Peter R. Ewer

Person

Surrey, GB

People

Patents Grantslast 30 patents

Information Patent Grant
High current capacity semiconductor device package and lead frame w...
- Patent number 6,667,547
- Issue date Dec 23, 2003
- International Rectifier Corporation
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel-iron expansion contact for semiconductor die
- Patent number 6,512,304
- Issue date Jan 28, 2003
- International Rectifier Corporation
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current capacity semiconductor device package and lead frame w...
- Patent number 6,476,481
- Issue date Nov 5, 2002
- International Rectifier Corporation
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with plural pad lead frame
- Patent number 6,465,875
- Issue date Oct 15, 2002
- International Rectifier Corporation
- Glyn Connah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package
- Patent number 6,396,091
- Issue date May 28, 2002
- International Rectifier Corporation
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current semiconductor device package with plastic housing and...
- Patent number 6,348,727
- Issue date Feb 19, 2002
- International Rectifier Corporation
- Paul C. Westmarland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale packaging process
- Patent number 6,281,096
- Issue date Aug 28, 2001
- International Rectifier Corp.
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current capacity semiconductor device housing
- Patent number 6,255,722
- Issue date Jul 3, 2001
- International Rectifier Corp.
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount semiconductor package
- Patent number 6,204,554
- Issue date Mar 20, 2001
- International Rectifier Corporation
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crushable bead on lead finger side surface to improve moldability
- Patent number 6,078,098
- Issue date Jun 20, 2000
- International Rectifier Corp.
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress clip design
- Patent number 6,075,286
- Issue date Jun 13, 2000
- International Rectifier Corporation
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plural semiconductor die housed in common package with split heat sink
- Patent number 5,977,630
- Issue date Nov 2, 1999
- International Rectifier Corp.
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount semiconductor package
- Patent number 5,905,304
- Issue date May 18, 1999
- International Rectifier Corporation
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with waffled front and rear surfaces
- Patent number 5,902,959
- Issue date May 11, 1999
- International Rectifier Corporation
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crushable bead on lead finger side surface to improve moldability
- Patent number 5,886,397
- Issue date Mar 23, 1999
- International Rectifier Corporation
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount semiconductor package
- Patent number 5,763,949
- Issue date Jun 9, 1998
- International Rectifier Corporation
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount semiconductor package
- Patent number 5,760,472
- Issue date Jun 2, 1998
- International Rectifier Corporation
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated gate bipolar transistor power module
- Patent number 4,965,710
- Issue date Oct 23, 1990
- International Rectifier Corporation
- Brian R. Pelly
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semi-conductor modules
- Patent number 4,853,762
- Issue date Aug 1, 1989
- International Rectifier Corporation
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High current capacity semiconductor device package and lead frame w...
- Publication number 20030011051
- Publication date Jan 16, 2003
- International Rectifier Corporation
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder composition for high temperature semiconductor device
- Publication number 20020012609
- Publication date Jan 31, 2002
- International Rectifier Corporation
- Peter R. Ewer
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HIGH CURRENT CAPACITY SEMICONDUCTOR DEVICE PACKAGE AND LEAD FRAME W...
- Publication number 20010054752
- Publication date Dec 27, 2001
- ARTHUR WOODWORTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package with plural pad lead frame
- Publication number 20010045627
- Publication date Nov 29, 2001
- International Rectifier Corp.
- Glyn Connah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip scale package
- Publication number 20010036695
- Publication date Nov 1, 2001
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nickel-iron expansion contact for semiconductor die
- Publication number 20010033022
- Publication date Oct 25, 2001
- International Rectifier Corp.
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS

Peter R. Ewer

Person

Patents Grantslast 30 patents

High current capacity semiconductor device package and lead frame w...

Nickel-iron expansion contact for semiconductor die

High current capacity semiconductor device package and lead frame w...

Semiconductor device package with plural pad lead frame

Chip scale package

High current semiconductor device package with plastic housing and...

Chip scale packaging process

High current capacity semiconductor device housing

Surface mount semiconductor package

Crushable bead on lead finger side surface to improve moldability

Stress clip design

Plural semiconductor die housed in common package with split heat sink

Surface mount semiconductor package

Lead frame with waffled front and rear surfaces

Crushable bead on lead finger side surface to improve moldability

Surface-mount semiconductor package

Surface mount semiconductor package

Insulated gate bipolar transistor power module

Semi-conductor modules

Patents Applicationslast 30 patents

High current capacity semiconductor device package and lead frame w...

Solder composition for high temperature semiconductor device

HIGH CURRENT CAPACITY SEMICONDUCTOR DEVICE PACKAGE AND LEAD FRAME W...

Semiconductor device package with plural pad lead frame

Chip scale package

Nickel-iron expansion contact for semiconductor die