Peter Wrschka

Person

Danbury, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fluid processing systems and methods
- Patent number 9,586,188
- Issue date Mar 7, 2017
- Entegris, Inc.
- Steven M. Lurcott
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Fluid processing systems and methods
- Patent number 9,038,855
- Issue date May 26, 2015
- Advanced Technology Materials, Inc.
- Steven M. Lurcott
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Grant
Systems and methods for delivery of fluid-containing process materi...
- Patent number 8,507,382
- Issue date Aug 13, 2013
- Foresight Processing, LLC
- John E. Q. Hughes
- B24 - GRINDING POLISHING
Information Patent Grant
High throughput chemical mechanical polishing composition for metal...
- Patent number 8,304,344
- Issue date Nov 6, 2012
- Advanced Technology Materials, Inc.
- Karl E. Boggs
- B24 - GRINDING POLISHING
Information Patent Grant
Method of passivating chemical mechanical polishing compositions fo...
- Patent number 8,236,695
- Issue date Aug 7, 2012
- Advanced Technology Materials, Inc.
- Jun Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical mechanical polishing compositions for copper and associate...
- Patent number 7,736,405
- Issue date Jun 15, 2010
- Advanced Technology Materials, Inc.
- Michael Darsillo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Passivative chemical mechanical polishing composition for copper fi...
- Patent number 7,300,601
- Issue date Nov 27, 2007
- Advanced Technology Materials, Inc.
- Jun Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integration scheme for metal gap fill, with fixed abrasive CMP
- Patent number 6,943,114
- Issue date Sep 13, 2005
- Infineon Technologies AG
- Peter Wrschka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing (CMP) process using fixed abrasive pads
- Patent number 6,899,597
- Issue date May 31, 2005
- Infineon Technologies AG
- Peter Wrschka
- B24 - GRINDING POLISHING
Information Patent Grant
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Patent number 6,740,539
- Issue date May 25, 2004
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Patent number 6,570,256
- Issue date May 27, 2003
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER CLEANING AND PROTECTION FORMULATIONS
- Publication number 20160075971
- Publication date Mar 17, 2016
- Advanced Technology Materials, Inc.
- Jun LIU
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
FLUID PROCESSING SYSTEMS AND METHODS
- Publication number 20150321897
- Publication date Nov 12, 2015
- Advanced Technology Materials, Inc.
- Steven M. LURCOTT
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
FLUID PROCESSING SYSTEMS AND METHODS
- Publication number 20120138631
- Publication date Jun 7, 2012
- Advanced Technology Materials, Inc.
- Steven M. Lurcott
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Application
SYSTEMS AND METHODS FOR DELIVERY OF FLUID-CONTAINING PROCESS MATERI...
- Publication number 20110008964
- Publication date Jan 13, 2011
- FORESIGHT PROCESSING, LLC
- John E.Q. Hughes
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING COMPOSITIONS FOR COPPER AND ASSOCIATE...
- Publication number 20100248480
- Publication date Sep 30, 2010
- Advanced Technology Materials Inc.
- Michael Darsillo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STABILIZATION OF POLYMER-SILICA DISPERSIONS FOR CHEMICAL MECHANICAL...
- Publication number 20100087065
- Publication date Apr 8, 2010
- Advanced Technology Materials, Inc.
- Karl E. Boggs
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTEGRATED CHEMICAL MECHANICAL POLISHING COMPOSITION AND PROCESS FO...
- Publication number 20090215269
- Publication date Aug 27, 2009
- Advanced Technology Materials Inc.
- Karl E. Boggs
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PASSIVATING CHEMICAL MECHANICAL POLISHING COMPOSITIONS FO...
- Publication number 20090137122
- Publication date May 28, 2009
- Advanced Technology Materials, Inc.
- Jun Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH THROUGHPUT CHEMICAL MECHANICAL POLISHING COMPOSITION FOR METAL...
- Publication number 20080254628
- Publication date Oct 16, 2008
- Advanced Technology Materials, Inc.
- Karl E. Boggs
- B24 - GRINDING POLISHING
Information Patent Application
PASSIVATIVE CHEMICAL MECHANICAL POLISHING COMPOSITION FOR COPPER FI...
- Publication number 20070181852
- Publication date Aug 9, 2007
- Jun Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Chemical mechanical polishing compositions for step-ll copper line...
- Publication number 20060249482
- Publication date Nov 9, 2006
- Peter Wrschka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Chemical mechanical polishing (CMP) process using fixed abrasive pads
- Publication number 20050014454
- Publication date Jan 20, 2005
- Infineon Technologies North America Corp.
- Peter Wrschka
- B24 - GRINDING POLISHING
Information Patent Application
Integration scheme for metal gap fill, with fixed abrasive CMP
- Publication number 20040248399
- Publication date Dec 9, 2004
- Infineon Technologies North America Corp.
- Peter Wrschka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical mechanical polishing compositions for copper and associate...
- Publication number 20040229461
- Publication date Nov 18, 2004
- Michael Darsillo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Passivative chemical mechanical polishing composition for copper fi...
- Publication number 20040108302
- Publication date Jun 10, 2004
- Jun Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integration scheme for metal gap fill with HDP and fixed abrasive CMP
- Publication number 20030186551
- Publication date Oct 2, 2003
- Infineon Technologies North America Corp.
- Peter Wrschka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Publication number 20030153198
- Publication date Aug 14, 2003
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon-graded layer for improved adhesion of low-k dielectrics to s...
- Publication number 20030017642
- Publication date Jan 23, 2003
- International Business Machines Corporation
- Richard A. Conti
- H01 - BASIC ELECTRIC ELEMENTS

Peter Wrschka

Person

Patents Grantslast 30 patents

Fluid processing systems and methods

Fluid processing systems and methods

Systems and methods for delivery of fluid-containing process materi...

High throughput chemical mechanical polishing composition for metal...

Method of passivating chemical mechanical polishing compositions fo...

Chemical mechanical polishing compositions for copper and associate...

Passivative chemical mechanical polishing composition for copper fi...

Integration scheme for metal gap fill, with fixed abrasive CMP

Chemical mechanical polishing (CMP) process using fixed abrasive pads

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Patents Applicationslast 30 patents

COPPER CLEANING AND PROTECTION FORMULATIONS

FLUID PROCESSING SYSTEMS AND METHODS

FLUID PROCESSING SYSTEMS AND METHODS

SYSTEMS AND METHODS FOR DELIVERY OF FLUID-CONTAINING PROCESS MATERI...

CHEMICAL MECHANICAL POLISHING COMPOSITIONS FOR COPPER AND ASSOCIATE...

STABILIZATION OF POLYMER-SILICA DISPERSIONS FOR CHEMICAL MECHANICAL...

INTEGRATED CHEMICAL MECHANICAL POLISHING COMPOSITION AND PROCESS FO...

METHOD OF PASSIVATING CHEMICAL MECHANICAL POLISHING COMPOSITIONS FO...

HIGH THROUGHPUT CHEMICAL MECHANICAL POLISHING COMPOSITION FOR METAL...

PASSIVATIVE CHEMICAL MECHANICAL POLISHING COMPOSITION FOR COPPER FI...

Chemical mechanical polishing compositions for step-ll copper line...

Chemical mechanical polishing (CMP) process using fixed abrasive pads

Integration scheme for metal gap fill, with fixed abrasive CMP

Chemical mechanical polishing compositions for copper and associate...

Passivative chemical mechanical polishing composition for copper fi...

Integration scheme for metal gap fill with HDP and fixed abrasive CMP

Carbon-graded layer for improved adhesion of low-k dielectrics to s...

Carbon-graded layer for improved adhesion of low-k dielectrics to s...