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Singapore Science Park 2, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Methods of TSV formation for advanced packaging
Patent number
11,854,886
Issue date
Dec 26, 2023
Applied Materials, Inc.
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor substrate having magnetic core inductor
Patent number
11,791,094
Issue date
Oct 17, 2023
Applied Materials, Inc.
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming through-silicon vias in substrates for advanced...
Patent number
11,404,318
Issue date
Aug 2, 2022
Applied Materials, Inc.
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a magnetic core on a substrate
Patent number
11,373,803
Issue date
Jun 28, 2022
Applied Materials, Inc.
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for forming vias in polymer layers
Patent number
10,636,696
Issue date
Apr 28, 2020
Applied Materials, Inc.
Yu Gu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for 3D MIM capacitor package processing
Patent number
10,475,735
Issue date
Nov 12, 2019
Applied Materials, Inc.
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Selective Deposition of Thin Films with Improved Stability
Publication number
20240110284
Publication date
Apr 4, 2024
Applied Materials, Inc.
Lulu XIONG
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHODS OF TSV FORMATION FOR ADVANCED PACKAGING
Publication number
20240087958
Publication date
Mar 14, 2024
Applied Materials, Inc.
Peng SUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF TSV FORMATION FOR ADVANCED PACKAGING
Publication number
20220328354
Publication date
Oct 13, 2022
Applied Materials, Inc.
Peng SUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING THROUGH-SILICON VIAS IN SUBSTRATES FOR ADVANCED...
Publication number
20220165621
Publication date
May 26, 2022
Applied Materials, Inc.
Peng SUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR SUBSTRATE HAVING MAGNETIC CORE INDUCTOR AND METHOD OF...
Publication number
20210233707
Publication date
Jul 29, 2021
Applied Materials, Inc.
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR WAFER-LEVEL PACKAGING USING DIRECT WRITING
Publication number
20210202334
Publication date
Jul 1, 2021
Applied Materials, Inc.
PENG SUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR REMOVING ABRASIVE PARTICLES
Publication number
20200306931
Publication date
Oct 1, 2020
Applied Materials, Inc.
PRAYUDI LIANTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR EMBEDDED ANTIFUSES
Publication number
20190287898
Publication date
Sep 19, 2019
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR SUBSTRATE HAVING MAGNETIC CORE INDUCTOR AND METHOD OF...
Publication number
20190051454
Publication date
Feb 14, 2019
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF INCREASING EMBEDDED 3D METAL-INSULATOR-METAL (MIM) CAPACI...
Publication number
20190051596
Publication date
Feb 14, 2019
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR 3D MIM CAPACITOR PACKAGE PROCESSING
Publication number
20180366401
Publication date
Dec 20, 2018
Peng Suo
H01 - BASIC ELECTRIC ELEMENTS