Phillip R. Troetschel

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Buda, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Warp-resistent ultra-thin integrated circuit package fabrication me...
- Patent number 6,194,247
- Issue date Feb 27, 2001
- Staktek Group L.P.
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warp-resistant ultra-thin integrated circuit package
- Patent number 5,581,121
- Issue date Dec 3, 1996
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warp-resistent ultra-thin integrated circuit package fabrication me...
- Patent number 5,369,058
- Issue date Nov 29, 1994
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warp-resistent ultra-thin integrated circuit package fabrication me...
- Patent number 5,369,056
- Issue date Nov 29, 1994
- Staktek Corporation
- Carmen D. Burns
- H01 - BASIC ELECTRIC ELEMENTS