PENG SUN

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Photosensitive array and imaging apparatus having the same
- Patent number 11,729,527
- Issue date Aug 15, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Kaiwei Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of image sensing device
- Patent number 11,107,856
- Issue date Aug 31, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Peng Sun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DICING METHOD, BONDING METHOD AND DIE
- Publication number 20240332079
- Publication date Oct 3, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE PIXEL CIRCUIT, IMAGE SENSOR, AND ELECTRONIC DEVICE
- Publication number 20240205564
- Publication date Jun 20, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Jun ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FA...
- Publication number 20240153911
- Publication date May 9, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yu ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY BLOCK AND CONTROL METHOD THEREOF
- Publication number 20240145005
- Publication date May 2, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- KAIWEI CAO
- G11 - INFORMATION STORAGE
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20240105532
- Publication date Mar 28, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Zhigang PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT MODULE AND FABRICATION METHOD...
- Publication number 20240038631
- Publication date Feb 1, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR MODELING AND SIMULATING ON-DIE CAPACITORS
- Publication number 20230177246
- Publication date Jun 8, 2023
- Yangtze Memory Technologies Co., Ltd.
- Peng SUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Structure
- Publication number 20230073118
- Publication date Mar 9, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Kaiwei CAO
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS AND SYSTEMS FOR AUTOMATIC WAVEFORM ANALYSIS
- Publication number 20230074806
- Publication date Mar 9, 2023
- Yangtze Memory Technologies Co., Ltd.
- Liqiang NI
- G01 - MEASURING TESTING
Information Patent Application
LARGE DIE WAFER, LARGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20220399282
- Publication date Dec 15, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE ARRAY AND IMAGING APPARATUS HAVING THE SAME
- Publication number 20220385845
- Publication date Dec 1, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Kaiwei CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF IMAGE SENSING DEVICE
- Publication number 20200013824
- Publication date Jan 9, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- PENG SUN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Photosensitive array and imaging apparatus having the same

Manufacturing method of image sensing device

Patents Applicationslast 30 patents

DICING METHOD, BONDING METHOD AND DIE

ACTIVE PIXEL CIRCUIT, IMAGE SENSOR, AND ELECTRONIC DEVICE

METHOD FOR FORMING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FA...

MEMORY BLOCK AND CONTROL METHOD THEREOF

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

THREE-DIMENSIONAL INTEGRATED CIRCUIT MODULE AND FABRICATION METHOD...

SYSTEM AND METHODS FOR MODELING AND SIMULATING ON-DIE CAPACITORS

Semiconductor Structure

METHODS AND SYSTEMS FOR AUTOMATIC WAVEFORM ANALYSIS

LARGE DIE WAFER, LARGE DIE AND METHOD OF FORMING THE SAME

PHOTOSENSITIVE ARRAY AND IMAGING APPARATUS HAVING THE SAME

MANUFACTURING METHOD OF IMAGE SENSING DEVICE