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Patents Grants
last 30 patents
Information
Patent Grant
Carrier tape system and components and methods of use
Patent number
12,016,126
Issue date
Jun 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Sung-Sheng Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic shielding material with insulator-coated ferromagnetic par...
Patent number
11,990,423
Issue date
May 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Tsung-Hsing Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having warpage control and method of f...
Patent number
11,978,729
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Heh-Chang Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming chip package structure
Patent number
11,804,445
Issue date
Oct 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Heh-Chang Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,798,860
Issue date
Oct 24, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier tape system and methods of making and using the same
Patent number
11,725,120
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Ming Kuo
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Package and printed circuit board attachment
Patent number
11,610,827
Issue date
Mar 21, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out structures and methods for forming the same
Patent number
11,527,499
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Company Limited
Tsui-Mei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having counductive bump with tapered portio...
Patent number
11,495,556
Issue date
Nov 8, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic shielding material with insulator-coated ferromagnetic par...
Patent number
11,404,383
Issue date
Aug 2, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Tsung-Hsing Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier tape system and components and methods of use
Patent number
11,240,947
Issue date
Feb 1, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Sung-Sheng Chiu
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,239,143
Issue date
Feb 1, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier tape system and methods of using carrier tape system
Patent number
11,164,763
Issue date
Nov 2, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Tsung-Jen Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier tape system and methods of using carrier tape system
Patent number
11,164,764
Issue date
Nov 2, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Tsung-Jen Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with bump structure and method of making semic...
Patent number
11,127,704
Issue date
Sep 21, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package and printed circuit board attachment
Patent number
11,101,190
Issue date
Aug 24, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dicing method for stacked semiconductor devices
Patent number
11,081,392
Issue date
Aug 3, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Tsung-Hsing Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,037,849
Issue date
Jun 15, 2021
Taiwan Semiconductor Manufacturing Company Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having a conductive bump with a plurality o...
Patent number
11,018,099
Issue date
May 25, 2021
Taiwan Semiconductor Manufacturing Company Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board
Patent number
10,912,194
Issue date
Feb 2, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic shielding material with insulator-coated ferromagnetic par...
Patent number
10,892,230
Issue date
Jan 12, 2021
Taiwan Semiconductor Manufacturing Co., Ltd
Tsung-Hsing Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip holder
Patent number
10,879,098
Issue date
Dec 29, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Tsung-Jen Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package and printed circuit board attachment
Patent number
10,867,881
Issue date
Dec 15, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with protrusion structure
Patent number
10,692,828
Issue date
Jun 23, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier tape system and methods of using carrier tape system
Patent number
10,679,877
Issue date
Jun 9, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Tsung-Jen Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package and printed circuit board attachment
Patent number
10,510,633
Issue date
Dec 17, 2019
Taiwan Semiconductor Manufacturing Co., Ltd
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board
Patent number
10,506,712
Issue date
Dec 10, 2019
Taiwan Semiconductor Manufacturing Co., Ltd
Pei-Haw Tsao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
10,475,719
Issue date
Nov 12, 2019
Taiwan Semiconductor Manufacturing Company Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
10,373,901
Issue date
Aug 6, 2019
Taiwan Semiconductor Manufacturing Company Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method for forming the same
Patent number
10,304,793
Issue date
May 28, 2019
Taiwan Semiconductor Manufacturing Co., Ltd
Tsung-Hsing Lu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF
Publication number
20240178159
Publication date
May 30, 2024
MEDIATEK INC.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240178112
Publication date
May 30, 2024
MEDIATEK INC.
Yu-Tung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL
Publication number
20240145448
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Heh-Chang HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20240112963
Publication date
Apr 4, 2024
MEDIATEK INC.
Yu-Tung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES
Publication number
20230402324
Publication date
Dec 14, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Tsung-Hsing Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20230387101
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION
Publication number
20230386954
Publication date
Nov 30, 2023
MEDIATEK INC.
Yu-Tung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR
Publication number
20230378079
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Heh-Chang HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME
Publication number
20230340298
Publication date
Oct 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Ming Kuo
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Package and Printed Circuit Board Attachment
Publication number
20230230891
Publication date
Jul 20, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw TSAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
Publication number
20230036317
Publication date
Feb 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Heng CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF F...
Publication number
20230012350
Publication date
Jan 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Heh-Chang HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220384377
Publication date
Dec 1, 2022
Taiwan Semiconductor Manufacturing company Ltd.
PEI-HAW TSAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20220352083
Publication date
Nov 3, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Heh-Chang HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT STRUCTURES AND METHODS FOR FORMING THE SAME
Publication number
20220352103
Publication date
Nov 3, 2022
Taiwan Semiconductor Manufacturing Company Limited
Tsui-Mei CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC SHIELDING MATERIAL WITH INSULATOR-COATED FERROMAGNETIC PAR...
Publication number
20220336370
Publication date
Oct 20, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsung-Hsing LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER TAPE SYSTEM AND COMPONENTS AND METHODS OF USE
Publication number
20220110232
Publication date
Apr 7, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Sung-Sheng CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Dicing Method for Stacked Semiconductor Devices
Publication number
20210358808
Publication date
Nov 18, 2021
Taiwan Semiconductor Manufacturing Co., LTD
Tsung-Hsing Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT STRUCTURES AND METHODS FOR FORMING THE SAME
Publication number
20210343667
Publication date
Nov 4, 2021
Taiwan Semiconductor Manufacturing Company Limited
Tsui-Mei CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20210305116
Publication date
Sep 30, 2021
Taiwan Semiconductor Manufacturing company Ltd.
PEI-HAW TSAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME
Publication number
20210134635
Publication date
May 6, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package and Printed Circuit Board Attachment
Publication number
20210098327
Publication date
Apr 1, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw TSAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC SHIELDING MATERIAL WITH INSULATOR-COATED FERROMAGNETIC PAR...
Publication number
20210035920
Publication date
Feb 4, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsung-Hsing LU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CARRIER TAPE SYSTEM AND METHODS OF USING CARRIER TAPE SYSTEM
Publication number
20200266082
Publication date
Aug 20, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsung-Jen LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Dicing Method for Stacked Semiconductor Devices
Publication number
20200105600
Publication date
Apr 2, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Tsung-Hsing Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20200098677
Publication date
Mar 26, 2020
Taiwan Semiconductor Manufacturing company Ltd.
PEI-HAW TSAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP HOLDER
Publication number
20200090970
Publication date
Mar 19, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsung-Jen Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package and Printed Circuit Board Attachment
Publication number
20200083130
Publication date
Mar 12, 2020
Taiwan Semiconductor Manufacturing CO.,LTD.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20200075449
Publication date
Mar 5, 2020
Taiwan Semiconductor Manufacturing company Ltd.
PEI-HAW TSAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20200077515
Publication date
Mar 5, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei-Haw TSAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR