Philip Lyndon R. Cablao

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Stacked die semiconductor device having circuit tape
- Patent number 7,786,575
- Issue date Aug 31, 2010
- Stats Chippac Ltd.
- Philip Lyndon R. Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor device having circuit tape
- Patent number 7,659,608
- Issue date Feb 9, 2010
- Stats Chippac Ltd.
- Philip Lyndon R. Cablao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED DIE SEMICONDUCTOR DEVICE HAVING CIRCUIT TAPE
- Publication number 20100078794
- Publication date Apr 1, 2010
- Philip Lyndon R. Cablao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE SEMICONDUCTOR PACKAGE
- Publication number 20080067658
- Publication date Mar 20, 2008
- STATS ChipPAC, Inc.
- Philip Lyndon R. Cablao
- H01 - BASIC ELECTRIC ELEMENTS