PIN GIAN GAN

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Patents Grantslast 30 patents

Information Patent Grant
Planarization methods for packaging substrates
- Patent number 11,931,855
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and apparatus for backside via reveal processing
- Patent number 11,289,387
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Prayudi Lianto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POLISHING ARTICLES FOR HYBRID BONDING APPLICATIONS
- Publication number 20250121472
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Liu Jiang
- B24 - GRINDING POLISHING
Information Patent Application
METHODS AND APPARATUS FOR BACKSIDE VIA REVEAL PROCESSING
- Publication number 20220037216
- Publication date Feb 3, 2022
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION METHODS FOR PACKAGING SUBSTRATES
- Publication number 20200391343
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- Han-Wen CHEN
- B24 - GRINDING POLISHING
Information Patent Application
METHODS AND APPARATUS FOR REMOVING ABRASIVE PARTICLES
- Publication number 20200306931
- Publication date Oct 1, 2020
- Applied Materials, Inc.
- PRAYUDI LIANTO
- H01 - BASIC ELECTRIC ELEMENTS