Peter A. Gruber

Person

Yorktown Heights, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic-assisted solder transfer
- Patent number 11,541,472
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Continuous solder transfer to substrates
- Patent number 11,110,534
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Injection molded microoptics
- Patent number 10,833,120
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Lawrence Jacobowitz
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 10,658,267
- Issue date May 19, 2020
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Injection molded microoptics
- Patent number 10,490,594
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Lawrence Jacobwitz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 9,972,556
- Issue date May 15, 2018
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced volume interconnect for three-dimensional chip stack
- Patent number 9,679,875
- Issue date Jun 13, 2017
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced volume interconnect for three-dimensional chip stack
- Patent number 9,543,273
- Issue date Jan 10, 2017
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded microoptics
- Patent number 9,490,408
- Issue date Nov 8, 2016
- International Business Machines Corporation
- Lawrence Jacobowitz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Double solder bumps on substrates for low temperature flip chip bon...
- Patent number 9,295,166
- Issue date Mar 22, 2016
- GLOBALFOUNDRIES Inc.
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fill head interface with combination vacuum pressure chamber
- Patent number 9,278,401
- Issue date Mar 8, 2016
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double solder bumps on substrates for low temperature flip chip bon...
- Patent number 9,095,081
- Issue date Jul 28, 2015
- International Business Machines Corporation
- Peter A. Gruber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 9,082,754
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double solder bumps on substrates for low temperature flip chip bon...
- Patent number 8,987,132
- Issue date Mar 24, 2015
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming metal preforms and metal balls
- Patent number 8,944,306
- Issue date Feb 3, 2015
- International Business Machines Corporation
- Peter A. Gruber
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Forming constant diameter spherical metal balls
- Patent number 8,875,978
- Issue date Nov 4, 2014
- International Business Machines Corporation
- Claudius Feger
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Forming an array of metal balls or shapes on a substrate
- Patent number 8,833,636
- Issue date Sep 16, 2014
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double solder bumps on substrates for low temperature flip chip bon...
- Patent number 8,828,860
- Issue date Sep 9, 2014
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus providing fine alignment of a structure relati...
- Patent number 8,820,616
- Issue date Sep 2, 2014
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microcavity structure and process
- Patent number 8,703,274
- Issue date Apr 22, 2014
- International Business Machines Corporation
- Russell A. Budd
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming metal preforms and metal balls
- Patent number 8,561,880
- Issue date Oct 22, 2013
- International Business Machines Corporation
- Peter Alfred Gruber
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Direct edge connection for multi-chip integrated circuits
- Patent number 8,551,816
- Issue date Oct 8, 2013
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect forming method
- Patent number 8,541,299
- Issue date Sep 24, 2013
- Ultratech, Inc.
- Stephen Leslie Buchwalter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus providing fine alignment of a structure relati...
- Patent number 8,528,805
- Issue date Sep 10, 2013
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming an array of metal balls or shapes on a substrate
- Patent number 8,523,046
- Issue date Sep 3, 2013
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct IMS (injection molded solder) without a mask for forming sol...
- Patent number 8,492,262
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Peter A. Gruber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnect structure
- Patent number 8,476,773
- Issue date Jul 2, 2013
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming constant diameter spherical metal balls
- Patent number 8,408,448
- Issue date Apr 2, 2013
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Injection molded solder method for forming solder bumps on substrates
- Patent number 8,381,962
- Issue date Feb 26, 2013
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-fluidic injection molded solder (IMS)
- Patent number 8,376,207
- Issue date Feb 19, 2013
- International Business Machines Corporation
- Stephen L. Buchwalter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ULTRASONIC-ASSISTED SOLDER TRANSFER
- Publication number 20210229203
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTINUOUS SOLDER TRANSFER TO SUBSTRATES
- Publication number 20200316702
- Publication date Oct 8, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INJECTION MOLDED MICROOPTICS
- Publication number 20200020738
- Publication date Jan 16, 2020
- International Business Machines Corporation
- Lawrence Jacobowitz
- B82 - NANO-TECHNOLOGY
Information Patent Application
METAL CORED SOLDER DECAL STRUCTURE AND PROCESS
- Publication number 20180174949
- Publication date Jun 21, 2018
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INJECTION MOLDED MICROOPTICS
- Publication number 20170033153
- Publication date Feb 2, 2017
- International Business Machines Corporation
- Lawrence Jacobowitz
- G02 - OPTICS
Information Patent Application
REDUCED VOLUME INTERCONNECT FOR THREE-DIMENSIONAL CHIP STACK
- Publication number 20160240501
- Publication date Aug 18, 2016
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED VOLUME INTERCONNECT FOR THREE-DIMENSIONAL CHIP STACK
- Publication number 20160211242
- Publication date Jul 21, 2016
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORED SOLDER DECAL STRUCTURE AND PROCESS
- Publication number 20150318251
- Publication date Nov 5, 2015
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...
- Publication number 20150195920
- Publication date Jul 9, 2015
- International Business Machines Corporation
- Peter A. Gruber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...
- Publication number 20150194408
- Publication date Jul 9, 2015
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...
- Publication number 20140363965
- Publication date Dec 11, 2014
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING CONSTANT DIAMETER SPHERICAL METAL BALLS
- Publication number 20140262113
- Publication date Sep 18, 2014
- International Business Machines Corporation
- CLAUDIUS FEGER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILL HEAD INTERFACE WITH COMBINATION VACUUM PRESSURE CHAMBER
- Publication number 20140224860
- Publication date Aug 14, 2014
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING AN ARRAY OF METAL BALLS OR SHAPES ON A SUBSTRATE
- Publication number 20140110462
- Publication date Apr 24, 2014
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INJECTION MOLDED MICROOPTICS
- Publication number 20140084314
- Publication date Mar 27, 2014
- International Business Machines Corporation
- Lawrence Jacobowitz
- B82 - NANO-TECHNOLOGY
Information Patent Application
DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...
- Publication number 20140065771
- Publication date Mar 6, 2014
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING METAL PREFORMS AND METAL BALLS
- Publication number 20140041824
- Publication date Feb 13, 2014
- International Business Machines Corporation
- PETER A. GRUBER
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METAL CORED SOLDER DECAL STRUCTURE AND PROCESS
- Publication number 20140035150
- Publication date Feb 6, 2014
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method And Apparatus Providing Fine Alignment Of A Structure Relati...
- Publication number 20130330568
- Publication date Dec 12, 2013
- Peter A. Gruber
- B32 - LAYERED PRODUCTS
Information Patent Application
Method And Apparatus Providing Fine Alignment Of A Structure Relati...
- Publication number 20130273339
- Publication date Oct 17, 2013
- Peter A. Gruber
- B32 - LAYERED PRODUCTS
Information Patent Application
FORMING METAL PREFORMS AND METAL BALLS
- Publication number 20130206351
- Publication date Aug 15, 2013
- International Business Machines Corporation
- PETER A. GRUBER
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SPHERICAL SOLDER REFLOW METHOD
- Publication number 20120273155
- Publication date Nov 1, 2012
- International Business Machines Corporation
- Peter A. Gruber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTISTACK SOLDER WAFER FILLING
- Publication number 20120234902
- Publication date Sep 20, 2012
- International Business Machines Corporation
- S. Jay Chey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...
- Publication number 20120205425
- Publication date Aug 16, 2012
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...
- Publication number 20120201596
- Publication date Aug 9, 2012
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct Edge Connection for Multi-Chip Integrated Circuits
- Publication number 20120187577
- Publication date Jul 26, 2012
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for Forming Solder Bump Interconnects
- Publication number 20120138769
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Micro-Fluidic Injection Molded Solder (IMS)
- Publication number 20120132694
- Publication date May 31, 2012
- International Business Machines Corporation
- Stephen L. Buchwalter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method And Apparatus Providing a Structure Relative to a Support
- Publication number 20120052263
- Publication date Mar 1, 2012
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...
- Publication number 20110272450
- Publication date Nov 10, 2011
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS

Peter A. Gruber

Person

Patents Grantslast 30 patents

Ultrasonic-assisted solder transfer

Continuous solder transfer to substrates

Injection molded microoptics

Metal cored solder decal structure and process

Injection molded microoptics

Metal cored solder decal structure and process

Reduced volume interconnect for three-dimensional chip stack

Reduced volume interconnect for three-dimensional chip stack

Injection molded microoptics

Double solder bumps on substrates for low temperature flip chip bon...

Fill head interface with combination vacuum pressure chamber

Double solder bumps on substrates for low temperature flip chip bon...

Metal cored solder decal structure and process

Double solder bumps on substrates for low temperature flip chip bon...

Forming metal preforms and metal balls

Forming constant diameter spherical metal balls

Forming an array of metal balls or shapes on a substrate

Double solder bumps on substrates for low temperature flip chip bon...

Method and apparatus providing fine alignment of a structure relati...

Microcavity structure and process

Forming metal preforms and metal balls

Direct edge connection for multi-chip integrated circuits

Electrical interconnect forming method

Method and apparatus providing fine alignment of a structure relati...

Forming an array of metal balls or shapes on a substrate

Direct IMS (injection molded solder) without a mask for forming sol...

Electrical interconnect structure

Forming constant diameter spherical metal balls

Injection molded solder method for forming solder bumps on substrates

Micro-fluidic injection molded solder (IMS)

Patents Applicationslast 30 patents

ULTRASONIC-ASSISTED SOLDER TRANSFER

CONTINUOUS SOLDER TRANSFER TO SUBSTRATES

INJECTION MOLDED MICROOPTICS

METAL CORED SOLDER DECAL STRUCTURE AND PROCESS

INJECTION MOLDED MICROOPTICS

REDUCED VOLUME INTERCONNECT FOR THREE-DIMENSIONAL CHIP STACK

REDUCED VOLUME INTERCONNECT FOR THREE-DIMENSIONAL CHIP STACK

METAL CORED SOLDER DECAL STRUCTURE AND PROCESS

DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...

DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...

DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...

FORMING CONSTANT DIAMETER SPHERICAL METAL BALLS

FILL HEAD INTERFACE WITH COMBINATION VACUUM PRESSURE CHAMBER

FORMING AN ARRAY OF METAL BALLS OR SHAPES ON A SUBSTRATE

INJECTION MOLDED MICROOPTICS

DOUBLE SOLDER BUMPS ON SUBSTRATES FOR LOW TEMPERATURE FLIP CHIP BON...

FORMING METAL PREFORMS AND METAL BALLS

METAL CORED SOLDER DECAL STRUCTURE AND PROCESS

Method And Apparatus Providing Fine Alignment Of A Structure Relati...

Method And Apparatus Providing Fine Alignment Of A Structure Relati...

FORMING METAL PREFORMS AND METAL BALLS

SPHERICAL SOLDER REFLOW METHOD

MULTISTACK SOLDER WAFER FILLING

MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...

MODIFICATION OF SOLDER ALLOY COMPOSITIONS TO SUPPRESS INTERFACIAL V...

Direct Edge Connection for Multi-Chip Integrated Circuits

Techniques for Forming Solder Bump Interconnects

Micro-Fluidic Injection Molded Solder (IMS)

Method And Apparatus Providing a Structure Relative to a Support

DIE LEVEL INTEGRATED INTERCONNECT DECAL MANUFACTURING METHOD AND AP...