Ping-Cheng Hu

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting semiconductor packages and related methods
- Patent number 9,059,379
- Issue date Jun 16, 2015
- Advanced Semiconductor Engineering, Inc.
- Yen-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with solder joint enhancement elements
- Patent number 8,994,156
- Issue date Mar 31, 2015
- Advanced Semiconductor Engineering, Inc.
- Po-Shing Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with lead extensions and related methods
- Patent number 8,674,487
- Issue date Mar 18, 2014
- Advanced Semiconductor Engineering, Inc.
- Lin-Wang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with solder joint enhancement element...
- Patent number 8,502,363
- Issue date Aug 6, 2013
- Advanced Semiconductor Engineering, Inc.
- Po-Shing Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a cavity structure
- Patent number 8,492,883
- Issue date Jul 23, 2013
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced quad flat non-leaded package structure and manufacturing m...
- Patent number 8,237,250
- Issue date Aug 7, 2012
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of advanced quad flat non-leaded package
- Patent number 8,124,447
- Issue date Feb 28, 2012
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced quad flat no lead chip package having marking and corner l...
- Patent number 8,120,152
- Issue date Feb 21, 2012
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced quad flat no lead chip package having a protective layer t...
- Patent number 8,115,285
- Issue date Feb 14, 2012
- Advanced Semiconductor Engineering, Inc.
- Chien-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 8,106,492
- Issue date Jan 31, 2012
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for automated loading of wafer cassette
- Patent number 6,135,702
- Issue date Oct 24, 2000
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gwo-Jou Huang
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Self-locking mechanism for a semiconductor wafer cassette support
- Patent number 6,024,334
- Issue date Feb 15, 2000
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gwo-Jou Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-EMITTING SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20140117388
- Publication date May 1, 2014
- Advanced Semiconductor Engineering, Inc.
- Yen-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH SOLDER JOINT ENHANCEMENT ELEMENT...
- Publication number 20130307157
- Publication date Nov 21, 2013
- Advanced Semiconductor Engineering, Inc.
- Po-Shing Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH LEAD EXTENSIONS AND RELATED METHODS
- Publication number 20130241041
- Publication date Sep 19, 2013
- Lin-Wang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH SOLDER JOINT ENHANCEMENT ELEMENT...
- Publication number 20130009313
- Publication date Jan 10, 2013
- Po-Shing Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...
- Publication number 20120119342
- Publication date May 17, 2012
- MEDIATEK INC.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHO...
- Publication number 20100258921
- Publication date Oct 14, 2010
- Advanced Semiconductor Engineering, Inc.
- PAO-HUEI CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ADVANCED QUAD FLAT NON-LEADED PACKAGE
- Publication number 20100258920
- Publication date Oct 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...
- Publication number 20100258934
- Publication date Oct 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...
- Publication number 20100044843
- Publication date Feb 25, 2010
- Advanced Semiconductor Engineering, Inc.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...
- Publication number 20100044850
- Publication date Feb 25, 2010
- Advanced Semiconductor Engineering, Inc.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT NO LEAD CHIP PACKAGE HAVING MARKING AND CORNER L...
- Publication number 20090230525
- Publication date Sep 17, 2009
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE HAVING GROUND AND POWER REGIONS AND MANU...
- Publication number 20090230524
- Publication date Sep 17, 2009
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT NO LEAD CHIP PACKAGE HAVING A CAVITY STRUCTURE A...
- Publication number 20090230523
- Publication date Sep 17, 2009
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS

Ping-Cheng Hu

Person

Patents Grantslast 30 patents

Light-emitting semiconductor packages and related methods

Semiconductor device packages with solder joint enhancement elements

Semiconductor packages with lead extensions and related methods

Semiconductor device packages with solder joint enhancement element...

Semiconductor package having a cavity structure

Advanced quad flat non-leaded package structure and manufacturing m...

Manufacturing method of advanced quad flat non-leaded package

Advanced quad flat no lead chip package having marking and corner l...

Advanced quad flat no lead chip package having a protective layer t...

Semiconductor package and manufacturing method thereof

Apparatus for automated loading of wafer cassette

Self-locking mechanism for a semiconductor wafer cassette support

Patents Applicationslast 30 patents

LIGHT-EMITTING SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE PACKAGES WITH SOLDER JOINT ENHANCEMENT ELEMENT...

SEMICONDUCTOR PACKAGES WITH LEAD EXTENSIONS AND RELATED METHODS

SEMICONDUCTOR DEVICE PACKAGES WITH SOLDER JOINT ENHANCEMENT ELEMENT...

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...

ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHO...

MANUFACTURING METHOD OF ADVANCED QUAD FLAT NON-LEADED PACKAGE

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...

ADVANCED QUAD FLAT NO LEAD CHIP PACKAGE HAVING MARKING AND CORNER L...

SEMICONDUCTOR CHIP PACKAGE HAVING GROUND AND POWER REGIONS AND MANU...

ADVANCED QUAD FLAT NO LEAD CHIP PACKAGE HAVING A CAVITY STRUCTURE A...