Peter Slota Jr.

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 11,049,819
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Reduced-warpage laminate structure
- Patent number 10,685,919
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 10,553,544
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 9,935,058
- Issue date Apr 3, 2018
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced-warpage laminate structure
- Patent number 9,613,915
- Issue date Apr 4, 2017
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit for detecting structural defects in an integrated circuit c...
- Patent number 9,599,664
- Issue date Mar 21, 2017
- GLOBALFOUNDRIES Inc.
- Luke D. Lacroix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced-warpage laminate structure
- Patent number 9,543,255
- Issue date Jan 10, 2017
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 9,531,209
- Issue date Dec 27, 2016
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Packages for three-dimensional die stacks
- Patent number 9,252,101
- Issue date Feb 2, 2016
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 9,245,854
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Inc.
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 9,209,141
- Issue date Dec 8, 2015
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced three-dimensional integrated circuit package
- Patent number 9,190,399
- Issue date Nov 17, 2015
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having off-axis in-hole capacitor
- Patent number 9,185,807
- Issue date Nov 10, 2015
- GlobalFoundries U.S. 2 LLC
- Mark C. Lamorey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit structures having off-axis in-hole capacitor and...
- Patent number 9,078,373
- Issue date Jul 7, 2015
- International Business Machines Corporation
- Mark C. Lamorey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit for detecting structural defects in an integrated circuit c...
- Patent number 9,057,760
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Luke D. Lacroix
- G01 - MEASURING TESTING
Information Patent Grant
Packages for three-dimensional die stacks
- Patent number 9,059,127
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution for 3D semiconductor package
- Patent number 9,018,040
- Issue date Apr 28, 2015
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated via structures
- Patent number 8,999,846
- Issue date Apr 7, 2015
- International Business Machines Corporation
- Luke D. LaCroix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 8,952,503
- Issue date Feb 10, 2015
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated via structures
- Patent number 8,759,977
- Issue date Jun 24, 2014
- International Business Machines Corporation
- Luke D. LaCroix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for monitoring stress induced failures in interlevel diel...
- Patent number 8,653,662
- Issue date Feb 18, 2014
- International Business Machines Corporation
- Luke D. LaCroix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor test chip device to mimic field thermal mini-cycles t...
- Patent number 8,586,982
- Issue date Nov 19, 2013
- International Business Machines Corporation
- Luke D. LaCroix
- G01 - MEASURING TESTING
Information Patent Grant
Uniform solder reflow fixture
- Patent number 8,444,043
- Issue date May 21, 2013
- International Business Machines Corporation
- William E. Bernier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wet etching of thermally or chemically cured polyimide
- Patent number 4,846,929
- Issue date Jul 11, 1989
- IBM Corporation
- Steven L. Bard
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Roughening surface of a substrate
- Patent number 4,615,763
- Issue date Oct 7, 1986
- International Business Machines Corporation
- Jeffrey D. Gelorme
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
- Publication number 20200083177
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
- Publication number 20180068957
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED-WARPAGE LAMINATE STRUCTURE
- Publication number 20170148749
- Publication date May 25, 2017
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
- Publication number 20170125358
- Publication date May 4, 2017
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED-WARPAGE LAMINATE STRUCTURE
- Publication number 20160155708
- Publication date Jun 2, 2016
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED-WARPAGE LAMINATE STRUCTURE
- Publication number 20160157357
- Publication date Jun 2, 2016
- International Business Machines Corporation
- Mark C. Lamorey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
- Publication number 20150349565
- Publication date Dec 3, 2015
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THERMALLY ENHANCED THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGE
- Publication number 20150255441
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT FOR DETECTING STRUCTURAL DEFECTS IN AN INTEGRATED CIRCUIT C...
- Publication number 20150247896
- Publication date Sep 3, 2015
- International Business Machines Corporation
- Luke D. Lacroix
- G01 - MEASURING TESTING
Information Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
- Publication number 20150243609
- Publication date Aug 27, 2015
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING OFF-AXIS IN-HOLE CAPACITOR
- Publication number 20150245491
- Publication date Aug 27, 2015
- International Business Machines Corporation
- Mark C. Lamorey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGES FOR THREE-DIMENSIONAL DIE STACKS
- Publication number 20150214155
- Publication date Jul 30, 2015
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING OFF-AXIS IN-HOLE CAPACITOR AND...
- Publication number 20150195914
- Publication date Jul 9, 2015
- International Business Machines Corporation
- Mark C. Lamorey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGES FOR THREE-DIMENSIONAL DIE STACKS
- Publication number 20150194364
- Publication date Jul 9, 2015
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION FOR 3D SEMICONDUCTOR PACKAGE
- Publication number 20150091131
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS
- Publication number 20150033554
- Publication date Feb 5, 2015
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELONGATED VIA STRUCTURES
- Publication number 20140227874
- Publication date Aug 14, 2014
- International Business Machines Corporation
- Luke D. LaCroix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS
- Publication number 20140210059
- Publication date Jul 31, 2014
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MONITORING STRESS INDUCED FAILURES IN INTE...
- Publication number 20130292817
- Publication date Nov 7, 2013
- International Business Machines Corporation
- Luke D. LaCroix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELONGATED VIA STRUCTURES
- Publication number 20130285251
- Publication date Oct 31, 2013
- International Business Machines Corporation
- Luke D. LaCroix
- H01 - BASIC ELECTRIC ELEMENTS

Peter Slota Jr.

Person

Patents Grantslast 30 patents

Shielded package assemblies with integrated capacitor

Reduced-warpage laminate structure

Shielded package assemblies with integrated capacitor

Shielded package assemblies with integrated capacitor

Reduced-warpage laminate structure

Circuit for detecting structural defects in an integrated circuit c...

Reduced-warpage laminate structure

Shielded package assemblies with integrated capacitor

Packages for three-dimensional die stacks

Organic module EMI shielding structures and methods

Shielded package assemblies with integrated capacitor

Thermally enhanced three-dimensional integrated circuit package

Integrated circuit structures having off-axis in-hole capacitor

Integrated circuit structures having off-axis in-hole capacitor and...

Circuit for detecting structural defects in an integrated circuit c...

Packages for three-dimensional die stacks

Power distribution for 3D semiconductor package

Elongated via structures

Organic module EMI shielding structures and methods

Elongated via structures

Structure for monitoring stress induced failures in interlevel diel...

Semiconductor test chip device to mimic field thermal mini-cycles t...

Uniform solder reflow fixture

Wet etching of thermally or chemically cured polyimide

Roughening surface of a substrate

Patents Applicationslast 30 patents

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

REDUCED-WARPAGE LAMINATE STRUCTURE

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

REDUCED-WARPAGE LAMINATE STRUCTURE

REDUCED-WARPAGE LAMINATE STRUCTURE

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

THERMALLY ENHANCED THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGE

CIRCUIT FOR DETECTING STRUCTURAL DEFECTS IN AN INTEGRATED CIRCUIT C...

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

INTEGRATED CIRCUIT STRUCTURES HAVING OFF-AXIS IN-HOLE CAPACITOR

PACKAGES FOR THREE-DIMENSIONAL DIE STACKS

INTEGRATED CIRCUIT STRUCTURES HAVING OFF-AXIS IN-HOLE CAPACITOR AND...

PACKAGES FOR THREE-DIMENSIONAL DIE STACKS

POWER DISTRIBUTION FOR 3D SEMICONDUCTOR PACKAGE

ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS

ELONGATED VIA STRUCTURES

ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS

STRUCTURE AND METHOD FOR MONITORING STRESS INDUCED FAILURES IN INTE...

ELONGATED VIA STRUCTURES