Philippe Laporte

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Echirolles, FR

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Patents Grantslast 30 patents

Information Patent Grant
Device for separating wafers and process for using said device
- Patent number 6,077,383
- Issue date Jun 20, 2000
- Commissariat a l'Energie
- Philippe Laporte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for etching and depositing integrated circuit interconnecti...
- Patent number 5,354,711
- Issue date Oct 11, 1994
- Commissariat a l'Energie Atomique
- Michel Heitzmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enclosure for the treatment, and particularly for the etching of su...
- Patent number 4,491,496
- Issue date Jan 1, 1985
- Commissariat a l'Energie Atomique
- Philippe Laporte
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...