Peter E. Kukanskis

Person

Naugatuck, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number RE45881
- Issue date Feb 9, 2016
- Ronald Redline
- 001 -
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number RE45842
- Issue date Jan 12, 2016
- Ronald Redline
- 001 -
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number RE45297
- Issue date Dec 23, 2014
- Ronald Redline
- 228 - Metal fusion bonding
Information Patent Grant
Polyimide substrate and method of manufacturing printed wiring boar...
- Patent number 7,666,471
- Issue date Feb 23, 2010
- Mark Wojtaszek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for the manufacture of printed circuit boards with plated re...
- Patent number 7,279,108
- Issue date Oct 9, 2007
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number 7,267,259
- Issue date Sep 11, 2007
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the manufacture of printed circuit boards with plated re...
- Patent number 7,034,231
- Issue date Apr 25, 2006
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integral plated resistor and method for the manufacture of printed...
- Patent number 7,022,464
- Issue date Apr 4, 2006
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number 6,905,587
- Issue date Jun 14, 2005
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the manufacture of printed circuit boards with integral...
- Patent number 6,767,445
- Issue date Jul 27, 2004
- Peter Kukanskis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for the manufacture of printed circuit boards with plated re...
- Patent number 6,585,904
- Issue date Jul 1, 2003
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number 6,544,397
- Issue date Apr 8, 2003
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux composition and corresponding soldering method
- Patent number 6,474,536
- Issue date Nov 5, 2002
- Peter Kukanskis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number 6,444,109
- Issue date Sep 3, 2002
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the manufacture of printed circuit boards with plated re...
- Patent number 6,281,090
- Issue date Aug 28, 2001
- MacDermid, Incorporated
- Peter Kukanskis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number 6,200,451
- Issue date Mar 13, 2001
- MacDermid, Incorporated
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for plating upon a polymeric surface
- Patent number 6,168,836
- Issue date Jan 2, 2001
- MacDermid, Incorporated
- Peter Kukanskis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for the manufacture of printed circuit boards
- Patent number 5,869,126
- Issue date Feb 9, 1999
- MacDermid, Inc.
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photodefinable dielectric composition useful in the manufacture of...
- Patent number 5,763,140
- Issue date Jun 9, 1998
- MacDermid, Incorporated
- Peter Kukanskis
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for the manufacture of printed circuit boards
- Patent number 5,693,364
- Issue date Dec 2, 1997
- Mac Dermid, Incorporated
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for preparing a non-conductive substrate for electroplating
- Patent number 5,674,372
- Issue date Oct 7, 1997
- Mac Dermid, Incorporated
- Peter Kukanskis
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Photodefinable dielectric composition useful in the manufacture of...
- Patent number 5,654,126
- Issue date Aug 5, 1997
- MacDermid, Incorporated
- Peter Kukanskis
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for creating circuitry on the surface of a photoimageable d...
- Patent number 5,648,200
- Issue date Jul 15, 1997
- MacDermid, Incorporated
- Raymond Letize
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for the manufacture of printed circuit boards
- Patent number 5,620,612
- Issue date Apr 15, 1997
- MacDermid, Incorporated
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for plating metals onto various substrates in an adherent f...
- Patent number 5,547,559
- Issue date Aug 20, 1996
- MacDermid, Incorporated
- Peter Kukanskis
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Photodefinable dielectric composition useful in the manufacture of...
- Patent number 5,545,510
- Issue date Aug 13, 1996
- Mac Dermid, Inc.
- Peter Kukanskis
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Composition and process for treatment of metallic surfaces
- Patent number 5,376,189
- Issue date Dec 27, 1994
- MacDermid, Incorporated
- Peter E. Kukanskis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for improving adhesion to polymide surfaces
- Patent number 5,213,840
- Issue date May 25, 1993
- MacDermid, Incorporated
- Richard C. Retallick
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition for preparing printed circuit through-holes for metalli...
- Patent number 5,132,038
- Issue date Jul 21, 1992
- MacDermid, Incorporated
- Peter E. Kukanskis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating process and apparatus
- Patent number 5,077,099
- Issue date Dec 31, 1991
- MacDermid, Incorporated
- Peter E. Kukanskis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method for the manufacture of printed circuit boards with plated re...
- Publication number 20080003351
- Publication date Jan 3, 2008
- MacDermid, Incorporated
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polyimide substrate and method of manufacturing printed wiring boar...
- Publication number 20070224346
- Publication date Sep 27, 2007
- Mark Wojtaszek
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for the manufacture of printed circuit boards with plated re...
- Publication number 20060124583
- Publication date Jun 15, 2006
- MacDermid, Incorporated
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRAL PLATED RESISTOR AND METHOD FOR THE MANUFACTURE OF PRINTED...
- Publication number 20060046202
- Publication date Mar 2, 2006
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the manufacture of printed circuit boards with embedded...
- Publication number 20040245210
- Publication date Dec 9, 2004
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the manufacture of printed circuit boards with integral...
- Publication number 20040076743
- Publication date Apr 22, 2004
- Peter Kukanskis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for enhancing the solderability of a surface
- Publication number 20030209446
- Publication date Nov 13, 2003
- MacDermid Incorporated
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the manufacture of printed circuit boards with plated re...
- Publication number 20030205551
- Publication date Nov 6, 2003
- MacDermid, Incorporated
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for enhancing the solderability of a surface
- Publication number 20030118742
- Publication date Jun 26, 2003
- MacDermid, Incorporated
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the manufacture of printed circuit boards with plated re...
- Publication number 20020135459
- Publication date Sep 26, 2002
- Peter Kukanskis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for enhancing the solderability of a surface
- Publication number 20010016232
- Publication date Aug 23, 2001
- Ronald Redline
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Peter E. Kukanskis

Person

Patents Grantslast 30 patents

Method for enhancing the solderability of a surface

Method for enhancing the solderability of a surface

Method for enhancing the solderability of a surface

Polyimide substrate and method of manufacturing printed wiring boar...

Method for the manufacture of printed circuit boards with plated re...

Method for enhancing the solderability of a surface

Method for the manufacture of printed circuit boards with plated re...

Integral plated resistor and method for the manufacture of printed...

Method for enhancing the solderability of a surface

Method for the manufacture of printed circuit boards with integral...

Method for the manufacture of printed circuit boards with plated re...

Method for enhancing the solderability of a surface

Flux composition and corresponding soldering method

Method for enhancing the solderability of a surface

Method for the manufacture of printed circuit boards with plated re...

Method for enhancing the solderability of a surface

Process for plating upon a polymeric surface

Process for the manufacture of printed circuit boards

Photodefinable dielectric composition useful in the manufacture of...

Method for the manufacture of printed circuit boards

Process for preparing a non-conductive substrate for electroplating

Photodefinable dielectric composition useful in the manufacture of...

Process for creating circuitry on the surface of a photoimageable d...

Method for the manufacture of printed circuit boards

Process for plating metals onto various substrates in an adherent f...

Photodefinable dielectric composition useful in the manufacture of...

Composition and process for treatment of metallic surfaces

Method for improving adhesion to polymide surfaces

Composition for preparing printed circuit through-holes for metalli...

Electroless copper plating process and apparatus

Patents Applicationslast 30 patents

Method for the manufacture of printed circuit boards with plated re...

Polyimide substrate and method of manufacturing printed wiring boar...

Method for the manufacture of printed circuit boards with plated re...

INTEGRAL PLATED RESISTOR AND METHOD FOR THE MANUFACTURE OF PRINTED...

Method for the manufacture of printed circuit boards with embedded...

Method for the manufacture of printed circuit boards with integral...

Method for enhancing the solderability of a surface

Method for the manufacture of printed circuit boards with plated re...

Method for enhancing the solderability of a surface

Method for the manufacture of printed circuit boards with plated re...

Method for enhancing the solderability of a surface