Philip H. Bowles

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic packages having hermetic cavities and methods for t...
- Patent number 10,442,685
- Issue date Oct 15, 2019
- NXP USA, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages having axially-partitioned hermetic caviti...
- Patent number 10,053,359
- Issue date Aug 21, 2018
- NXP USA, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages having split gyroscope structures and meth...
- Patent number 9,891,244
- Issue date Feb 13, 2018
- NXP USA, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device packages and related fabrication methods
- Patent number 9,676,611
- Issue date Jun 13, 2017
- NXP USA, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sequential wafer bonding
- Patent number 9,604,844
- Issue date Mar 28, 2017
- NXP USA, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages having axially-partitioned hermetic caviti...
- Patent number 9,499,397
- Issue date Nov 22, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages having stacked accelerometer and magnetome...
- Patent number 9,376,310
- Issue date Jun 28, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package having stacked die
- Patent number 9,365,414
- Issue date Jun 14, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems (MEMS) devices with control circuits...
- Patent number 9,359,192
- Issue date Jun 7, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cavity-type semiconductor package and method of packaging same
- Patent number 9,227,838
- Issue date Jan 5, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor packaging method and sensor packages
- Patent number 9,165,886
- Issue date Oct 20, 2015
- Freescale Semiconductor,INC
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages having stacked accelerometer and magnetome...
- Patent number 9,108,841
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sequential wafer bonding
- Patent number 9,090,454
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of forming same
- Patent number 9,040,355
- Issue date May 26, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vent hole sealing in multiple die sensor device
- Patent number 9,018,029
- Issue date Apr 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages including patterned die attach material an...
- Patent number 8,962,389
- Issue date Feb 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- William C. Stermer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cavity-type semiconductor package and method of packaging same
- Patent number 8,906,747
- Issue date Dec 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Leadframes, air-cavity packages, and electronic devices with offset...
- Patent number 8,884,413
- Issue date Nov 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages and method of packaging dies of differing sizes
- Patent number 8,709,868
- Issue date Apr 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for high pressure sensor device
- Patent number 8,686,550
- Issue date Apr 1, 2014
- FREESCALE SEMICONDUCTOR, INC.
- William G. McDonald
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Sensor packaging method and sensor packages
- Patent number 8,659,167
- Issue date Feb 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic assembly with back side metallization and method fo...
- Patent number 7,723,224
- Issue date May 25, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Darrell G. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for RF shielding in vertically-integrated sem...
- Patent number 7,446,017
- Issue date Nov 4, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Lianjun Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC PACKAGES HAVING AXIALLY-PARTITIONED HERMETIC CAVITI...
- Publication number 20170044005
- Publication date Feb 16, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES HAVING SPLIT GYROSCOPE STRUCTURES AND METH...
- Publication number 20170038209
- Publication date Feb 9, 2017
- PHILIP H. BOWLES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES HAVING HERMETIC CAVITIES AND METHODS FOR T...
- Publication number 20160167952
- Publication date Jun 16, 2016
- PHILIP H. BOWLES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES HAVING STACKED ACCELEROMETER AND MAGNETOME...
- Publication number 20150329352
- Publication date Nov 19, 2015
- Freescale Semiconductor Inc.
- PHILIP H. BOWLES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEQUENTIAL WAFER BONDING
- Publication number 20150321907
- Publication date Nov 12, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE HAVING STACKED DIE
- Publication number 20150298966
- Publication date Oct 22, 2015
- PHILIP H. BOWLES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES HAVING AXIALLY-PARTITIONED HERMETIC CAVITI...
- Publication number 20150274515
- Publication date Oct 1, 2015
- PHILIP H. BOWLES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES HAVING STACKED ACCELEROMETER AND MAGNETOME...
- Publication number 20150251903
- Publication date Sep 10, 2015
- PHILIP H. BOWLES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE PACKAGES AND RELATED FABRICATION METHODS
- Publication number 20150108653
- Publication date Apr 23, 2015
- STEPHEN R. HOOPER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAVITY-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SAME
- Publication number 20150061106
- Publication date Mar 5, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEQUENTIAL WAFER BONDING
- Publication number 20150061044
- Publication date Mar 5, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20150048462
- Publication date Feb 19, 2015
- FREESCALE SEMICONDUCTOR, INC.
- PHILIP H. BOWLES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES INCLUDING PATTERNED DIE ATTACH MATERIAL AN...
- Publication number 20140353772
- Publication date Dec 4, 2014
- William C. Stermer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGES HAVING SEMICONDUCTOR DIES OF DIFFERING SIZES
- Publication number 20140183729
- Publication date Jul 3, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGES
- Publication number 20140124958
- Publication date May 8, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGES
- Publication number 20140061948
- Publication date Mar 6, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEADFRAMES, AIR-CAVITY PACKAGES, AND ELECTRONIC DEVICES WITH OFFSET...
- Publication number 20140061883
- Publication date Mar 6, 2014
- PHILIP H. BOWLES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGES AND METHOD OF PACKAGING DIES OF DIFFERING SIZES
- Publication number 20140054798
- Publication date Feb 27, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGES AND METHOD OF PACKAGING DIES OF VARIOUS SIZES
- Publication number 20140048946
- Publication date Feb 20, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20140015123
- Publication date Jan 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAVITY-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SAME
- Publication number 20130313700
- Publication date Nov 28, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Stephen R. Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND APPARATUS FOR HIGH PRESSURE SENSOR DEVICE
- Publication number 20130207207
- Publication date Aug 15, 2013
- William G. McDonald
- B60 - VEHICLES IN GENERAL
Information Patent Application
STACKED AND SHIELDED PACKAGES WITH INTERCONNECTS
- Publication number 20110250721
- Publication date Oct 13, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED AND SHIELDED DIE PACKAGES WITH INTERCONNECTS
- Publication number 20080246126
- Publication date Oct 9, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Philip H. Bowles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assembly with back side metallization and method fo...
- Publication number 20070293033
- Publication date Dec 20, 2007
- Darrell G. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for RF shielding in vertically-integrated sem...
- Publication number 20070281438
- Publication date Dec 6, 2007
- Lianjun Liu
- H01 - BASIC ELECTRIC ELEMENTS

Philip H. Bowles

Person

Patents Grantslast 30 patents

Microelectronic packages having hermetic cavities and methods for t...

Microelectronic packages having axially-partitioned hermetic caviti...

Microelectronic packages having split gyroscope structures and meth...

Sensor device packages and related fabrication methods

Sequential wafer bonding

Microelectronic packages having axially-partitioned hermetic caviti...

Microelectronic packages having stacked accelerometer and magnetome...

Sensor package having stacked die

Microelectromechanical systems (MEMS) devices with control circuits...

Cavity-type semiconductor package and method of packaging same

Sensor packaging method and sensor packages

Microelectronic packages having stacked accelerometer and magnetome...

Sequential wafer bonding

Sensor package and method of forming same

Vent hole sealing in multiple die sensor device

Microelectronic packages including patterned die attach material an...

Cavity-type semiconductor package and method of packaging same

Leadframes, air-cavity packages, and electronic devices with offset...

Sensor packages and method of packaging dies of differing sizes

Method and apparatus for high pressure sensor device

Sensor packaging method and sensor packages

Microelectronic assembly with back side metallization and method fo...

Methods and apparatus for RF shielding in vertically-integrated sem...

Patents Applicationslast 30 patents

MICROELECTRONIC PACKAGES HAVING AXIALLY-PARTITIONED HERMETIC CAVITI...

MICROELECTRONIC PACKAGES HAVING SPLIT GYROSCOPE STRUCTURES AND METH...

MICROELECTRONIC PACKAGES HAVING HERMETIC CAVITIES AND METHODS FOR T...

MICROELECTRONIC PACKAGES HAVING STACKED ACCELEROMETER AND MAGNETOME...

SEQUENTIAL WAFER BONDING

SENSOR PACKAGE HAVING STACKED DIE

MICROELECTRONIC PACKAGES HAVING AXIALLY-PARTITIONED HERMETIC CAVITI...

MICROELECTRONIC PACKAGES HAVING STACKED ACCELEROMETER AND MAGNETOME...

SENSOR DEVICE PACKAGES AND RELATED FABRICATION METHODS

CAVITY-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SAME

SEQUENTIAL WAFER BONDING

SENSOR PACKAGE AND METHOD OF FORMING SAME

MICROELECTRONIC PACKAGES INCLUDING PATTERNED DIE ATTACH MATERIAL AN...

SENSOR PACKAGES HAVING SEMICONDUCTOR DIES OF DIFFERING SIZES

SENSOR PACKAGING METHOD AND SENSOR PACKAGES

SENSOR PACKAGING METHOD AND SENSOR PACKAGES

LEADFRAMES, AIR-CAVITY PACKAGES, AND ELECTRONIC DEVICES WITH OFFSET...

SENSOR PACKAGES AND METHOD OF PACKAGING DIES OF DIFFERING SIZES

SENSOR PACKAGES AND METHOD OF PACKAGING DIES OF VARIOUS SIZES

SENSOR PACKAGE AND METHOD OF FORMING SAME

CAVITY-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SAME

METHOD AND APPARATUS FOR HIGH PRESSURE SENSOR DEVICE

STACKED AND SHIELDED PACKAGES WITH INTERCONNECTS

STACKED AND SHIELDED DIE PACKAGES WITH INTERCONNECTS

Microelectronic assembly with back side metallization and method fo...

Methods and apparatus for RF shielding in vertically-integrated sem...