Philip H. Chen

Person

Tualatine, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and device for wafer scale packaging of optical devices usin...
- Patent number 9,006,878
- Issue date Apr 14, 2015
- Miradia Inc.
- Xiao “Charles” Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for wafer scale packaging of optical devices usin...
- Patent number 7,825,519
- Issue date Nov 2, 2010
- Miradia Inc.
- Xiao Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for wafer scale packaging of optical devices usin...
- Patent number 7,344,956
- Issue date Mar 18, 2008
- Miradia Inc.
- Xiao “Charles” Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heat sink and package surface design
- Patent number 6,870,736
- Issue date Mar 22, 2005
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and package surface design
- Patent number 6,757,170
- Issue date Jun 29, 2004
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounted device with grooves on a termination lead
- Patent number 6,426,880
- Issue date Jul 30, 2002
- Intermedics, Inc.
- Philip H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for stacking IC devices
- Patent number 6,406,940
- Issue date Jun 18, 2002
- Intermedics Inc.
- Philip H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in assembling electronic devices
- Patent number 6,251,219
- Issue date Jun 26, 2001
- Intermedics Inc.
- Philip H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounted device with grooves on a termination lead and metho...
- Patent number 6,246,587
- Issue date Jun 12, 2001
- Intermedics Inc.
- Philip H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for dicing electronic substrate
- Patent number 6,182,357
- Issue date Feb 6, 2001
- Intermedics Inc.
- Philip H. Chen
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor device packaging and method of fabrication
- Patent number 5,987,358
- Issue date Nov 16, 1999
- Intermedics, Inc.
- Thomas G. Sosebee
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Printed circuit substrate with cavities for encapsulating integrate...
- Patent number 5,963,429
- Issue date Oct 5, 1999
- Sulzer Intermedics Inc.
- Philip H. Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USIN...
- Publication number 20110012166
- Publication date Jan 20, 2011
- Miradia Inc.
- Xiao "Charles" Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USIN...
- Publication number 20080191221
- Publication date Aug 14, 2008
- Miradia Inc.
- Xiao Charles Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and device for wafer scale packaging of optical devices usin...
- Publication number 20060121693
- Publication date Jun 8, 2006
- Miradia Inc.
- Xiao "Charles" Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Heat sink and package surface design
- Publication number 20040218354
- Publication date Nov 4, 2004
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink and package surface design
- Publication number 20040017656
- Publication date Jan 29, 2004
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS

Philip H. Chen

Person

Patents Grantslast 30 patents

Method and device for wafer scale packaging of optical devices usin...

Method and device for wafer scale packaging of optical devices usin...

Method and device for wafer scale packaging of optical devices usin...

Heat sink and package surface design

Heat sink and package surface design

Surface mounted device with grooves on a termination lead

Method and apparatus for stacking IC devices

Method and apparatus for use in assembling electronic devices

Surface mounted device with grooves on a termination lead and metho...

Method and apparatus for dicing electronic substrate

Semiconductor device packaging and method of fabrication

Printed circuit substrate with cavities for encapsulating integrate...

Patents Applicationslast 30 patents

METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USIN...

METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USIN...

Method and device for wafer scale packaging of optical devices usin...

Heat sink and package surface design

Heat sink and package surface design