Number | Name | Date | Kind |
---|---|---|---|
2663663 | Weltman et al. | Dec 1953 | |
3625758 | Stahl et al. | Dec 1971 | |
3795557 | Jacob | Mar 1974 | |
3801427 | Morishita et al. | Apr 1974 | |
3884771 | Hanabusa et al. | May 1975 | |
3978252 | Lombardo et al. | Aug 1976 | |
4113899 | Henry et al. | Sep 1978 | |
4147564 | Magee et al. | Apr 1979 | |
4152477 | Haruta et al. | May 1979 | |
4180432 | Clark | Dec 1979 | |
4216246 | Iwasaki et al. | Aug 1980 | |
4281038 | Ambros et al. | Jul 1981 | |
4283249 | Ephrath | Aug 1981 | |
4325991 | Donovan | Apr 1982 | |
4469777 | O'Neil | Sep 1984 |
Entry |
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IBM Technical Disclosure Bulletin, vol. 26, No. 2, Jul. 1983, Method of Improving the Adhesive of Copper on a Plastic Laminate, H. Bohlen, pp. 673-674. |
Robin H. Wheater et al., "Polymer Interlayer Adhesion Enhancements Through Plasma Surface Modification". |