Poi Siong Teo

Person

  • Singapore, SG

Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer level super stretch solder

    • Patent number 6,890,795
    • Issue date May 10, 2005
    • Agency for Science, Technology and Research
    • Ee Hua Wong
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents