Phillip Duane ISAACS

Person

Rochester, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Creating a standoff for a low-profile component without adding a pr...
- Patent number 11,812,562
- Issue date Nov 7, 2023
- International Business Machines Corporation
- Phillip Isaacs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixture facilitating heat sink fabrication
- Patent number 11,404,287
- Issue date Aug 2, 2022
- International Business Machines Corporation
- Phillip D. Isaacs
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Control of driverless vehicles in construction zones
- Patent number 11,238,726
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Phillip D. Isaacs
- G08 - SIGNALLING
Information Patent Grant
Fixture facilitating heat sink fabrication
- Patent number 10,978,313
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Phillip D. Isaacs
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Dynamic billboard advertisement for vehicular traffic
- Patent number 10,956,941
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Phillip D. Isaacs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dynamic billboard advertisement for vehicular traffic
- Patent number 10,825,051
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Phillip D. Isaacs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Overlapping, discrete tamper-respondent sensors
- Patent number 10,685,146
- Issue date Jun 16, 2020
- International Business Machines Corporation
- William L. Brodsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of fabricating a tamper-respondent sensor assembly
- Patent number 10,395,067
- Issue date Aug 27, 2019
- International Business Machines Corporation
- William L. Brodsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Overlapping, discrete tamper-respondent sensors
- Patent number 10,331,915
- Issue date Jun 25, 2019
- International Business Machines Corporation
- William L. Brodsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-respondent assemblies
- Patent number 10,334,722
- Issue date Jun 25, 2019
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating tamper-respondent sensor
- Patent number 10,257,939
- Issue date Apr 9, 2019
- International Business Machines Corporation
- John R. Dangler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-respondent assembly with nonlinearity monitoring
- Patent number 10,242,543
- Issue date Mar 26, 2019
- International Business Machines Corporation
- James A. Busby
- G08 - SIGNALLING
Information Patent Grant
Manufacturing electronic package with heat transfer element(s)
- Patent number 10,237,964
- Issue date Mar 19, 2019
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer stack with embedded tamper-detect protection
- Patent number 10,217,336
- Issue date Feb 26, 2019
- International Business Machines Corporation
- James A. Busby
- G08 - SIGNALLING
Information Patent Grant
Multi-layer stack with embedded tamper-detect protection
- Patent number 10,169,967
- Issue date Jan 1, 2019
- International Business Machines Corporation
- James A. Busby
- G08 - SIGNALLING
Information Patent Grant
Tamper-respondent sensors with formed flexible layer(s)
- Patent number 10,172,239
- Issue date Jan 1, 2019
- International Business Machines Corporation
- John R. Dangler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-layer stack with embedded tamper-detect protection
- Patent number 10,169,968
- Issue date Jan 1, 2019
- International Business Machines Corporation
- James A. Busby
- G08 - SIGNALLING
Information Patent Grant
Circuit layouts of tamper-respondent sensors
- Patent number 10,143,090
- Issue date Nov 27, 2018
- International Business Machines Corporation
- William L. Brodsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit layouts of tamper-respondent sensors
- Patent number 10,136,519
- Issue date Nov 20, 2018
- International Business Machines Corporation
- William L. Brodsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-layer stack with embedded tamper-detect protection
- Patent number 10,115,275
- Issue date Oct 30, 2018
- International Business Machines Corporation
- James A. Busby
- G08 - SIGNALLING
Information Patent Grant
Tamper-respondent assembly with protective wrap(s) over tamper-resp...
- Patent number 9,978,231
- Issue date May 22, 2018
- International Business Machines Corporation
- Phillip Duane Isaacs
- G08 - SIGNALLING
Information Patent Grant
Tamper-respondent assemblies
- Patent number 9,936,573
- Issue date Apr 3, 2018
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-respondent assemblies
- Patent number 9,924,591
- Issue date Mar 20, 2018
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer stack with embedded tamper-detect protection
- Patent number 9,916,744
- Issue date Mar 13, 2018
- International Business Machines Corporation
- James A. Busby
- G08 - SIGNALLING
Information Patent Grant
Overlapping, discrete tamper-respondent sensors
- Patent number 9,911,012
- Issue date Mar 6, 2018
- International Business Machines Corporation
- William L. Brodsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-respondent assembly with nonlinearity monitoring
- Patent number 9,858,776
- Issue date Jan 2, 2018
- International Business Machines Corporation
- James A. Busby
- G08 - SIGNALLING
Information Patent Grant
Solder void reduction between electronic packages and printed circu...
- Patent number 9,839,128
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with heat transfer element(s)
- Patent number 9,560,737
- Issue date Jan 31, 2017
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder void reduction between electronic packages and printed circu...
- Patent number 9,462,703
- Issue date Oct 4, 2016
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder void reduction for component attachment to printed circuit b...
- Patent number 9,426,900
- Issue date Aug 23, 2016
- GLOBALFOUNDRIES, INC.
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CREATING A STANDOFF FOR A LOW-PROFILE COMPONENT WITHOUT ADDING A PR...
- Publication number 20230067845
- Publication date Mar 2, 2023
- International Business Machines Corporation
- Phillip Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXTURE FACILITATING HEAT SINK FABRICATION
- Publication number 20210111037
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Phillip D. ISAACS
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
FIXTURE FACILITATING HEAT SINK FABRICATION
- Publication number 20190259632
- Publication date Aug 22, 2019
- International Business Machines Corporation
- Phillip D. ISAACS
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
OVERLAPPING, DISCRETE TAMPER-RESPONDENT SENSORS
- Publication number 20190220628
- Publication date Jul 18, 2019
- International Business Machines Corporation
- William L. BRODSKY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DYNAMIC BILLBOARD ADVERTISEMENT FOR VEHICULAR TRAFFIC
- Publication number 20190088176
- Publication date Mar 21, 2019
- International Business Machines Corporation
- PHILLIP D. ISAACS
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DYNAMIC BILLBOARD ADVERTISEMENT FOR VEHICULAR TRAFFIC
- Publication number 20190088175
- Publication date Mar 21, 2019
- International Business Machines Corporation
- PHILLIP D. ISAACS
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION
- Publication number 20180365945
- Publication date Dec 20, 2018
- International Business Machines Corporation
- James A. BUSBY
- G08 - SIGNALLING
Information Patent Application
MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION
- Publication number 20180365946
- Publication date Dec 20, 2018
- International Business Machines Corporation
- James A. BUSBY
- G08 - SIGNALLING
Information Patent Application
MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION
- Publication number 20180365947
- Publication date Dec 20, 2018
- International Business Machines Corporation
- James A. BUSBY
- G08 - SIGNALLING
Information Patent Application
CONTROL OF DRIVERLESS VEHICLES IN CONSTRUCTION ZONES
- Publication number 20180157264
- Publication date Jun 7, 2018
- International Business Machines Corporation
- PHILLIP D. ISAACS
- G05 - CONTROLLING REGULATING
Information Patent Application
TAMPER-RESPONDENT ASSEMBLY WITH NONLINEARITY MONITORING
- Publication number 20180108229
- Publication date Apr 19, 2018
- International Business Machines Corporation
- James A. BUSBY
- G01 - MEASURING TESTING
Information Patent Application
OVERLAPPING, DISCRETE TAMPER-RESPONDENT SENSORS
- Publication number 20180096173
- Publication date Apr 5, 2018
- International Business Machines Corporation
- William L. BRODSKY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES
- Publication number 20180070444
- Publication date Mar 8, 2018
- International Business Machines Corporation
- William L. BRODSKY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION
- Publication number 20180061196
- Publication date Mar 1, 2018
- International Business Machines Corporation
- James A. BUSBY
- G08 - SIGNALLING
Information Patent Application
TAMPER-RESPONDENT ASSEMBLY WITH NONLINEARITY MONITORING
- Publication number 20170372570
- Publication date Dec 28, 2017
- International Business Machines Corporation
- James A. BUSBY
- G01 - MEASURING TESTING
Information Patent Application
MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION
- Publication number 20170249813
- Publication date Aug 31, 2017
- International Business Machines Corporation
- James A. BUSBY
- G08 - SIGNALLING
Information Patent Application
TAMPER-RESPONDENT ASSEMBLY WITH PROTECTIVE WRAP(S) OVER TAMPER-RESP...
- Publication number 20170116830
- Publication date Apr 27, 2017
- International Business Machines Corporation
- Phillip Duane ISAACS
- G08 - SIGNALLING
Information Patent Application
CIRCUIT LAYOUTS OF TAMPER-RESPONDENT SENSORS
- Publication number 20170111998
- Publication date Apr 20, 2017
- International Business Machines Corporation
- William L. BRODSKY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT LAYOUTS OF TAMPER-RESPONDENT SENSORS
- Publication number 20170108543
- Publication date Apr 20, 2017
- International Business Machines Corporation
- William L. BRODSKY
- G01 - MEASURING TESTING
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES
- Publication number 20170094806
- Publication date Mar 30, 2017
- International Business Machines Corporation
- William L. BRODSKY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERLAPPING, DISCRETE TAMPER-RESPONDENT SENSORS
- Publication number 20170094804
- Publication date Mar 30, 2017
- International Business Machines Corporation
- William L. BRODSKY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER-RESPONDENT SENSORS WITH FORMED FLEXIBLE LAYER(S)
- Publication number 20170091491
- Publication date Mar 30, 2017
- International Business Machines Corporation
- John R. DANGLER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TAMPER-RESPONDENT SENSORS WITH FORMED FLEXIBLE LAYER(S)
- Publication number 20170094803
- Publication date Mar 30, 2017
- International Business Machines Corporation
- John R. DANGLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES
- Publication number 20170094784
- Publication date Mar 30, 2017
- International Business Machines Corporation
- William L. BRODSKY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERLAPPING, DISCRETE TAMPER-RESPONDENT SENSORS
- Publication number 20170091492
- Publication date Mar 30, 2017
- International Business Machines Corporation
- William L. BRODSKY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCU...
- Publication number 20160338200
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE WITH HEAT TRANSFER ELEMENT(S)
- Publication number 20160262253
- Publication date Sep 8, 2016
- International Business Machines Corporation
- Phillip D. ISAACS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE WITH HEAT TRANSFER ELEMENT(S)
- Publication number 20160262270
- Publication date Sep 8, 2016
- International Business Machines Corporation
- Phillip D. ISAACS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER VOID REDUCTION FOR COMPONENT ATTACHMENT TO PRINTED CIRCUIT B...
- Publication number 20150131250
- Publication date May 14, 2015
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCU...
- Publication number 20150092374
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Phillip Duane ISAACS

Person

Patents Grantslast 30 patents

Creating a standoff for a low-profile component without adding a pr...

Fixture facilitating heat sink fabrication

Control of driverless vehicles in construction zones

Fixture facilitating heat sink fabrication

Dynamic billboard advertisement for vehicular traffic

Dynamic billboard advertisement for vehicular traffic

Overlapping, discrete tamper-respondent sensors

Method of fabricating a tamper-respondent sensor assembly

Overlapping, discrete tamper-respondent sensors

Tamper-respondent assemblies

Method of fabricating tamper-respondent sensor

Tamper-respondent assembly with nonlinearity monitoring

Manufacturing electronic package with heat transfer element(s)

Multi-layer stack with embedded tamper-detect protection

Multi-layer stack with embedded tamper-detect protection

Tamper-respondent sensors with formed flexible layer(s)

Multi-layer stack with embedded tamper-detect protection

Circuit layouts of tamper-respondent sensors

Circuit layouts of tamper-respondent sensors

Multi-layer stack with embedded tamper-detect protection

Tamper-respondent assembly with protective wrap(s) over tamper-resp...

Tamper-respondent assemblies

Tamper-respondent assemblies

Multi-layer stack with embedded tamper-detect protection

Overlapping, discrete tamper-respondent sensors

Tamper-respondent assembly with nonlinearity monitoring

Solder void reduction between electronic packages and printed circu...

Electronic package with heat transfer element(s)

Solder void reduction between electronic packages and printed circu...

Solder void reduction for component attachment to printed circuit b...

Patents Applicationslast 30 patents

CREATING A STANDOFF FOR A LOW-PROFILE COMPONENT WITHOUT ADDING A PR...

FIXTURE FACILITATING HEAT SINK FABRICATION

FIXTURE FACILITATING HEAT SINK FABRICATION

OVERLAPPING, DISCRETE TAMPER-RESPONDENT SENSORS

DYNAMIC BILLBOARD ADVERTISEMENT FOR VEHICULAR TRAFFIC

DYNAMIC BILLBOARD ADVERTISEMENT FOR VEHICULAR TRAFFIC

MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION

MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION

MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION

CONTROL OF DRIVERLESS VEHICLES IN CONSTRUCTION ZONES

TAMPER-RESPONDENT ASSEMBLY WITH NONLINEARITY MONITORING

OVERLAPPING, DISCRETE TAMPER-RESPONDENT SENSORS

TAMPER-RESPONDENT ASSEMBLIES

MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION

TAMPER-RESPONDENT ASSEMBLY WITH NONLINEARITY MONITORING

MULTI-LAYER STACK WITH EMBEDDED TAMPER-DETECT PROTECTION

TAMPER-RESPONDENT ASSEMBLY WITH PROTECTIVE WRAP(S) OVER TAMPER-RESP...

CIRCUIT LAYOUTS OF TAMPER-RESPONDENT SENSORS

CIRCUIT LAYOUTS OF TAMPER-RESPONDENT SENSORS

TAMPER-RESPONDENT ASSEMBLIES

OVERLAPPING, DISCRETE TAMPER-RESPONDENT SENSORS

TAMPER-RESPONDENT SENSORS WITH FORMED FLEXIBLE LAYER(S)

TAMPER-RESPONDENT SENSORS WITH FORMED FLEXIBLE LAYER(S)

TAMPER-RESPONDENT ASSEMBLIES

OVERLAPPING, DISCRETE TAMPER-RESPONDENT SENSORS

SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCU...

ELECTRONIC PACKAGE WITH HEAT TRANSFER ELEMENT(S)

ELECTRONIC PACKAGE WITH HEAT TRANSFER ELEMENT(S)

SOLDER VOID REDUCTION FOR COMPONENT ATTACHMENT TO PRINTED CIRCUIT B...

SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCU...