Peng-Jung Lee

Person

Tao Yuan Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structures
- Patent number 11,315,857
- Issue date Apr 26, 2022
- Delta Electronics, Inc.
- Peng-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging with multilayer conductive circuit
- Patent number 11,189,555
- Issue date Nov 30, 2021
- Delta Electronics, Inc.
- Peng-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of packaging device
- Patent number 11,049,796
- Issue date Jun 29, 2021
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures
- Patent number 10,892,210
- Issue date Jan 12, 2021
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging device and manufacturing method thereof
- Patent number 10,685,904
- Issue date Jun 16, 2020
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure having a via structure and fabrication th...
- Patent number 10,424,508
- Issue date Sep 24, 2019
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package having patterned insulation metal substrate
- Patent number 10,056,319
- Issue date Aug 21, 2018
- DELTA ELECTRONICS, INC.
- Chia-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package having patterned insulation metal substrate
- Patent number 9,905,439
- Issue date Feb 27, 2018
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package having patterned insulation metal substrate
- Patent number 9,865,531
- Issue date Jan 9, 2018
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 9,847,312
- Issue date Dec 19, 2017
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure
- Patent number 9,748,165
- Issue date Aug 29, 2017
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,431,327
- Issue date Aug 30, 2016
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having a lateral semiconductor device and a...
- Patent number 9,385,070
- Issue date Jul 5, 2016
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnection structure of package structure
- Patent number 9,275,982
- Issue date Mar 1, 2016
- Delta Electronics, Inc.
- Chia-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of package structure and method of formin...
- Patent number 9,209,164
- Issue date Dec 8, 2015
- Delta Electronics, Inc.
- Chia-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging device
- Patent number 9,177,957
- Issue date Nov 3, 2015
- Delta Electronics, Inc.
- Peng Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure having a via structure
- Patent number 9,159,699
- Issue date Oct 13, 2015
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package structure and method for manufacturing thereof
- Patent number 8,912,663
- Issue date Dec 16, 2014
- Delta Electronics, Inc.
- Chia-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURES
- Publication number 20210249338
- Publication date Aug 12, 2021
- Delta Electronics, Inc.
- Peng-Hsin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20210249339
- Publication date Aug 12, 2021
- Delta Electronics, Inc.
- Peng-Hsin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGING DEVICE
- Publication number 20200251405
- Publication date Aug 6, 2020
- Delta Electronics, Inc.
- Hsin-Chang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200243434
- Publication date Jul 30, 2020
- Delta Electronics, Inc.
- Peng-Hsin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FORMING METHOD OF THE SAME
- Publication number 20200243430
- Publication date Jul 30, 2020
- Delta Electronics, Inc.
- Peng-Hsin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20180096921
- Publication date Apr 5, 2018
- Delta Electronics, Inc.
- Hsin-Chang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE HAVING PATTERNED INSULATION METAL SUBSTRATE
- Publication number 20170317015
- Publication date Nov 2, 2017
- Delta Electronics, Inc.
- Chia-Yen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE HAVING PATTERNED INSULATION METAL SUBSTRATE
- Publication number 20170316955
- Publication date Nov 2, 2017
- Delta Electronics, Inc.
- Hsin-Chang TSAI
- B32 - LAYERED PRODUCTS
Information Patent Application
POWER MODULE PACKAGE HAVING PATTERNED INSULATION METAL SUBSTRATE
- Publication number 20170317014
- Publication date Nov 2, 2017
- Delta Electronics, Inc.
- Hsin-Chang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20170092570
- Publication date Mar 30, 2017
- Delta Electronics, Inc.
- Hsin-Chang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE
- Publication number 20160172281
- Publication date Jun 16, 2016
- Delta Electronics, Inc.
- Hsin-Chang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160148855
- Publication date May 26, 2016
- DELTA ELECTRONICS, INC.
- Hsin-Chang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150348889
- Publication date Dec 3, 2015
- DELTA ELECTRONICS, INC.
- Hsin-Chang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE HAVING A VIA STRUCTURE AND FABRICATION TH...
- Publication number 20150294910
- Publication date Oct 15, 2015
- Delta Electronics, Inc.
- Hsin-Chang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20150125995
- Publication date May 7, 2015
- Delta Electronics, Inc.
- Chia-Yen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT HAVING A LATERAL SEMICONDUCTOR DEVICE AND A...
- Publication number 20150001692
- Publication date Jan 1, 2015
- DELTA ELECTRONICS, INC.
- Hsin-Chang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20150001727
- Publication date Jan 1, 2015
- DELTA ELECTRONICS, INC.
- Chia-Yen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND FABRICATION THEREOF
- Publication number 20140131871
- Publication date May 15, 2014
- DELTA ELECTRONICS, INC.
- Hsin-Chang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20140131887
- Publication date May 15, 2014
- DELTA ELECTRONICS, INC.
- Chia-Yen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lamp tube illumination stabilization device
- Publication number 20030201732
- Publication date Oct 30, 2003
- Peng-Jung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Peng-Jung Lee

Person

Patents Grantslast 30 patents

Package structures

Chip packaging with multilayer conductive circuit

Manufacturing method of packaging device

Package structures

Packaging device and manufacturing method thereof

Interconnection structure having a via structure and fabrication th...

Power module package having patterned insulation metal substrate

Power module package having patterned insulation metal substrate

Power module package having patterned insulation metal substrate

Package structure

Packaging structure

Semiconductor device

Semiconductor component having a lateral semiconductor device and a...

Method of forming interconnection structure of package structure

Interconnection structure of package structure and method of formin...

Embedded packaging device

Interconnection structure having a via structure

Embedded package structure and method for manufacturing thereof

Patents Applicationslast 30 patents

PACKAGE STRUCTURES

PACKAGE STRUCTURES

MANUFACTURING METHOD OF PACKAGING DEVICE

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND FORMING METHOD OF THE SAME

PACKAGE STRUCTURES

POWER MODULE PACKAGE HAVING PATTERNED INSULATION METAL SUBSTRATE

POWER MODULE PACKAGE HAVING PATTERNED INSULATION METAL SUBSTRATE

POWER MODULE PACKAGE HAVING PATTERNED INSULATION METAL SUBSTRATE

PACKAGE STRUCTURE

PACKAGING STRUCTURE

PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

INTERCONNECTION STRUCTURE HAVING A VIA STRUCTURE AND FABRICATION TH...

METHOD OF FORMING PACKAGE STRUCTURE

SEMICONDUCTOR COMPONENT HAVING A LATERAL SEMICONDUCTOR DEVICE AND A...

EMBEDDED PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THEREOF

INTERCONNECTION STRUCTURE AND FABRICATION THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Lamp tube illumination stabilization device