Po-Han LEE

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Thin loudspeaker
- Patent number 12,133,059
- Issue date Oct 29, 2024
- National Central University
- Po-Lei Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Three-dimensional optoelectronic device package and method for manu...
- Patent number 11,545,487
- Issue date Jan 3, 2023
- Po-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic stimulation device having planar coil structure
- Patent number 11,534,620
- Issue date Dec 27, 2022
- Po-Lei Lee
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of chip package
- Patent number 11,476,293
- Issue date Oct 18, 2022
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,387,201
- Issue date Jul 12, 2022
- Xintec Inc.
- Po-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,355,659
- Issue date Jun 7, 2022
- Xintec Inc.
- Po-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and power module
- Patent number 11,310,904
- Issue date Apr 19, 2022
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,038,077
- Issue date Jun 15, 2021
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anode material of nano-silicon having multilayer-graphene as carrie...
- Patent number 10,879,530
- Issue date Dec 29, 2020
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- Po-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,446,504
- Issue date Oct 15, 2019
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,424,540
- Issue date Sep 24, 2019
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suture delivery device for suturing tissue
- Patent number 10,327,761
- Issue date Jun 25, 2019
- Medeon Biodesign, Inc.
- Shih-Wei Ho
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Light emitting device
- Patent number 10,256,217
- Issue date Apr 9, 2019
- TSLC CORP.
- Po-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,153,237
- Issue date Dec 11, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,096,635
- Issue date Oct 9, 2018
- Xintec Inc.
- Wei-Ming Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
File download method for mobile device, server and mobile device th...
- Patent number 10,085,128
- Issue date Sep 25, 2018
- HTC CORPORATION
- Po-Yen Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,947,716
- Issue date Apr 17, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,875,912
- Issue date Jan 23, 2018
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,780,251
- Issue date Oct 3, 2017
- Xintec Inc.
- Wei-Luen Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact structure with a redistribution layer connected...
- Patent number 9,640,683
- Issue date May 2, 2017
- Xintec Inc.
- Wei-Luen Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,613,919
- Issue date Apr 4, 2017
- Xintec Inc.
- Tsang-Yu Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Scene-sound set operating method and portable device
- Patent number 9,405,522
- Issue date Aug 2, 2016
- HTC Corporation
- Po-Yen Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip package and method of manufacturing the same
- Patent number 9,406,818
- Issue date Aug 2, 2016
- Xintec Inc.
- Tsang-Yu Liu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method, system, apparatus and computer-readable medium for browsing...
- Patent number 9,354,792
- Issue date May 31, 2016
- HTC Corporation
- Po-Yen Lee
- G01 - MEASURING TESTING
Information Patent Grant
Fabrication methods of chip device packages
- Patent number 9,305,842
- Issue date Apr 5, 2016
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of manufacturing the same
- Patent number 9,269,837
- Issue date Feb 23, 2016
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for providing a service for a mobile device and n...
- Patent number 9,225,705
- Issue date Dec 29, 2015
- HTC Corporation
- Po-Yen Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electrical contact structure with a redistribution layer connected...
- Patent number 9,214,579
- Issue date Dec 15, 2015
- Xintec Inc.
- Wei-Ming Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip device packages and fabrication methods thereof
- Patent number 9,196,571
- Issue date Nov 24, 2015
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for providing online services corresponding to mu...
- Patent number 8,959,234
- Issue date Feb 17, 2015
- HTC Corporation
- Po-Yen Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240304582
- Publication date Sep 12, 2024
- XINTEC INC.
- Wei-Ming CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN LOUDSPEAKER
- Publication number 20230412984
- Publication date Dec 21, 2023
- National Central University
- Po-Lei LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369362
- Publication date Nov 16, 2023
- XINTEC INC.
- Po-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230361144
- Publication date Nov 9, 2023
- XINTEC INC.
- Wei-Ming CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL OPTOELECTRONIC DEVICE PACKAGE AND METHOD FOR MANU...
- Publication number 20230091760
- Publication date Mar 23, 2023
- TSLC Corporation
- Po-Wei LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC STIMULATION DEVICE HAVING PLANAR COIL STRUCTURE
- Publication number 20230054517
- Publication date Feb 23, 2023
- Po-Lei Lee
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20220216131
- Publication date Jul 7, 2022
- XINTEC INC.
- Po-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ELECTROENCEPHALOGRAPHIC ELECTRODE
- Publication number 20220211313
- Publication date Jul 7, 2022
- National Central University
- Po-Lei Lee
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
UV LED Package Having Encapsulating Extraction Layer
- Publication number 20220131056
- Publication date Apr 28, 2022
- TSLC CORPORATION
- TZU-YING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL OPTOELECTRONIC DEVICE PACKAGE AND METHOD FOR MANU...
- Publication number 20210366903
- Publication date Nov 25, 2021
- TSLC Corporation
- Po-Wei LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC STIMULATION DEVICE HAVING PLANAR COIL STRUCTURE
- Publication number 20210260396
- Publication date Aug 26, 2021
- Po-Lei Lee
- G01 - MEASURING TESTING
Information Patent Application
CARTILAGE FILLING SYSTEM AND SURGICAL INSTRUMENT KIT INCLUDING THE...
- Publication number 20210252227
- Publication date Aug 19, 2021
- BioGend Therapeutics Co., Ltd.
- Chin-Tsung HUANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210159350
- Publication date May 27, 2021
- XINTEC INC.
- Po-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UV LED PACKAGE
- Publication number 20210111318
- Publication date Apr 15, 2021
- TSLC CORPORATION
- TZU-YING LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082841
- Publication date Mar 18, 2021
- XINTEC INC.
- Po-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE
- Publication number 20210066379
- Publication date Mar 4, 2021
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SAFETY COMMUNICATION MODULE
- Publication number 20200364177
- Publication date Nov 19, 2020
- Po Huan LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and Brain-computer Interface System for Recognizing Brainwav...
- Publication number 20200310538
- Publication date Oct 1, 2020
- NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- Po-Lei Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANODE MATERIAL OF NANO-SILICON HAVING MULTILAYER-GRAPHENE AS CARRIE...
- Publication number 20200194787
- Publication date Jun 18, 2020
- NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- Po-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND POWER MODULE
- Publication number 20200137879
- Publication date Apr 30, 2020
- XINTEC INC.
- Tsang-Yu LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190273175
- Publication date Sep 5, 2019
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180358398
- Publication date Dec 13, 2018
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light Emitting Device
- Publication number 20180342486
- Publication date Nov 29, 2018
- TSLC CORPORATION
- Po-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20180337142
- Publication date Nov 22, 2018
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20180102321
- Publication date Apr 12, 2018
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20170271276
- Publication date Sep 21, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE STORAGE DEVICE AND DATA PROCESSING METHOD THEREOF
- Publication number 20170235635
- Publication date Aug 17, 2017
- LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
- Po-Ching Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FEEDBACK PHOTOPLETHYSMOGRAPHY MEASURING DEVICE AND MEASURING METHOD...
- Publication number 20170209054
- Publication date Jul 27, 2017
- Po-Lei Lee
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170179330
- Publication date Jun 22, 2017
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170148844
- Publication date May 25, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thin loudspeaker

Three-dimensional optoelectronic device package and method for manu...

Magnetic stimulation device having planar coil structure

Manufacturing method of chip package

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Chip package and power module

Chip package and manufacturing method thereof

Anode material of nano-silicon having multilayer-graphene as carrie...

Chip package and method for forming the same

Chip package and method for forming the same

Suture delivery device for suturing tissue

Light emitting device

Chip package and method for forming the same

Semiconductor structure and manufacturing method thereof

File download method for mobile device, server and mobile device th...

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Electrical contact structure with a redistribution layer connected...

Chip package and method for forming the same

Scene-sound set operating method and portable device

Chip package and method of manufacturing the same

Method, system, apparatus and computer-readable medium for browsing...

Fabrication methods of chip device packages

Chip package and method of manufacturing the same

Method and system for providing a service for a mobile device and n...

Electrical contact structure with a redistribution layer connected...

Chip device packages and fabrication methods thereof

Method and system for providing online services corresponding to mu...

Patents Applicationslast 30 patents

CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME

THIN LOUDSPEAKER

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL OPTOELECTRONIC DEVICE PACKAGE AND METHOD FOR MANU...

MAGNETIC STIMULATION DEVICE HAVING PLANAR COIL STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE AND SEMICONDUCTOR PACKAGE ASSEMBLY

DRY ELECTROENCEPHALOGRAPHIC ELECTRODE

UV LED Package Having Encapsulating Extraction Layer

THREE-DIMENSIONAL OPTOELECTRONIC DEVICE PACKAGE AND METHOD FOR MANU...

MAGNETIC STIMULATION DEVICE HAVING PLANAR COIL STRUCTURE

CARTILAGE FILLING SYSTEM AND SURGICAL INSTRUMENT KIT INCLUDING THE...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

UV LED PACKAGE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF CHIP PACKAGE

SAFETY COMMUNICATION MODULE

Method and Brain-computer Interface System for Recognizing Brainwav...

ANODE MATERIAL OF NANO-SILICON HAVING MULTILAYER-GRAPHENE AS CARRIE...

CHIP PACKAGE AND POWER MODULE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Light Emitting Device

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SOLID STATE STORAGE DEVICE AND DATA PROCESSING METHOD THEREOF

FEEDBACK PHOTOPLETHYSMOGRAPHY MEASURING DEVICE AND MEASURING METHOD...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF