micromechanical Resonator

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

Force Transducer for Electronic Devices

LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM

Integrated Haptic Output and Touch Input System

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

Localized and/or Encapsulated Haptic Actuators and Elements

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

STACKED-DIE MEMS RESONATOR SYSTEM

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

LOW-PROFILE STACKED-DIE MEMS RESONATOR SYSTEM

WAFER ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

STACKED DIE PACKAGE FOR MEMS RESONATOR SYSTEM

Stacked Die Package for MEMS Resonator System

Stacked Die Package for MEMS Resonator System

STACKED DIE PACKAGE FOR MEMS RESONATOR SYSTEM

Wafer encapsulated microelectromechanical structure and method of m...

Wafer encapsulated microelectromechanical structure and method of m...

Wafer encapsulated microelectromechanical structure and method of m...