Po-Ching LIN

Person

Miao-Li County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package structure with ring structure
- Patent number 12,368,080
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having underfill material surrounding a...
- Patent number 12,368,127
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having warpage control and method of f...
- Patent number 12,368,114
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with ring structure
- Patent number 12,362,197
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including package substrate with elongated solder...
- Patent number 12,362,268
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal module for a semiconductor package and methods of forming t...
- Patent number 12,362,258
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,362,274
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package structure
- Patent number 12,362,256
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,362,177
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,354,928
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,347,793
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including intra-die structural reinforcement str...
- Patent number 12,347,764
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive patterns of redistribution...
- Patent number 12,341,091
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,334,434
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor structure and method of manufactu...
- Patent number 12,336,212
- Issue date Jun 17, 2025
- GlobalWafers Co., Ltd.
- Po-Jung Lin
Information Patent Grant
Non-transitory machine-readable medium, device and method for deter...
- Patent number 12,335,504
- Issue date Jun 17, 2025
- SHARP KABUSHIKI KAISHA
- Chih-Yu Teng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package including stress-reduction structures and met...
- Patent number 12,327,772
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eccentric via structures for stress reduction
- Patent number 12,322,703
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with underfill
- Patent number 12,322,704
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly lid and methods for forming the same
- Patent number 12,322,666
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including lid with additional stress mitigating fe...
- Patent number 12,315,768
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,317,556
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Ting Chen
Information Patent Grant
Method for treating arthritis by using stem cell preparation and me...
- Patent number 12,310,990
- Issue date May 27, 2025
- GWO XI STEM CELL APPLIED TECHNOLOGY CO., LTD.
- Feng-Huei Lin
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Semiconductor die with tapered sidewall in package
- Patent number 12,308,346
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control device and method of controlling power generation system
- Patent number 12,308,643
- Issue date May 20, 2025
- National Cheng Kung University
- Yueh-Heng Li
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Chip package with lid
- Patent number 12,300,632
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial structures exposed in airgaps for semiconductor devices
- Patent number 12,302,615
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency heat dissipation using discrete thermal interface m...
- Patent number 12,300,568
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprisng a micro-lens and photodiode array with...
- Patent number 12,289,926
- Issue date Apr 29, 2025
- Innolux Corporation
- Yu-Tsung Liu
Information Patent Grant
Audio latency calibration method, electronic device and computer-re...
- Patent number 12,284,503
- Issue date Apr 22, 2025
- Ambit Microsystems (Shanghai) Ltd.
- Po-Chang Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
VERIFICATION METHODS AND APPARATUS THEREOF
- Publication number 20250240172
- Publication date Jul 24, 2025
- MEDIATEK INC.
- Po-Chun LIN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250233310
- Publication date Jul 17, 2025
- Advanced Semiconductor Engineering, Inc.
- Po-An LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multimedia system and interactive method thereof
- Publication number 20250232160
- Publication date Jul 17, 2025
- InnoLux Corporation
- Po-Shen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20250233039
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEARCH AREA REFINEMENT FOR DECODER MOTION REFINEMENT
- Publication number 20250220208
- Publication date Jul 3, 2025
- QUALCOMM Incorporated
- Zhi Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
AUDIO LATENCY CALIBRATION METHOD, ELECTRONIC DEVICE AND COMPUTER-RE...
- Publication number 20250211907
- Publication date Jun 26, 2025
- AMBIT MICROSYSTEMS (SHANGHAI) LTD.
- PO-CHANG LIN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DIE WITH WARPAGE RELEASE LAYER STRUCTURE IN PACKAGE
- Publication number 20250210543
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALGORITHMS FOR SPARSE ATTENTION OPERATIONS
- Publication number 20250209135
- Publication date Jun 26, 2025
- Industrial Technology Research Institute
- Yao-Hua Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wake-on-WLAN device and method
- Publication number 20250203509
- Publication date Jun 19, 2025
- REALTEK SEMICONDUCTOR CORPORATION
- PO-CHUAN LIN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250201686
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH RIVETING STRUCTURE BETWEEN TWO RINGS AND...
- Publication number 20250192072
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
- Publication number 20250191939
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250192088
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...
- Publication number 20250191997
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING ELECTRONIC DEVICE
- Publication number 20250180941
- Publication date Jun 5, 2025
- InnoLux Corporation
- Tai-Chi PAN
- G02 - OPTICS
Information Patent Application
ARRAY ANTENNA MODULE AND WIRELESS COMMUNICATION DEVICE
- Publication number 20250174913
- Publication date May 29, 2025
- Chiun Mai Communication Systems, Inc.
- SHU-WEI JHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR
- Publication number 20250169125
- Publication date May 22, 2025
- HiPer Semiconductor Inc.
- PO-JUNG LIN
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250167138
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250157949
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPILATION METHOD, DATA PROCESSING METHOD AND APPARATUS THEREOF
- Publication number 20250156679
- Publication date May 15, 2025
- MEDIATEK INC.
- PING-YUAN TSENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE WITH REINFORCED ELEMENT
- Publication number 20250149469
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPARATION METHOD OF PHARMACEUTICAL COMPOSITION FOR TREATING CHRON...
- Publication number 20250144150
- Publication date May 8, 2025
- GWO XI STEM CELL APPLIED TECHNOLOGY CO., LTD.
- Po-Cheng Lin
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
TRANSISTOR INCLUDING AN ACTIVE REGION AND METHODS FOR FORMING THE SAME
- Publication number 20250142890
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wu-Wei Tsai
Information Patent Application
PHARMACEUTICAL COMPOSITION COMPRISING ADIPOSE TISSUE-DERIVED EXTRAC...
- Publication number 20250136661
- Publication date May 1, 2025
- GWO XI STEM CELL APPLIED TECHNOLOGY CO., LTD.
- Hsiu-Jung Liao
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250132216
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR FORMING DEVICES WITH LIDS
- Publication number 20250132223
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Shiou Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECODER DERIVED CROSS COMPONENT PREDICTION IN VIDEO CODING
- Publication number 20250119536
- Publication date Apr 10, 2025
- QUALCOMM Incorporated
- Yao-Jen Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CROSS COMPONENT PREDICTION MERGE CANDIDATE DERIVATION AND FUSION IN...
- Publication number 20250119528
- Publication date Apr 10, 2025
- QUALCOMM Incorporated
- Po-Han Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250112217
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250112137
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS

Po-Ching LIN

Person

Patents Grantslast 30 patents

Chip package structure with ring structure

Semiconductor chip package having underfill material surrounding a...

Semiconductor device package having warpage control and method of f...

Semiconductor die package with ring structure

Package assembly including package substrate with elongated solder...

Thermal module for a semiconductor package and methods of forming t...

Package structure and method of forming the same

Method for forming semiconductor package structure

Method of manufacturing semiconductor devices

Semiconductor device and manufacturing method thereof

Semiconductor package

Organic interposer including intra-die structural reinforcement str...

Semiconductor packages having conductive patterns of redistribution...

Package structure and method of forming the same

High electron mobility transistor structure and method of manufactu...

Non-transitory machine-readable medium, device and method for deter...

Semiconductor package including stress-reduction structures and met...

Eccentric via structures for stress reduction

Package structure with underfill

Package assembly lid and methods for forming the same

Package assembly including lid with additional stress mitigating fe...

Semiconductor devices and methods of manufacture

Method for treating arthritis by using stem cell preparation and me...

Semiconductor die with tapered sidewall in package

Control device and method of controlling power generation system

Chip package with lid

Epitaxial structures exposed in airgaps for semiconductor devices

High efficiency heat dissipation using discrete thermal interface m...

Electronic device comprisng a micro-lens and photodiode array with...

Audio latency calibration method, electronic device and computer-re...

Patents Applicationslast 30 patents

VERIFICATION METHODS AND APPARATUS THEREOF

ELECTRONIC DEVICE

Multimedia system and interactive method thereof

METHOD OF FABRICATING PACKAGE STRUCTURE

SEARCH AREA REFINEMENT FOR DECODER MOTION REFINEMENT

AUDIO LATENCY CALIBRATION METHOD, ELECTRONIC DEVICE AND COMPUTER-RE...

SEMICONDUCTOR DIE WITH WARPAGE RELEASE LAYER STRUCTURE IN PACKAGE

ALGORITHMS FOR SPARSE ATTENTION OPERATIONS

Wake-on-WLAN device and method

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH RIVETING STRUCTURE BETWEEN TWO RINGS AND...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

SEMICONDUCTOR STRUCTURE

PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...

METHOD OF FORMING ELECTRONIC DEVICE

ARRAY ANTENNA MODULE AND WIRELESS COMMUNICATION DEVICE

HIGH ELECTRON MOBILITY TRANSISTOR

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

PACKAGE STRUCTURE

COMPILATION METHOD, DATA PROCESSING METHOD AND APPARATUS THEREOF

PACKAGE STRUCTURE WITH REINFORCED ELEMENT

PREPARATION METHOD OF PHARMACEUTICAL COMPOSITION FOR TREATING CHRON...

TRANSISTOR INCLUDING AN ACTIVE REGION AND METHODS FOR FORMING THE SAME

PHARMACEUTICAL COMPOSITION COMPRISING ADIPOSE TISSUE-DERIVED EXTRAC...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

DEVICES AND METHODS FOR FORMING DEVICES WITH LIDS

DECODER DERIVED CROSS COMPONENT PREDICTION IN VIDEO CODING

CROSS COMPONENT PREDICTION MERGE CANDIDATE DERIVATION AND FUSION IN...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD