Pei-Haw Tsao

Person

Tai-Chung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package having warpage control
- Patent number 12,347,817
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heh-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 12,261,125
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heh-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing method for stacked semiconductor devices
- Patent number 12,237,226
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with polymer layer delamination prevention desi...
- Patent number 12,230,593
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and printed circuit board attachment
- Patent number 12,205,859
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out structures and methods for forming the same
- Patent number 12,159,847
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsui-Mei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and methods of forming thereof
- Patent number 12,051,624
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape system and components and methods of use
- Patent number 12,016,126
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic shielding material with insulator-coated ferromagnetic par...
- Patent number 11,990,423
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having warpage control and method of f...
- Patent number 11,978,729
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heh-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 11,804,445
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heh-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,798,860
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape system and methods of making and using the same
- Patent number 11,725,120
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Ming Kuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package and printed circuit board attachment
- Patent number 11,610,827
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out structures and methods for forming the same
- Patent number 11,527,499
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Tsui-Mei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having counductive bump with tapered portio...
- Patent number 11,495,556
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic shielding material with insulator-coated ferromagnetic par...
- Patent number 11,404,383
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,239,143
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape system and components and methods of use
- Patent number 11,240,947
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Sheng Chiu
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Carrier tape system and methods of using carrier tape system
- Patent number 11,164,763
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape system and methods of using carrier tape system
- Patent number 11,164,764
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bump structure and method of making semic...
- Patent number 11,127,704
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and printed circuit board attachment
- Patent number 11,101,190
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing method for stacked semiconductor devices
- Patent number 11,081,392
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,037,849
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a conductive bump with a plurality o...
- Patent number 11,018,099
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 10,912,194
- Issue date Feb 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic shielding material with insulator-coated ferromagnetic par...
- Patent number 10,892,230
- Issue date Jan 12, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip holder
- Patent number 10,879,098
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and printed circuit board attachment
- Patent number 10,867,881
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR
- Publication number 20250210536
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250174576
- Publication date May 29, 2025
- MEDIATEK INC.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
- Publication number 20250157955
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250112166
- Publication date Apr 3, 2025
- MEDIATEK INC.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20240395621
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE WITH WARPAGE CONTROL
- Publication number 20240379640
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MOISTURE PASSING GAP IN POWER OR GROUN...
- Publication number 20240347479
- Publication date Oct 17, 2024
- MEDIATEK INC.
- Chu-Chia Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240290737
- Publication date Aug 29, 2024
- MEDIATEK INC.
- Hung-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240243098
- Publication date Jul 18, 2024
- MEDIATEK INC.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240178159
- Publication date May 30, 2024
- MEDIATEK INC.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240178112
- Publication date May 30, 2024
- MEDIATEK INC.
- Yu-Tung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL
- Publication number 20240145448
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240112963
- Publication date Apr 4, 2024
- MEDIATEK INC.
- Yu-Tung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20230402324
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20230387101
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION
- Publication number 20230386954
- Publication date Nov 30, 2023
- MEDIATEK INC.
- Yu-Tung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR
- Publication number 20230378079
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME
- Publication number 20230340298
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Ming Kuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Package and Printed Circuit Board Attachment
- Publication number 20230230891
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
- Publication number 20230036317
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF F...
- Publication number 20230012350
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384377
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220352083
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220352103
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Tsui-Mei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC SHIELDING MATERIAL WITH INSULATOR-COATED FERROMAGNETIC PAR...
- Publication number 20220336370
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Hsing LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TAPE SYSTEM AND COMPONENTS AND METHODS OF USE
- Publication number 20220110232
- Publication date Apr 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Sheng CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing Method for Stacked Semiconductor Devices
- Publication number 20210358808
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20210343667
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Tsui-Mei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210305116
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME
- Publication number 20210134635
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Pei-Haw Tsao

Person

Patents Grantslast 30 patents

Semiconductor device package having warpage control

Method for forming chip package structure

Dicing method for stacked semiconductor devices

Wafer level package with polymer layer delamination prevention desi...

Package and printed circuit board attachment

Integrated fan-out structures and methods for forming the same

Stacked semiconductor devices and methods of forming thereof

Carrier tape system and components and methods of use

Magnetic shielding material with insulator-coated ferromagnetic par...

Semiconductor device package having warpage control and method of f...

Method for forming chip package structure

Semiconductor structure and manufacturing method thereof

Carrier tape system and methods of making and using the same

Package and printed circuit board attachment

Integrated fan-out structures and methods for forming the same

Semiconductor structure having counductive bump with tapered portio...

Magnetic shielding material with insulator-coated ferromagnetic par...

Semiconductor structure and manufacturing method thereof

Carrier tape system and components and methods of use

Carrier tape system and methods of using carrier tape system

Carrier tape system and methods of using carrier tape system

Semiconductor device with bump structure and method of making semic...

Package and printed circuit board attachment

Dicing method for stacked semiconductor devices

Semiconductor structure and manufacturing method thereof

Semiconductor structure having a conductive bump with a plurality o...

Printed circuit board

Magnetic shielding material with insulator-coated ferromagnetic par...

Semiconductor chip holder

Package and printed circuit board attachment

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...

FLIP CHIP PACKAGE AND FABRICATION METHOD THEREOF

DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES

METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE WITH WARPAGE CONTROL

SEMICONDUCTOR PACKAGE HAVING MOISTURE PASSING GAP IN POWER OR GROUN...

BUMP STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL

SEMICONDUCTOR STRUCTURE

DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES

Integrated Circuit Packages and Methods of Forming the Same

WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR

CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME

Package and Printed Circuit Board Attachment

WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...

SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF F...

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

INTEGRATED FAN-OUT STRUCTURES AND METHODS FOR FORMING THE SAME

MAGNETIC SHIELDING MATERIAL WITH INSULATOR-COATED FERROMAGNETIC PAR...

CARRIER TAPE SYSTEM AND COMPONENTS AND METHODS OF USE

Dicing Method for Stacked Semiconductor Devices

INTEGRATED FAN-OUT STRUCTURES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME