Philip C. Liu

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Endwell, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Via fill compositions for direct attach of devices and methods for...
- Patent number 6,194,024
- Issue date Feb 27, 2001
- International Business Machines Corporation
- Roy Lynn Arldt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via fill compositions for direct attach of devices and methods of a...
- Patent number 6,134,772
- Issue date Oct 24, 2000
- International Business Machines Corporation
- Roy Lynn Arldt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Via fill compositions for direct attach of devices and methods for...
- Patent number 5,766,670
- Issue date Jun 16, 1998
- Roy Lynn Arldt
- B32 - LAYERED PRODUCTS
Information Patent Grant
Via fill compositions for direct attach of devices and methods for...
- Patent number 5,571,593
- Issue date Nov 5, 1996
- International Business Machines Corporation
- Roy L. Arldt
- B32 - LAYERED PRODUCTS