Claims
- 1. A circuit carrier comprising:
- a. a first circuit carrier having at least one aperture, filled with an epoxy or cyanate fill composition;
- b. a metal pad disposed atop the filled aperture, and
- c. a solder ball disposed atop the pad;
- d. a second circuit carrier disposed atop the solder ball electrically connected to the first circuit carrier through the solder ball.
- 2. The circuit carrier of claim 1, wherein the aperture is a plated through hole or plated via.
- 3. The circuit carrier of claim 1, wherein the aperture is an unplated through hole or unplated via.
- 4. A circuit carrier of claim 1 wherein the via through hole fill composition comprises:
- a. from about 5% to about 65% by composition weight of a binder, comprising:
- i. about 25% to about 100% by binder weight, of resin, selected from the group consisting of cycloaliphatic epoxy resin; novolac epoxy resin; and cyanate ester resin and mixtures thereof;
- ii. 0% to about 75% by binder weight of a curing agent; wherein if the resin is cycloaliphatic epoxy resin or novolac epoxy resin, then the curing agent is present from about 25% to about 75% by binder weight;
- iii. catalyst, in an amount sufficient to accelerate the cure said resin;
- b. from about 35% to about 95% by composition weight of conductive powder; and
- wherein the fill composition when applied to vias and through holes and cured, is essentially free of voids and has a shrinkage less than about 0.8%.
- 5. The circuit carrier of claim 4 wherein the resin is a cycloaliphatic epoxy resin having a molecular weight of from about 200 to 800; the curing agent is an anhydride curing agent, and the conductive powder comprises metal powder.
- 6. The circuit carrier of claim 4, wherein the resin is an epoxy novolac resin having a weight per epoxide of about 200 to about 500 further comprising from about 10% to about 60% by weight of the composition of an organic solvent.
- 7. The circuit carrier of claim 4, wherein the resin comprises cyanate ester resin.
Parent Case Info
This is a divisional of copending application Ser. No. 08/154,341 filed on Nov. 16, 1994, pending.
US Referenced Citations (18)
Foreign Referenced Citations (1)
Number |
Date |
Country |
62-132353 |
Jun 1987 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
154341 |
Nov 1994 |
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