Pawel MROZEK

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Reliable hybrid bonded apparatus
- Patent number 11,742,314
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR USING ACOUSTIC WAVES TO COUNTERACT DEFORMATIO...
- Publication number 20240213210
- Publication date Jun 27, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE HYBRID BONDED APPARATUS
- Publication number 20240021573
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION CONTROL FOR BONDING
- Publication number 20230299029
- Publication date Sep 21, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH CONDUCTIVE FEATURE FOR DIRECT BONDING AND METHOD OF...
- Publication number 20230197453
- Publication date Jun 22, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE HYBRID BONDED APPARATUS
- Publication number 20210305202
- Publication date Sep 30, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS