Pezhman Monadgemi

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally efficient semiconductor device assemblies including inter...
- Patent number 12,191,284
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Pezhman Monadgemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally efficient semiconductor device assemblies including inter...
- Patent number 11,742,328
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Pezhman Monadgemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale apertures having islands of functionality
- Patent number 10,562,766
- Issue date Feb 18, 2020
- Pacific Biosciences of California, Inc.
- Stephen Turner
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and structures for heat dissipating interposers
- Patent number 10,475,733
- Issue date Nov 12, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BVA interposer
- Patent number 10,297,582
- Issue date May 21, 2019
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a carrier-less silicon interposer
- Patent number 10,181,411
- Issue date Jan 15, 2019
- Invensas Corporation
- Michael Newman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structures for heat dissipating interposers
- Patent number 10,103,094
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making high multiplex arrays
- Patent number 9,689,800
- Issue date Jun 27, 2017
- Pacific Biosciences of California, Inc.
- Denis Zaccarin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structures for heat dissipating interposers
- Patent number 9,685,401
- Issue date Jun 20, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale apertures having islands of functionality
- Patent number 9,637,380
- Issue date May 2, 2017
- Pacific Biosciences of California, Inc.
- Stephen Turner
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thin wafer handling and known good die test method
- Patent number 9,601,398
- Issue date Mar 21, 2017
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BVA interposer
- Patent number 9,502,390
- Issue date Nov 22, 2016
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal PVD-free conducting structures
- Patent number 9,379,008
- Issue date Jun 28, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structure for carrier-less thin wafer handling
- Patent number 9,355,905
- Issue date May 31, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures formed using monocrystalline silicon and/or other materi...
- Patent number 9,323,010
- Issue date Apr 26, 2016
- Invensas Corporation
- Valentin Kosenko
- G02 - OPTICS
Information Patent Grant
Surface modified TSV structure and methods thereof
- Patent number 9,312,175
- Issue date Apr 12, 2016
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-less silicon interposer
- Patent number 9,237,648
- Issue date Jan 12, 2016
- Invensas Corporation
- Michael Newman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for forming MEMS assemblies incorporating getters
- Patent number 9,212,051
- Issue date Dec 15, 2015
- Western Digital (Fremont), LLC
- Pezhman Monadgemi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structures for heat dissipating interposers
- Patent number 9,123,780
- Issue date Sep 1, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a device substrate
- Patent number 9,099,482
- Issue date Aug 4, 2015
- Invensas Corporation
- Pezhman Monadgemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structure for carrier-less thin wafer handling
- Patent number 9,064,933
- Issue date Jun 23, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for edge-emitting diode package having deflect...
- Patent number 9,008,139
- Issue date Apr 14, 2015
- JDS Uniphase Corporation
- Pezhman Monadgemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High multiplex arrays and systems
- Patent number 8,993,307
- Issue date Mar 31, 2015
- Pacific Biosciences of California, Inc.
- Denis Zaccarin
- G01 - MEASURING TESTING
Information Patent Grant
Metal PVD-free conducting structures
- Patent number 8,981,564
- Issue date Mar 17, 2015
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for providing a laser cavity for an energy assist...
- Patent number 8,877,358
- Issue date Nov 4, 2014
- Western Digital (Fremont), LLC
- Lei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for providing a laser submount for an energy assi...
- Patent number 8,860,216
- Issue date Oct 14, 2014
- Western Digital (Fremont), LLC
- Lei Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Thin wafer handling and known good die test method
- Patent number 8,846,447
- Issue date Sep 30, 2014
- Invensas Corporation
- Charles G. Woychik
- G01 - MEASURING TESTING
Information Patent Grant
Method of processing a device substrate
- Patent number 8,790,996
- Issue date Jul 29, 2014
- Invensas Corporation
- Pezhman Monadgemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical interposer
- Patent number 8,757,897
- Issue date Jun 24, 2014
- Invensas Corporation
- Valentin Kosenko
- G02 - OPTICS
Information Patent Grant
Method and system for providing a laser submount for an energy assi...
- Patent number 8,518,748
- Issue date Aug 27, 2013
- Western Digital (Fremont), LLC
- Lei Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY EFFICIENT SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING INTER...
- Publication number 20230378137
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Pezhman Monadgemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY EFFICIENT SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING INTER...
- Publication number 20220208728
- Publication date Jun 30, 2022
- Micron Technology, Inc.
- Pezhman Monadgemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20190139878
- Publication date May 9, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20170365546
- Publication date Dec 21, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE APERTURES HAVING ISLANDS OF FUNCTIONALITY
- Publication number 20170253480
- Publication date Sep 7, 2017
- Pacific Biosciences of California, Inc.
- Stephen Turner
- B82 - NANO-TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS
- Publication number 20160176705
- Publication date Jun 23, 2016
- WESTERN DIGITAL (FREMONT), LLC
- Pezhman Monadgemi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS
- Publication number 20160176706
- Publication date Jun 23, 2016
- WESTERN DIGITAL (FREMONT), LLC
- Pezhman Monadgemi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BVA INTERPOSER
- Publication number 20160079214
- Publication date Mar 17, 2016
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-LESS SILICON INTERPOSER
- Publication number 20160079090
- Publication date Mar 17, 2016
- Invensas Corporation
- Michael Newman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20150340310
- Publication date Nov 26, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING
- Publication number 20150255345
- Publication date Sep 10, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PVD-FREE CONDUCTING STRUCTURES
- Publication number 20150162241
- Publication date Jun 11, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MAKING HIGH MULTIPLEX ARRAYS
- Publication number 20150053641
- Publication date Feb 26, 2015
- Pacific Biosciences of California, Inc.
- Denis Zaccarin
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Thin Wafer Handling and Known Good Die Test Method
- Publication number 20150014688
- Publication date Jan 15, 2015
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR EDGE-EMITTING DIODE PACKAGE HAVING DEFLECT...
- Publication number 20150003482
- Publication date Jan 1, 2015
- JDS Uniphase Corporation
- Pezhman MONADGEMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PVD-FREE CONDUCTING STRUCTURES
- Publication number 20140339702
- Publication date Nov 20, 2014
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A DEVICE SUBSTRATE
- Publication number 20140315384
- Publication date Oct 23, 2014
- Invensas Corporation
- Pezhman Monadgemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-LESS SILICON INTERPOSER
- Publication number 20140240938
- Publication date Aug 28, 2014
- Invensas Corporation
- Michael Newman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING
- Publication number 20140179099
- Publication date Jun 26, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MODIFIED TSV STRUCTURE AND METHODS THEREOF
- Publication number 20140175654
- Publication date Jun 26, 2014
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20140167267
- Publication date Jun 19, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD
- Publication number 20140054763
- Publication date Feb 27, 2014
- Invensas Corporation
- Charles G. Woychik
- G01 - MEASURING TESTING
Information Patent Application
BVA INTERPOSER
- Publication number 20140036454
- Publication date Feb 6, 2014
- Invensas Corporation
- Terrence Caskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A DEVICE SUBSTRATE
- Publication number 20140017878
- Publication date Jan 16, 2014
- Invensas Corporation
- Pezhman Monadgemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FORMED USING MONOCRYSTALLINE SILICON AND/OR OTHER MATERI...
- Publication number 20130177274
- Publication date Jul 11, 2013
- Invensas Corporation
- Valentin Kosenko
- G02 - OPTICS
Information Patent Application
OPTICAL INTERPOSER
- Publication number 20130177281
- Publication date Jul 11, 2013
- Invensas Corporation
- Valentin Kosenko
- G02 - OPTICS
Information Patent Application
HIGH MULTIPLEX ARRAYS AND SYSTEMS
- Publication number 20130023039
- Publication date Jan 24, 2013
- Pacific Biosciences of California, Inc.
- Denis Zaccarin
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
NANOSCALE APERTURES HAVING ISLANDS OF FUNCTIONALITY
- Publication number 20110257040
- Publication date Oct 20, 2011
- Pacific Biosciences of California, Inc.
- Stephen Turner
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
MICROMIRROR ARRAYS HAVING SELF ALIGNED FEATURES
- Publication number 20110222179
- Publication date Sep 15, 2011
- Pacific Biosciences of California, Inc.
- Pezhman Monadgemi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PLANAR MICROSHELLS FOR VACUUM ENCAPSULATED DEVICES AND DAMASCENE ME...
- Publication number 20110121412
- Publication date May 26, 2011
- Silicon Laboratories Inc.
- Emmanuel P. Quevy
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Pezhman Monadgemi

Person

Patents Grantslast 30 patents

Thermally efficient semiconductor device assemblies including inter...

Thermally efficient semiconductor device assemblies including inter...

Nanoscale apertures having islands of functionality

Method and structures for heat dissipating interposers

BVA interposer

Method for fabricating a carrier-less silicon interposer

Method and structures for heat dissipating interposers

Process for making high multiplex arrays

Structures for heat dissipating interposers

Nanoscale apertures having islands of functionality

Thin wafer handling and known good die test method

BVA interposer

Metal PVD-free conducting structures

Methods and structure for carrier-less thin wafer handling

Structures formed using monocrystalline silicon and/or other materi...

Surface modified TSV structure and methods thereof

Carrier-less silicon interposer

Systems and methods for forming MEMS assemblies incorporating getters

Method and structures for heat dissipating interposers

Method of processing a device substrate

Methods and structure for carrier-less thin wafer handling

Structure and method for edge-emitting diode package having deflect...

High multiplex arrays and systems

Metal PVD-free conducting structures

Method and system for providing a laser cavity for an energy assist...

Method and system for providing a laser submount for an energy assi...

Thin wafer handling and known good die test method

Method of processing a device substrate

Optical interposer

Method and system for providing a laser submount for an energy assi...

Patents Applicationslast 30 patents

THERMALLY EFFICIENT SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING INTER...

THERMALLY EFFICIENT SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING INTER...

METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS

METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS

NANOSCALE APERTURES HAVING ISLANDS OF FUNCTIONALITY

SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS

SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS

BVA INTERPOSER

CARRIER-LESS SILICON INTERPOSER

METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS

METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING

METAL PVD-FREE CONDUCTING STRUCTURES

PROCESS FOR MAKING HIGH MULTIPLEX ARRAYS

Thin Wafer Handling and Known Good Die Test Method

STRUCTURE AND METHOD FOR EDGE-EMITTING DIODE PACKAGE HAVING DEFLECT...

METAL PVD-FREE CONDUCTING STRUCTURES

METHOD OF PROCESSING A DEVICE SUBSTRATE

CARRIER-LESS SILICON INTERPOSER

METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING

SURFACE MODIFIED TSV STRUCTURE AND METHODS THEREOF

METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS

THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD

BVA INTERPOSER

METHOD OF PROCESSING A DEVICE SUBSTRATE

STRUCTURES FORMED USING MONOCRYSTALLINE SILICON AND/OR OTHER MATERI...

OPTICAL INTERPOSER

HIGH MULTIPLEX ARRAYS AND SYSTEMS

NANOSCALE APERTURES HAVING ISLANDS OF FUNCTIONALITY

MICROMIRROR ARRAYS HAVING SELF ALIGNED FEATURES

PLANAR MICROSHELLS FOR VACUUM ENCAPSULATED DEVICES AND DAMASCENE ME...